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Photosensitive solder resist white oil and preparation method thereof

A technology of photosensitive solder resist and white oil, applied in ink, household utensils, applications, etc., can solve the problems of yellowing resistance, low heat resistance of oil film, insufficient gloss, etc., and achieve good adhesion, short curing time, and gloss high degree of effect

Inactive Publication Date: 2020-02-28
珠海宏博电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing oil film has problems such as low heat resistance, yellowing resistance, leveling, and insufficient gloss.

Method used

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  • Photosensitive solder resist white oil and preparation method thereof
  • Photosensitive solder resist white oil and preparation method thereof
  • Photosensitive solder resist white oil and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] In a second aspect, the present invention provides a method for preparing a photosensitive solder resist white oil as described in the first aspect, comprising the following steps:

[0041] (1) Mix maleic anhydride-modified unsaturated polyester, photoinitiator, filler, leveling agent, defoamer, divalent acid ester, and fumed silica evenly, grind 1 to 5 times, and then add diluent Agent A is mixed evenly, and the main agent is obtained through filtration and canning;

[0042] (2) After mixing novolac epoxy resin, dipentaerythritol pentahexaacrylate, hydroxyalkylamide, melamine, titanium dioxide, and bivalent ester, grind it for 1 to 5 times, then add diluent B and mix evenly, and filter , canning to obtain curing agent.

Embodiment 1

[0047] The preparation method of the photosensitive solder resist white oil provided in this embodiment comprises the following steps:

[0048] (1) Take the raw materials of the main agent according to the weight ratio in the following table 1, and mix maleic anhydride modified unsaturated polyester, photoinitiator ITX, barium sulfate, titanium dioxide, silicone leveling agent, defoaming agent Agent KS-66, dibasic acid ester (DBE), and fumed silica are put into the dispersion barrel, and the raw materials in the barrel are dispersed evenly at high speed by a high-speed disperser, and then the mixed materials are transferred to a three-roller machine, and passed through After grinding 2 to 3 times with a three-roller machine, the material with a particle size of no more than 20 μm is obtained, and then the ground material is transferred into a dispersing bucket, and diluent A is added into the dispersing bucket, and the material in the bucket is dispersed at high speed by a high...

Embodiment 2～6

[0051] Examples 2-6 of the present invention adopt the preparation method similar to Example 1 to prepare photosensitive solder resist white oil. The difference between Examples 2-6 and Example 1 is that the amount of raw materials is different. In Examples 2-6, the main The consumption of each raw material of agent and each raw material of curing agent is as shown in table 1.

[0052] Table 1 Raw material ratio of the main agent and curing agent of each embodiment (the consumption of each raw material is in parts by weight)

[0053]

[0054]

[0055] In order to further illustrate the beneficial effects of the present invention, the ink obtained in the above examples is passed through the coated circuit board formed by screen printing, and then the curing time, hardness, adhesion, and gloss of the solder resist ink obtained in the above examples are analyzed. Temperature, heat resistance and solder resistance performance are tested, and the performance test methods and ...

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Abstract

The invention discloses a photosensitive solder resist white oil and a preparation method thereof. The photosensitive solder resist white oil comprises a main agent and a curing agent, wherein the main agent comprises a maleic anhydride modified unsaturated polyester, a photoinitiator, a filler, a leveling agent, an antifoaming agent, a dibasic acid ester, fumed silica and a diluent A; and the curing agent comprises novolac epoxy resin, dipentaerythritol pentahexaacrylate, hydroxyalkylamide, melamine, titanium dioxide, a dibasic acid ester and a diluent B. The preparation method comprises thefollowing steps: mixing the main agent containing the maleic anhydride modified unsaturated polyester with the curing agent, and coating an obtained mixture on a substrate of a printed circuit board;wherein during exposure, polymerization reaction of a prepolymer is induced by the photoinitiator in an ink layer to obtain a polymer, under the compounding action of the novolac epoxy resin, the polymer, the filler and other components, a protective layer with good adhesion and good hardness is formed, and the solder resist ink also has the advantages of excellent solder resist performance, highglossiness, high temperature resistance and short curing time.

Description

technical field [0001] The invention relates to the technical field of ink, in particular to a photosensitive solder resist white oil and a preparation method thereof. Background technique [0002] Printed circuit board (PCB) is an important electronic component, which is generally obtained through processes such as coating photocurable ink, drying, covering a mask, exposing, developing, etching, and peeling off the protective layer of photocurable ink. Wherein, the photocurable ink forms an ink layer after drying, and when exposed to light, the ink layer can undergo cross-linking and curing or degradation reactions to form a protective layer. However, the existing oil film has problems such as low heat resistance, yellowing resistance, leveling property and insufficient luster. Contents of the invention [0003] The object of the present invention is to provide a photosensitive solder resist white oil and a preparation method thereof, so as to solve the above-mentioned t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/104C09D11/03C09D11/102C09D11/101
CPCC09D11/03C09D11/101C09D11/102C09D11/104
Inventor 杨毅
Owner 珠海宏博电子科技有限公司