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Copper-aluminum composite plate strip with added nickel grid layer and continuous production method thereof

A technology of copper-aluminum composite board and production method, which is applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., can solve the problems of affecting the performance of materials, the reduction of the bonding strength of composite boards and strips, and achieve the convenience of deep drawing And bending processing, processing and heat treatment process simplification, the effect of a wide range of use

Active Publication Date: 2020-01-24
长沙博朗思达新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the heat treatment process, copper and aluminum are very easy to diffuse and react with each other, forming CuAl and CuAl at the interface. 2 、Cu 4 Al 9 These brittle phases will lead to a decrease in the bonding strength of the composite strip, thereby affecting the performance of the material

Method used

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  • Copper-aluminum composite plate strip with added nickel grid layer and continuous production method thereof
  • Copper-aluminum composite plate strip with added nickel grid layer and continuous production method thereof
  • Copper-aluminum composite plate strip with added nickel grid layer and continuous production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Example 1: Preparation of a copper-aluminum composite strip with a nickel grid layer added with a thickness of 1.2mm

[0037] 1. Raw materials: select copper plate with a thickness of 4mm and a width of 50mm as the raw material of the copper substrate; an aluminum strip with a thickness of 0.5mm and a width of 10mm as the raw material of the aluminum cladding;

[0038] 2. Electroplated nickel grid layer:

[0039] ① Wash off the oil on the surface of the copper plate with 10% sodium hydroxide solution, and rinse until neutral;

[0040] ②Soak in 10% dilute nitric acid solution for 20s to remove the oxide layer on the surface of the copper plate and rinse until neutral;

[0041]③ Rinse with alcohol and dry with cold air for later use;

[0042] ④Paste a special non-adhesive protective film on the non-composite area of ​​the copper plate surface for protection;

[0043] ⑤Put the copper plate as the cathode into the electroplating tank. The formula of the electroplating so...

Embodiment 2

[0049] Example 2: Preparation of a copper-aluminum composite strip with a nickel grid layer added with a thickness of 0.8mm

[0050] 1. Raw material: select copper plate with a thickness of 2.4mm and a width of 50mm as the copper base material; aluminum strip with a thickness of 0.4mm and a width of 15mm as the aluminum cladding material;

[0051] 2. Electroplated nickel grid layer:

[0052] ① Wash off the oil on the surface of the copper plate with 10% sodium hydroxide solution, and rinse until neutral;

[0053] ②Soak in 10% dilute nitric acid solution for 20s to remove the oxide layer on the surface of the copper plate and rinse until neutral;

[0054] ③ Rinse with alcohol and dry with cold air for later use;

[0055] ④Paste a special non-adhesive protective film on the non-composite area of ​​the copper plate surface for protection;

[0056] ⑤Put the copper plate as the cathode into the electroplating tank. The formula of the electroplating solution is: 280g / L nickel sul...

Embodiment 3

[0062] Example 3: Preparation of a copper-aluminum composite strip with a nickel grid layer added with a thickness of 0.5 mm

[0063] 1. Raw materials: select copper plate with a thickness of 2mm and a width of 50mm as the raw material of the copper substrate; an aluminum strip with a thickness of 0.3mm and a width of 10mm as the raw material of the aluminum cladding;

[0064] 2. Electroplated nickel grid layer:

[0065] ① Wash off the oil on the surface of the copper plate with 10% sodium hydroxide solution, and rinse until neutral;

[0066] ②Soak in 10% dilute nitric acid solution for 20s to remove the oxide layer on the surface of the copper plate and rinse until neutral;

[0067] ③ Rinse with alcohol and dry with cold air for later use;

[0068] ④Paste a special non-adhesive protective film on the non-composite area of ​​the copper plate surface for protection;

[0069] ⑤Put the copper plate as the cathode into the electroplating tank. The formula of the electroplating ...

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Abstract

The invention discloses a copper-aluminum composite plate strip with an added nickel grid layer and a continuous production method thereof. The copper-aluminum composite plate strip is characterized by comprising three layers of metal; the two outer layers are a copper substrate and an aluminum covering material correspondingly; and the middle layer is the nickel grid layer arranged on the surfaceof the copper substrate in an electroplated mode. The production method comprises the steps that the nickel grid layer of the corresponding thickness is electroplated on the surface of the copper substrate firstly; then the copper substrate with the nickel grid layer and the aluminum covering material are put into a composite rolling mill simultaneously, and compounding is completed through a single pass of large deformation; and then the composite plate strip is put into an online annealing furnace, heat treatment is conducted, and the copper-aluminum composite plate strip with high composite strength and good surface quality is obtained. The copper-aluminum composite plate strip has the outstanding advantages such as low cost, good mechanical properties and high bonding strength and iswidely applied to power electronics, automobiles, communication and other technical fields.

Description

technical field [0001] The invention belongs to the technical field of metal composite preparation, and in particular relates to a copper-aluminum composite strip added with a nickel grid layer and a continuous production method thereof. Background technique [0002] The rapid development of science and technology has higher and higher requirements for electronic components. One of the most important points is to undertake a large number of gradually increasing functions in a very small space. This requires that the power transmission should operate well at the interface And the heat should be dissipated quickly and efficiently. The copper-aluminum composite strip material has the advantages of good thermal stability, excellent heat sink performance and high electrical conductivity, and can provide a single-metal welding system for electronic packaging, which can increase the circuit capacity and operate stably, thus obtaining Extensive attention and research are expected t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/24B21B37/56B21B37/46C25D3/12C22F1/02B32B15/01
CPCB21B1/24B21B37/46B21B37/56B21B2265/10B32B15/017B32B2307/202B32B2307/302B32B2307/50C22F1/02C25D3/12
Inventor 王日初董翠鸽吴天昊罗森晖杨益唐超
Owner 长沙博朗思达新材料科技有限公司
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