Metal-based composite material and preparation method thereof
A composite material and metal material technology, which is applied in the field of metal matrix composite materials and its preparation, can solve the problems that the strength, density and toughness cannot meet the requirements, the lightweight materials that meet the requirements cannot be prepared, and the performance distribution is oriented, etc. To achieve the effect of favorable oxidation bonding, easy oxidation, and large aspect ratio
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0034] A method for preparing a metal matrix composite material, comprising the following steps:
[0035] (1) Weigh Al according to the formula 2 o 3 Hollow microspheres 40Kg, silicon carbide whiskers 10Kg, silicon carbide particles 30Kg, selected Al 2 o 3 The particle size of hollow microspheres is 10-30μm, the ratio of wall thickness to radius t / R is (0.030-0.050): 1; the particle size of silicon carbide whiskers is 50-70nm, and the aspect ratio is (20-40): 1; The particle size of silicon carbide particles is 10-20nm. Then put it into a V-shaped mixing tank for pre-mixing for 2 hours, and the speed of the mixing tank is 60r / min; weigh 10Kg of paraffin, put it into a heating furnace for preheating, and the preheating temperature is 200°C to remove the moisture and flammable impurities in the raw materials. make it melt; then pre-mixed Al 2 o 3 Put the hollow microspheres, silicon carbide whiskers, silicon carbide particles and melted paraffin into a mixing tank equipped...
Embodiment 2
[0040] A method for preparing a metal matrix composite material, comprising the following steps:
[0041] (1) Weigh Al according to the formula 2 o 3 Hollow microspheres 10Kg, silicon carbide whiskers 10Kg, silicon carbide particles 30Kg, selected Al 2 o 3 The particle size of hollow microspheres is 40-60μm, the ratio of wall thickness to radius t / R is (0.050-0.080): 1; the particle size of silicon carbide whiskers is 80-110nm, and the aspect ratio is (65-90): 1; The particle size of silicon carbide particles is 30-40nm. Then put it into a V-shaped mixing tank for pre-mixing for 2 hours, and the mixing tank speed is 60r / min; weigh 20Kg of paraffin, put it into a heating furnace for preheating, and the preheating temperature is 200°C to remove the moisture and flammable impurities in the raw materials. make it melt; then pre-mixed Al 2 o 3 Put the hollow microspheres, silicon carbide whiskers, silicon carbide particles and melted paraffin into a mixing tank equipped with ...
Embodiment 3
[0046] A method for preparing a metal matrix composite material, comprising the following steps:
[0047] (1) Weigh Al according to the formula 2 o 3 Hollow microspheres 80Kg, silicon carbide whiskers 15Kg, silicon carbide particles 50Kg, selected Al 2 o 3 The particle size of hollow microspheres is 30-50μm, the ratio of wall thickness to radius t / R is (0.040-0.060): 1; the particle size of silicon carbide whiskers is 60-80nm, and the aspect ratio is (50-70): 1; The particle size of silicon carbide particles is 20-30nm. Then put it in a V-shaped mixing tank for pre-mixing for 2 hours, and the mixing tank speed is 60r / min; weigh 60Kg of paraffin, put it in a heating furnace for preheating, and the preheating temperature is 200°C to remove the moisture and flammable impurities in the raw materials. make it melt; then pre-mixed Al 2 o 3 Put the hollow microspheres, silicon carbide whiskers, silicon carbide particles and melted paraffin into a mixing tank equipped with a hea...
PUM
Property | Measurement | Unit |
---|---|---|
Particle size | aaaaa | aaaaa |
Particle size | aaaaa | aaaaa |
Density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com