Through hole electroplating method of printed circuit board

Abstract

The invention relates to a through hole electroplating method of a printed circuit board. The method comprises the following steps that graphene oxide is grafted to gamma-aminoethyl aminopropyl trimethoxy silane, and a product A is obtained; the product A adsorbs active metal ions to obtain a product B; the product B is physically adsorbed to the surface of an insulating substrate on the wall of athrough hole of the printed circuit board to form an adsorption layer; the adsorption layer is converted into an electric conduction layer through the chemical reduction process; and the wall of thethrough hole with the electric conduction layer is electroplated to form a metal layer. Graphene oxide is selected to be grafted to gamma-aminoethyl aminopropyl trimethoxy silane, due to the fact thathigh-density oxide bond functional sites are formed on the grating interface, and adsorption capacity to the active metal ions is effectively improved; and meanwhile, ethidene diamine perssads on thesurface of the electric conduction layer can effectively improve the capturing capacity to copper ions in a solution in the electroplating process, the mass transfer function of the copper ions is accelerated, accelerated deposition of a copper plated layer in the hole is facilitated, and therefore the uniform plating capacity of the plating solution is greatly enhanced.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a through-hole electroplating method for printed circuit boards. Background technique [0002] After the printed circuit board is drilled, hole metallization is required to achieve interconnection between layers. Hole metallization consists of two steps, first forming a conductive layer on the hole wall, and then thickening it by electroplating. Graphene is a two-dimensional material with ultrahigh electrical conductivity. At present, the industry has begun to try to use graphene as a conductive layer in the metallization process. [0003] However, if the conductive layer does not contain metal or metal particles, it is difficult to directly deposit the coating on the non-metallic conductive layer. Usually, it is necessary to use the original metal as the starting point for lateral growth, but the uniformity of the thickness of the coating formed in this way P...

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Problems solved by technology

However, it uses highly toxic organic solvents such as tetrahydrofuran, which is not conducive to human health

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