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Solvent-resistant cross-linked polyimide film with high dimensional stability

A polyimide film, dimensional stability technology, applied in the field of cross-linked polyimide film, can solve the problem that the dimensional stability and mechanical properties of the film cannot be more effectively improved, the service life is reduced, the overall performance is reduced, etc. problems, to achieve colorless and transparent heat resistance and mechanical properties, improve light transparency, excellent heat resistance and mechanical properties

Active Publication Date: 2020-04-21
浙江中科玖源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when adding a small molecule cross-linking agent in the past, although its solvent resistance and light transmittance can be improved, the dimensional stability and mechanical properties of the film cannot be improved more effectively, so the mechanical strength may be damaged during use. Insufficient and broken, resulting in a decline in overall performance and reduced service life

Method used

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  • Solvent-resistant cross-linked polyimide film with high dimensional stability
  • Solvent-resistant cross-linked polyimide film with high dimensional stability
  • Solvent-resistant cross-linked polyimide film with high dimensional stability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A solvent-resistant and high-dimensionally stable cross-linked polyimide film, the preparation method of which comprises:

[0044] S1. Under a nitrogen atmosphere, dissolve 8mmol 4,4'-diaminodiphenyl ether and 2mmol 2-(3-aminophenyl)-5-aminobenzimidazole as diamine monomer raw materials in 28ml of N,N -In the solvent of dimethylacetamide, after stirring until completely dissolved, add 10mmol 4,4'-(hexafluoroisopropene) diphthalic anhydride as the tetracarboxylic dianhydride monomer raw material, then continue stirring until completely dissolved to obtain a solid A homogeneous solution with a content of 20wt% was reacted at 5°C for 8 hours to obtain a polyamic acid solution, and 0.98ml of pyridine was added to the polyamic acid solution as an imidization agent, and 9.5ml of acetic anhydride was added after the dispersion was complete As a dehydrating agent, after stirring again for 4 hours, move the reaction solution to the dropping funnel, drop it at a rate of 2-3 drops...

Embodiment 2

[0047] A solvent-resistant and high dimensional stability cross-linked polyimide film, the preparation method of this polyimide film is the same as in Example 1, except that in step S1, 8mmol 2,2'-bis( Trifluoromethyl)-4,4'-diaminobiphenyl and 2mmol 2-(3-aminophenyl)-5-aminobenzimidazole are used as diamine monomer raw materials, and the polyimide film thus obtained The relevant performance test results are shown in Table 1.

Embodiment 3

[0049] A solvent-resistant and high dimensional stability cross-linked polyimide film, the preparation method of this polyimide film is the same as in Example 1, except that in step S1, 8mmol 4,4'-bis( 2-trifluoromethyl-4-aminophenoxy)benzene and 2mmol 2-(3-aminophenyl)-5-aminobenzimidazole are used as diamine monomer raw materials, and the polyimide film thus obtained The relevant performance test results are shown in Table 1.

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Abstract

The invention provides a solvent-resistant cross-linked polyimide film with high dimensional stability. The transmittance of light with the wavelength of 400 nm can reach 80% or above, meanwhile, theglass-transition temperature is 340 DEG C or above, the tensile strength is 150MPa or above, and the solvent resistance index is 1% or below. Meanwhile, the invention further provides an application of the cross-linked polyimide film in photoelectric display devices and other products and components with high requirements on light transmission and solvent resistance.

Description

technical field [0001] The invention relates to the technical field of optical materials, in particular to a solvent-resistant and high-dimensionally stable cross-linked polyimide film. Background technique [0002] Polyimide is one of the materials with the best heat resistance among existing polymers, and aromatic polyimide has excellent heat resistance because of its rigid molecular chain structure and strong intermolecular force. , which also has thermal stability, dimensional stability, mechanical properties, chemical stability and radiation resistance. In addition, the designability of polyimide molecules and the special two-step reaction characteristics make it more advantageous in processing, application and research than other rigid chain polymers. Therefore, polyimide has become an OLED display cover and One of the best choices for substrate material. [0003] Previously, the applicant developed an effective method to improve the solvent resistance and dimensiona...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08G73/12C08J5/18C08L79/08
CPCC08G73/1071C08G73/1042C08G73/1039C08G73/1078C08G73/123C08G73/124C08J5/18C08J2379/08Y02E10/549
Inventor 李南文许辉
Owner 浙江中科玖源新材料有限公司
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