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Polyimide film and preparation method thereof

The technology of polyimide film and polyimide resin is applied in the field of polyimide film and its preparation, and can solve the problems of low transparency of polyimide film, poor mechanical properties of transparent polyimide film, etc. Achieve the effect of making up for the lack of mechanical strength, enhancing mechanical properties, and simple preparation method

Pending Publication Date: 2020-05-12
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low transparency of polyimide films and poor mechanical properties of transparent polyimide films, the present invention develops and provides a low dielectric constant polyimide with good mechanical properties and high transparency Film Preparation Method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The preparation of embodiment 1 transparent polyimide film

[0041] (1) Dissolve 1.601g (0.005mol) diamine monomer 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB) in 21mL N,N-dimethylformamide solution at room temperature After ultrasonication and stirring for 30min, 1.303g of 4,4'-diphenyl ether dianhydride (ODPA) (0.0042mol) was added thereto, mechanically stirred for 8h under nitrogen protection, and 0.800g of hexafluorodianhydride ( 6FDA) (0.0018mol) to obtain a transparent polyamic acid solution with a solid content of 15wt%. After ultrasonication and stirring for 12 hours, a catalyst (the ratio of acetic anhydride to pyridine was 10:1) was added for chemical imidization After reacting and continuing to stir for 12 hours, pour into ethanol to precipitate polyimide resin containing terminal anhydride functional groups, and then wash the polyimide resin several times.

[0042] (2) Dissolve polyimide resin in N,N-dimethylformamide solution, ultrasonically stir for 1 ...

Embodiment 2

[0047] Example 2 Preparation of transparent polyimide film (1) Dissolve 1.601g (0.005mol) of diamine monomer 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB) in 21mL at room temperature In the N,N-dimethylformamide solution, after being ultrasonically stirred for 30 min, 1.303 g of 4,4'-diphenyl ether dianhydride (ODPA) (0.0042 mol) was added thereto, and mechanically stirred for 8 h under nitrogen protection. Then add 0.800g hexafluorodianhydride (6FDA) (0.0018mol) to it to obtain a transparent polyamic acid solution with a solid content of 15wt%. The ratio is 10:1) to carry out chemical imidization reaction, continue to stir for 12 hours, pour into ethanol to precipitate polyimide resin containing terminal anhydride functional groups, and then wash the polyimide resin several times.

[0048] (2) Dissolve polyimide resin in N,N-dimethylformamide solution, ultrasonically stir for 1 hour, and then add 0.188g of bridging compound to it Tris (3-aminopropyl) amine, after continui...

Embodiment 3

[0053] The preparation of embodiment 3 transparent polyimide films

[0054] (1) Dissolve 1.601g (0.005mol) diamine monomer 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB) in 22mL N,N-dimethylformamide solvent at room temperature , after ultrasonic stirring for 30min, 0.558g of 4,4'-diphenyl ether dianhydride (ODPA) (0.0018mol) was added thereto, mechanically stirred for 8h under nitrogen protection, and 1.866g of hexafluorodianhydride (6FDA ) (0.0042mol) to obtain a transparent polyamic acid solution with a solid content of 15wt%. After ultrasonication and stirring for 12 hours, a catalyst was added thereto (the ratio of the amount of acetic anhydride to pyridine was 10:1) for chemical imidization reaction After continuing to stir for 12 hours, pour into ethanol to precipitate polyimide resin containing terminal anhydride functional groups, wash and dry the polyimide resin several times.

[0055] (2) Dissolve polyimide resin in N,N-dimethylformamide solvent, ultrasonically an...

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Abstract

The invention relates to a polyimide film and a preparation method thereof. The preparation method for the polyimide film specifically comprises the following steps: 1) polymerizing a fluorine-containing diamine monomer and a dianhydride monomer to obtain a polyamide acid precursor solution; 2) adding a catalyst into the polyamic acid precursor solution, carrying out a chemical imidization reaction, and then pouring a reaction product into an alcohol solvent for precipitation so as to prepare polyimide resin containing terminal anhydride functional groups; 3) dissolving the polyimide resin, and adding a bridging compound for a reaction; and 4) coating a film-forming solution by using a spin coater to form a film, and carrying out thermal imidization treatment on the film to obtain the polyimide film, wherein the bridging compound is selected from compounds represented by N((CH<2>)<n>NH<2>)<3>, and n is in a range of 2-5. The film provided by the invention has the advantages of high transparency, low dielectric constant and excellent mechanical properties.

Description

technical field [0001] The invention belongs to the technical field of polymer films, and in particular relates to a transparent polyimide film with low dielectric constant and excellent mechanical properties and a preparation method thereof. Background technique [0002] Polyimide is an aromatic polymer engineering plastic developed in the past half a century. Due to its excellent thermal stability, mechanical strength, chemical corrosion resistance and insulation, it is widely used in aerospace, rail transit, electronics, etc. Packaging, chemical industry and other fields. Usually, polyimide is prepared by liquid-phase polymerization of aromatic dianhydride and aromatic diamine, followed by dehydration imidization under high temperature conditions. [0003] However, the traditional polyimide material has a large number of carbonyl groups and amino groups remaining in the polyimide molecular chain, and the electronic interaction between the two makes the formation of elect...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K5/17C08G73/10C08J3/24
CPCC08J5/18C08G73/1071C08G73/1039C08G73/1042C08J3/24C08J2379/08C08K5/17
Inventor 于淑会李鸿韬罗遂斌吴旭东孙蓉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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