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Treatment method of electroless copper plating wastewater not containing hydroxyl-containing organic amine

A technology for electroless copper plating and treatment method, which is applied in the fields of metallurgical wastewater treatment, chemical instruments and methods, oxidized water/sewage treatment, etc. Market application prospects, overcoming the effects of high costs and low processing costs

Active Publication Date: 2021-11-19
GUANGZHOU ULTRA UNION CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sodium citrate has strong oxidation resistance, and the efficiency of destroying complexing agents by traditional oxidation methods is low. Generally, a large amount of oxidizing agent is required, and the processing cost is high. It is difficult to effectively remove these complexing agents at low temperatures.
Disodium ethylenediamine tetraacetate, ATMP and HEDP have strong oxidation resistance, and these complexing agents cannot be removed by traditional oxidation methods
As far as the existing technology is used to treat electroless copper plating wastewater at present, the speed of destroying sodium citrate and tartaric acid Garner by oxidant method in winter is slow, and the treatment effect is relatively poor. Copper plating wastewater is also difficult to effectively remove copper, so the treated wastewater often does not meet the requirements of GB 21900-2008 "Electroplating Pollutant Discharge Standard"

Method used

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  • Treatment method of electroless copper plating wastewater not containing hydroxyl-containing organic amine
  • Treatment method of electroless copper plating wastewater not containing hydroxyl-containing organic amine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1: process the electroless copper plating wastewater containing potassium sodium tartrate 800mg / L

[0042] Step 1, add ferrous chloride

[0043] The electroless copper plating wastewater is input from the wastewater regulating tank to the feeding tank, the tank liquid is stirred with a mixer, the pH is adjusted to 5-7 by adding dilute hydrochloric acid, and 20L of ferrous chloride solution is added to each ton of wastewater.

[0044] Step 2. Precipitation of complexing agent and copper ions

[0045] The wastewater flows from the feeding tank into the sedimentation tank, and the tank liquid is stirred with a mixer, and the pH of the wastewater is adjusted to 10-12 by adding lime emulsion. The ferrous ions and calcium ions form precipitates with potassium sodium tartrate, and the copper ions released from the complex form Copper hydroxide precipitates.

[0046] Step 3. Precipitation and separation

[0047] The wastewater flows from the sedimentation tank int...

Embodiment 2

[0054] Embodiment 2: process the electroless copper plating wastewater containing disodium edetate 600mg / L

[0055] Step 1, add ferrous chloride

[0056] The electroless copper plating wastewater is input from the wastewater regulating tank to the feeding tank, the tank liquid is stirred with a mixer, the pH is adjusted to 5-7 by adding dilute hydrochloric acid, and 15L of ferrous chloride solution is added to each ton of wastewater.

[0057] Step 2. Precipitation of complexing agent and copper ions

[0058] Wastewater flows into the sedimentation tank from the feeding tank, stir the tank liquid with a mixer, add lime emulsion to make the pH of the wastewater to 10-12, ferrous ions and calcium ions form precipitates with disodium edetate, and release them from the complex copper ions to form copper hydroxide precipitates.

[0059] Step 3. Precipitation and separation

[0060] The wastewater flows from the sedimentation tank into the flocculation tank, the pool liquid is sti...

Embodiment 3

[0067] Embodiment 3: process the electroless copper plating wastewater containing sodium citrate 600mg / L

[0068] Step 1, add ferrous chloride

[0069] The electroless copper plating wastewater is input from the wastewater regulating tank to the feeding tank, the pool liquid is stirred with a mixer, the pH is adjusted to 5-7 by adding dilute hydrochloric acid, 15L of ferrous chloride solution is added to each ton of waste water, and the pool liquid is stirred.

[0070] Step 2. Precipitation of complexing agent and copper ions

[0071] The wastewater flows from the feeding tank into the sedimentation tank, and the tank liquid is stirred with a mixer, and the pH of the wastewater is added to 10-12 by adding lime emulsion. The ferrous ions and calcium ions form precipitates with sodium citrate, and the copper ions released from the complex form Copper hydroxide precipitates.

[0072] Step 3. Precipitation and separation

[0073] The wastewater flows from the sedimentation tank...

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Abstract

The invention discloses a treatment method for electroless copper plating wastewater. The pH is adjusted to 5-7, ferrous chloride solution is added to the wastewater treatment pool, and then lime emulsion is added to make the pH of the wastewater reach 10-12. Ferrous ions and Calcium ions co-precipitate carboxyl-containing organic acid complexing agents or organic phosphonic acid complexing agents, copper ions form copper hydroxide precipitation, add flocculants to aggregate the precipitated particles, filter to remove the precipitates; add sodium hypochlorite solution to oxidize and reduce electroless copper plating agent and other organic matter, and adjust the pH of the wastewater to 6-9. The results of copper processing meet the requirements of Table 3 in GB 21900-2008 "Electroplating Pollutant Discharge Standard". The invention creates a new method for removing carboxyl-containing organic acid complexing agents, organic phosphonic acid complexing agents, and copper ions in waste water by precipitation with ferrous ions and calcium ions. The process is simple and easy, and the treatment cost is low. market application prospects.

Description

technical field [0001] The invention belongs to the technical field of industrial wastewater treatment, in particular to a treatment method for electroless copper plating wastewater. Background technique [0002] Electroless copper plating plays a very important role in surface treatment. The copper layers plated by different electroless copper plating solutions are all pure copper. They are mainly used in the bottom layer of non-metallic plating, metallization of printed circuit board holes, and electronic equipment. Electromagnetic shielding layer, etc. [0003] Traditional electroless copper plating generally uses carboxyl-containing organic acids as complexing agents. Electroless copper plating using organic phosphonic acids as complexing agents has been reported, but it is rarely used. Electroless copper plating wastewater contains potassium sodium tartrate, disodium ethylenediaminetetraacetic acid, sodium citrate, aminotrimethylene phosphonic acid (ATMP), 1-hydroxyeth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C02F9/04C02F101/20C02F103/16
CPCC02F1/5245C02F1/56C02F1/76C02F2101/20C02F2103/16
Inventor 郭崇武黎小阳赖奂汶
Owner GUANGZHOU ULTRA UNION CHEM LTD