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High-strength and high-conductivity copper-chromium-zirconium alloy material and preparation method thereof

An alloy material, copper-chromium-zirconium technology, applied in the field of high-strength and high-conductivity copper-chromium-zirconium alloy materials and their preparation, can solve problems affecting the use of alloy materials and uneven composition of ingots

Active Publication Date: 2020-02-25
NINGBO XINGYE SHENGTAI GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since Cr and Zr elements are easily oxidized in a non-vacuum environment, the ingot composition is likely to be uneven during the industrial production process of a large-tonnage non-vacuum environment, which affects the use of alloy materials. At present, the domestic demand for high-end copper-chromium-zirconium products, Mainly rely on imports from Japan, Germany and other developed countries

Method used

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  • High-strength and high-conductivity copper-chromium-zirconium alloy material and preparation method thereof
  • High-strength and high-conductivity copper-chromium-zirconium alloy material and preparation method thereof
  • High-strength and high-conductivity copper-chromium-zirconium alloy material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0028] The alloy of the present invention is smelted using the following raw materials: electrolytic copper, copper-chromium master alloy, copper-zirconium master alloy, copper-magnesium master alloy, copper-iron master alloy, copper-silicon master alloy, sponge titanium and copper-boron master alloy. The composition of the alloy is shown in Example 1 of Table 1.

[0029] 1. Smelting: Before smelting, add electrolytic copper, copper-silicon master alloy, copper-iron master alloy into the non-vacuum induction furnace, after the above materials are melted, continue to add copper-chromium master alloy, copper-magnesium master alloy and copper-boron master alloy Alloy and titanium sponge, raise the temperature to 1300°C, after the melt is completely melted, pour the melt into the holding furnace and stir evenly, then add copper-zirconium master alloy, its content is consistent with the design content, and then pour it into the holding furnace Feed 0.02kg of copper-zirconium master...

Embodiment 2

[0039] The alloy of the present invention is smelted using the following raw materials: electrolytic copper, copper-chromium master alloy, copper-zirconium master alloy, copper-magnesium master alloy, copper-iron master alloy, copper-silicon master alloy, sponge titanium and copper-boron master alloy. The composition of the alloy is shown in Example 2 of Table 1.

[0040] 1. Smelting: Before smelting, add electrolytic copper, copper-silicon master alloy, copper-iron master alloy into the non-vacuum induction furnace, after the above materials are melted, continue to add copper-chromium master alloy, copper-magnesium master alloy and copper-boron master alloy Alloy and titanium sponge, raise the temperature to 1350°C. After the melt is completely melted, pour the melt into the holding furnace and stir evenly. Feed 0.1kg of copper-zirconium master alloy per minute, control the casting temperature at 1275°C, hold for 10 minutes before casting.

[0041] 2. Hot rolling: the above ...

Embodiment 3

[0050] The alloy of the present invention is smelted using the following raw materials: electrolytic copper, copper-chromium master alloy, copper-zirconium master alloy, copper-magnesium master alloy, copper-iron master alloy, copper-silicon master alloy, copper-lanthanum master alloy and copper-boron master alloy. The composition of the alloy is shown in Example 3 of Table 1.

[0051] 1. Smelting: Before smelting, add electrolytic copper, copper-silicon master alloy, copper-iron master alloy into the non-vacuum induction furnace, after the above materials are melted, continue to add copper-chromium master alloy, copper-magnesium master alloy and copper-boron master alloy Alloy and copper-lanthanum master alloy, raise the temperature to 1320°C, after the melt is completely melted, pour the melt into the holding furnace and stir evenly, then add copper-zirconium master alloy, its content is consistent with the design content, and then add to the heat preservation furnace The fu...

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Abstract

The invention relates to a high-strength and high-conductivity copper-chromium-zirconium alloy material and a preparation method thereof. The material is composed of, by weight, 0.5-1.5% of Cr, 0.05-0.3% of Zr, 0.02-0.1% of Mg, 0.005-0.01% of Si, 0.002-0.005% of Fe and the balance Cu. The alloy further includes two of the four elements: Ti, La, B and Ca, the content of each element is 0.001-0.005%, and the total content of the alloy elements is 0.005-0.01%. The material is prepared through smelting and casting, hot rolling, face milling, rough rolling, intermediate annealing, intermediate rolling, high-temperature rapid solution treatment, finish rolling and aging treatment. The high-strength and high-conductivity copper-chromium-zirconium alloy material has the tensile strength of 500-800MPa, the yield strength of 350-700 MPa, the elongation of 3-10%, the electrical conductivity of 75-90% IACS and the softening temperature of 500-600 DEG C, the stress relaxation after treatment for 1000 hours at 150 DEG C is smaller than 10%, and the transverse or longitudinal section does not crack after bending by 90 or 180 degrees under the condition: R / t<=1.5. The use requirements of precision plug-in terminals of high-end electronic components for copper alloy materials are completely met.

Description

technical field [0001] The invention relates to a high-strength and high-conductivity copper-chromium-zirconium alloy material and a preparation method thereof, belonging to the field of nonferrous metal processing. Background technique [0002] High-performance copper alloy is an important industrial basic material. It is widely used in the core devices of industrial equipment such as integrated circuits, transportation equipment, aerospace, new energy, electric power, electronic communications, and smart home appliances. It is mainly used in the ultra-large-scale integration of the electronic information industry. Circuit lead frame, USB Type-c interface, new energy vehicle electrical connector, high current connector for electronic equipment, overhead wire for high-speed rail transit, conductor for electronic countermeasure radar and high pulse magnetic field, rotor wire for large high-speed turbine generator Functional conductor devices such as resistance welding electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/03C22F1/08
CPCC22C1/03C22C9/00C22F1/08
Inventor 马吉苗彭丽军刘峰夏彬程万林林志豪武志刚陆旭军李晋张杰余金勋卢小勇
Owner NINGBO XINGYE SHENGTAI GROUP
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