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Electroless copper plating activating solution and preparation method thereof

A technology of electroless copper plating and activation solution, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of palladium solution decomposition, catalytic failure, destruction, high operating cost of ionic palladium activation solution, etc., to achieve The surface is smooth, avoiding sedimentation, and ensuring the effect of activity

Active Publication Date: 2020-01-10
SHENZHEN CYPRESS IND DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the operating cost of ionic palladium activation solution is relatively high
However, the violent circular stirring of the horizontal line electroless copper plating will destroy the colloidal palladium system, resulting in the decomposition and catalytic failure of the palladium solution. Colloidal palladium is rarely used as the activation solution.

Method used

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  • Electroless copper plating activating solution and preparation method thereof
  • Electroless copper plating activating solution and preparation method thereof
  • Electroless copper plating activating solution and preparation method thereof

Examples

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preparation example Construction

[0044] The preparation method of above-mentioned electroless copper plating activation solution is as follows:

[0045] Palladium chloride and sodium chloride are dissolved in hydrochloric acid to obtain a palladium chloride-hydrochloric acid solution;

[0046] Dissolving stannous chloride in deionized water prepares a saturated stannous chloride solution;

[0047] Mix palladium chloride-hydrochloric acid solution with saturated stannous chloride solution, and vibrate in ultrasonic to obtain tin palladium colloid;

[0048] Aging the tin palladium colloid;

[0049] Add complexing agent, buffering agent, stabilizer, antioxidant and wetting agent, and stir to obtain electroless copper plating activation solution.

[0050] Therefore, the electroless copper plating activation solution of the present application first prepares tin-palladium colloid, after aging the tin-palladium colloid to form a colloidal solution, add complexing agent and buffering agent, through complexing agent ...

Embodiment 1

[0055] Taking the preparation of 1Kg of electroless copper plating activation solution as an example, the components and contents are as follows:

[0056]

[0057]

[0058] The preparation method of the electroless copper plating activation solution of the present embodiment may further comprise the steps:

[0059] a1, take palladium chloride, sodium chloride and hydrochloric acid according to above-mentioned content, and palladium chloride, sodium chloride are dissolved in hydrochloric acid, obtain palladium chloride-hydrochloric acid solution;

[0060] a2, take stannous chloride by weighing, and dissolve in deionized water, prepare saturated stannous chloride solution;

[0061] a3, mixing palladium chloride-hydrochloric acid solution with saturated stannous chloride solution, and vibrating in 500KHz ultrasonic waves for 1 hour to obtain tin palladium colloid;

[0062] a4, aging the tin-palladium colloid at 80°C for 2 hours;

[0063] a5, add complexing agent, bufferin...

Embodiment 2

[0065] Taking the preparation of 1Kg of electroless copper plating activation solution as an example, the components and contents are as follows:

[0066]

[0067] The preparation method of the electroless copper plating activation solution of the present embodiment may further comprise the steps:

[0068] b1, take palladium chloride, sodium chloride and hydrochloric acid according to the above-mentioned content, and dissolve palladium chloride and sodium chloride in hydrochloric acid to obtain palladium chloride-hydrochloric acid solution;

[0069] b2, take stannous chloride by weighing, and dissolve in deionized water, prepare saturated stannous chloride solution;

[0070] b3, mixing palladium chloride-hydrochloric acid solution with saturated stannous chloride solution, and vibrating in 100KHz ultrasonic waves for 4 hours to obtain tin palladium colloid;

[0071] b4, aging the tin-palladium colloid at 100°C for 0.5 hours;

[0072] b5, add complexing agent, buffering ag...

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Abstract

The invention provides an electroless copper plating activating solution and a preparation method thereof. The electroless copper plating activating solution is prepared from, by weight part, 1-10 parts of palladium chloride, 100-400 parts of stannous chloride, 50-200 parts of sodium chloride, 10-100 parts of sodium chloride, 0.1-50 parts of a complexing agent, 1-200 parts of a buffering agent, 0.1-10 parts of a stabilizing agent, 0.05-10 parts of an antioxidant and 0.1-10 parts of a wetting agent. The complexing agent is one or more of ethidene diamine, trimethyl amine, triethylanmine, diethylenetriamine, triethylenetetramine and tetraethylenepentamine. The buffering agent is one or more of ethylenediamine tetraacetic acid, glycine, propionic acid, malic acid and 2-(cyclohexylamino)ethanesulfonic acid. The electroless copper plating activating solution is high in stability and can adapt to intense circulating stirring in a horizontal electroless copper plating process.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to an electroless copper plating activation solution and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the demand for fine and complex printed circuit boards is increasing. Electroless copper plating technology is used in through-hole metallization of printed circuit boards, inner layer copper foil treatment, electromagnetic wave shielding and packaging technology of electronic components. Electroless copper plating is a process of metal deposition on the surface of the substrate through chemical reduction without external current. [0003] Generally, in electroless copper plating, it is necessary to activate the substrate first, so that a layer of active particles is adsorbed on the surface of the substrate, and sufficient reducing agent is provided for the process of electroless copper plating,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/38
CPCC23C18/1675C23C18/38
Inventor 倪亚金莫庆生
Owner SHENZHEN CYPRESS IND DEV CO LTD
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