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High temperature resistant silane modified adhesive and its preparation method and application

A silane-modified and silane-modified polyether technology, which is applied in the direction of non-macromolecular adhesive additives, adhesives, polyether adhesives, etc., can solve the problem of high temperature resistance of acrylate adhesives that cannot meet the technical requirements of hatch production Insufficient and other problems, to achieve good elasticity, low TVOC, good storage effect

Active Publication Date: 2021-10-19
HUBEI HUITIAN NEW MATERIALS STOCK CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high temperature resistance of acrylic glue is lacking, and its use temperature is limited to below 100°C, which can no longer meet the production technical requirements of the hatch

Method used

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  • High temperature resistant silane modified adhesive and its preparation method and application
  • High temperature resistant silane modified adhesive and its preparation method and application
  • High temperature resistant silane modified adhesive and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] This embodiment provides a high-temperature-resistant silane-modified adhesive, including component A and component B. Among them, component A: 100 parts of silane modified polymer STP-E 15, 5 parts of diisoamyl phthalate DINP, 15 parts of nano-calcium CCS25, 0.5 parts of UV absorber Tinuvin326, 0.5 parts of light stabilizer Tinuvin770, 0.5 parts of colorant, 2 parts of methyl trimethoxy silane, 3 parts of γ-aminopropyltriethoxysilane and 5 parts of 2,4,6-tris(dimethylaminomethyl)phenol.

[0054]Component B: 100 parts of epoxy resin E-51, 20 parts of polyisobutylene, 10 parts of activated 4A molecular sieve raw powder, 0.5 parts of water and 0.2 parts of dibutyltin dilaurate.

[0055] This embodiment also provides a preparation method of the high-temperature-resistant silane-modified adhesive, which includes the following steps:

[0056] Preparation of component A: Weigh each raw material according to the composition of component A, and the silane-modified polymer ...

Embodiment 2

[0059] This embodiment provides a high-temperature-resistant silane-modified adhesive, including component A and component B. Among them, component A: 100 parts of silane modified polymer SAX260, 8 parts of dioctyl phthalate DOP, 25 parts of heavy calcium carbonate, 0.5 parts of UV absorber Tinuvin327, 0.8 parts of light stabilizer Tinuvin327, 1 Parts of colorant, 4 parts of dimethyldimethoxysilane, 5 parts of N-β-aminoethyl-γ-aminopropyltrimethoxysilane and 6 parts of (1,3-cyclohexanedimethylamine) alicyclic amine.

[0060] Component B: 100 parts of epoxy resin E-44, 25 parts of polybutadiene, 8 parts of activated 5A molecular sieve raw powder, 1 part of water and 0.5 parts of dibutyltin diacetate.

[0061] The preparation method of the high-temperature resistant silane-modified adhesive of this embodiment is the same as that of Embodiment 1.

Embodiment 3

[0063] This embodiment provides a high-temperature-resistant silane-modified adhesive, including component A and component B. Among them, A component: 100 parts of silane modified polymer SAX580, 12 parts of polyether polyol (molecular weight 2500), 30 parts of heavy calcium carbonate, 0.5 parts of UV absorber Tinuvin326, 0.5 parts of light stabilizer Tinuvin5050, 2 Parts of colorant, 8 parts of dimethyldimethoxysilane, 2 parts of N-β-aminoethyl-γ-aminopropyltrimethoxysilane, and 3 parts of N,N'-bis(3-aminopropyl) -1,2-Ethylenediamine.

[0064] Component B: 100 parts of epoxy resin E-42, 10 parts of polyisobutylene, 5 parts of activated 13X molecular sieve powder, 2 parts of water and 1.5 parts of stannous octoate.

[0065] The preparation method of the high-temperature resistant silane-modified adhesive of this embodiment is the same as that of Embodiment 1.

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Abstract

The invention relates to a high temperature resistant silane modified adhesive and its preparation method and application. The high temperature resistant silane modified adhesive includes A component and B component, A component includes 100 parts of silane modified polymer, The first plasticizer is 0-15 parts, the filler is 10-40 parts, the crosslinking agent is 2-10 parts, the silane coupling agent is 2-8 parts and the curing agent is 0.5-10 parts, and the B component includes 100 parts of epoxy resin , 10-30 parts of the second plasticizer, 5-20 parts of molecular sieves, 0.5-5 parts of water and 0.1-2 parts of organic tin catalyst. The high-temperature-resistant silane-modified adhesive is suitable for non-polishing aluminum substrates and can meet the performance indicators of good elasticity and good bonding strength after high-temperature resistance. The TVOC is lower than 100mg / L, which can meet the production requirements of passenger car doors. skills requirement.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a high-temperature-resistant silane-modified adhesive, a preparation method and application thereof. Background technique [0002] Fast-curing, high-strength acrylic glue is mostly used for bonding traditional passenger car doors. However, raw materials such as methyl methyl ester in acrylate system glue have a low flash point and obvious odor, and its TVOC is very high, reaching 8000mg / L, which is not environmentally friendly. [0003] In recent years, with the rapid development of new energy buses, the material thickness of the cabin door and other body parts has become thinner. When acrylic adhesive is used for bonding, the cured acrylic adhesive shrinks significantly, and after curing, it is brittle and has poor flexibility, resulting in Textures are produced on the surface of the aluminum substrate. In addition, the aluminum plate base material is not polished during the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C09J171/00C09J163/02C09J123/20C09J151/00C09J11/04C09J11/06
CPCC08K2003/265C08K2201/011C08L2201/08C08L2205/03C08L2205/035C09J11/04C09J11/06C09J123/20C09J163/00C09J171/00C09J175/04C08L71/00C08L63/00C08L23/22C08L23/20C08L51/003C08K13/04C08K7/26C08K5/12C08K3/26C08K5/3475C08K5/3435C08K5/5419C08K5/544C08K5/18C08K5/17C08K5/548C08L75/04
Inventor 王翠花饶磊赵瑞蔡海涛赵勇刚章锋
Owner HUBEI HUITIAN NEW MATERIALS STOCK CO LTD
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