Preparing method of nano metal solder paste for Ag-Sn core-shell structure and application thereof

A nano-metal, core-shell structure technology, applied in metal processing equipment, metal processing, welding equipment, etc., can solve the problems of high sintering temperature, high cost of nano-silver, low service temperature of solder paste sintering materials, etc., to reduce Cost price, improve the quality of use, reduce the effect of electromigration

Active Publication Date: 2020-06-05
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the technical problems existing in the above-mentioned prior art, the present invention will solve the high cost of nano-silver prepared by the existing method, the problem of higher sintering temperature and the low service temperature of tin solder paste sintering materials, and provides a silver-tin nucleus The preparation method of the nano metal solder paste of shell structure specifically comprises the following steps:

Method used

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  • Preparing method of nano metal solder paste for Ag-Sn core-shell structure and application thereof

Examples

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Effect test

Embodiment 1

[0033] (1) Using deionized water at room temperature to ultrasonically wash the nano-silver at 20 KHz for 15 minutes, to obtain the nano-silver washed with deionized water.

[0034] (2) Add the nano-silver powder washed with deionized water into acetone (acetone is volatile), and use an ultrasonic cleaner with a temperature of 25°C at 30KHz to process the acetone solution containing silver powder for 10 minutes to obtain the acetone solution containing silver powder after ultrasonic .

[0035] (3) Naturally volatilize the acetone in the acetone solution containing the silver powder at room temperature to obtain dry silver powder to be coated.

[0036] (4) Add sodium hydroxide to deionized ice water to obtain an alkaline solution, adjust the solution to PH=12, add sodium borohydride to the alkaline solution to obtain a concentration of 1×10 -2 mol / L sodium borohydride reducing solution.

[0037] (5) Using a magnetic stirrer at a stirring speed of 300 r / min, the obtained dried...

Embodiment 2

[0040] A preferred embodiment comprises the following preparation steps:

[0041] (1) Using deionized water at room temperature to ultrasonically wash the nano-silver at 20 KHz for 15 minutes, to obtain the nano-silver washed with deionized water.

[0042] (2) Add the nano-silver powder washed with deionized water into acetone (acetone is volatile), and use an ultrasonic cleaner with a temperature of 25°C at 30KHz to process the acetone solution containing silver powder for 10 minutes to obtain the acetone solution containing silver powder after ultrasonic .

[0043] (3) Naturally volatilize the acetone in the acetone solution containing the silver powder at room temperature to obtain dry silver powder to be coated.

[0044] (4) Add sodium hydroxide to deionized ice water to obtain an alkaline solution, adjust the solution to PH=12, add sodium borohydride to the alkaline solution to obtain a concentration of 1×10 -2 mol / L sodium borohydride reducing solution.

[0045] (5) U...

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Abstract

The invention provides a preparing method of nano metal solder paste for an Ag-Sn core-shell structure and application thereof. Through preprocessing nano Ag, preparing a sodium borohydride reducing solution and wrapping the nano Ag by Sn, the nano metal solder paste for the Ag-Sn core-shell structure is obtained. The sintering temperature of Ag-Sn core-shell layer composite metal is lower than the sintering temperature of the nano Ag, and the service temperature is higher than the service temperature of Sn metal solder paste; the cost price of a sintering paste material is reduced overall; the electromigration phenomenon of Ag is reduced, and the use quality of the solder paste is improved; and the strength of an interconnected material connector can reach 25 MPa or above.

Description

technical field [0001] The invention relates to the technical field of preparation of composite nanomaterials, in particular to a preparation method and application of a nano-metal solder paste with a silver-tin core-shell structure. Background technique [0002] At present, with the development of power semiconductor devices, the characteristic size of semiconductor devices drives the package size to become smaller and smaller. At the same time, people have higher and higher performance requirements for power electronic devices. Therefore, some high-voltage, high-temperature, and high-power wide-bandgap semiconductor devices continue to emerge, such as silicon carbide and gallium nitride-based devices. This type of semiconductor device has the characteristics of high blocking voltage, low on-state specific resistance and specific thermal resistance, low switching loss, high temperature resistance and radiation resistance, etc., and still has very good conversion characteri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B23K1/00
CPCB23K35/025B23K1/00B23K2101/40B23K2101/36
Inventor 陈静刘盼张靖叶怀宇张国旗
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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