Resin composition and prepreg using same, and circuit material

A technology of resin composition and terpene resin, applied in printed circuit, electronic equipment, printed circuit, etc., can solve the problems of insufficient heat resistance, weak intermolecular force, low peel strength, etc., and achieve good film-forming properties Effect

Active Publication Date: 2020-06-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyolefin materials have fewer reactive groups and weak intermolecular forces after curing, so the prepared boards have the disadvantages of low peel strength and insufficient heat resistance.

Method used

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  • Resin composition and prepreg using same, and circuit material
  • Resin composition and prepreg using same, and circuit material
  • Resin composition and prepreg using same, and circuit material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3 and comparative example 1-6

[0081]Embodiment 1-3 and comparative example 1-6 each provide a kind of circuit material, and its preparation method is as follows:

[0082] Provide prepregs: Synamic6 prepregs, thermosetting hydrocarbon-based substrate materials, self-made by Guangdong Shengyi Technology;

[0083] Preparation of the adhesive layer: dissolve unsaturated polyphenylene ether resin, polyolefin resin, terpene resin, initiator, flame retardant, filler, etc. in xylene according to the proportion, and mix at room temperature to obtain glue; Coating machine coats this glue solution on the copper foil, then bakes in the oven of 155 ℃ for 5 minutes, obtains the copper foil with adhesive layer (adhesive layer unit gram weight is 20g / m 2 ).

[0084] Preparation of circuit materials: 4 pieces of Synamic6 prepregs and copper foil with adhesive layer are stacked neatly (adhesive layer is between the prepreg and copper foil), laminated and cured in a press at 210°C to obtain circuit material.

Embodiment 4

[0086] This embodiment provides a copper clad laminate, the preparation method of which is as follows:

[0087] Dissolve unsaturated polyphenylene ether resin, polyolefin resin, terpene resin, initiator, flame retardant, filler, etc. in xylene in proportion, and mix at room temperature to obtain glue; impregnate the reinforcing material 2116 glass fiber with glue Cloth, dry and semi-cured to obtain a prepreg;

[0088] The above-mentioned prepreg and a piece of copper foil are stacked neatly, laminated and cured in a press at 210° C. to obtain a copper-clad laminate.

Embodiment 5

[0090] This embodiment provides a circuit material, and its preparation method is as follows:

[0091] Provide prepreg: S7136 prepreg, thermosetting hydrocarbon-based substrate material, self-made by Guangdong Shengyi Technology;

[0092] Preparation of the adhesive layer: dissolve unsaturated polyphenylene ether resin, polyolefin resin, terpene resin, initiator, flame retardant, filler, etc. in xylene according to the proportion, and mix at room temperature to obtain glue; The coating machine coats the glue solution on the release film, then bakes it in an oven at 155°C for 5 minutes, removes the release film to obtain an adhesive layer (the unit weight of the adhesive layer is 20g / m 2 );

[0093] Preparation of circuit material: 4 sheets of S7136 prepreg, adhesive layer and copper foil were laminated in sequence, laminated and cured in a press at 210° C. to obtain a circuit material.

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Abstract

The invention provides a resin composition and a prepreg using the same, and a circuit material. The resin composition comprises unsaturated polyphenyl ether resin, polyolefin resin, terpene resin andan initiator, wherein the content of the terpene resin is 3-40 parts by weight based on the fact that the total weight of the unsaturated polyphenyl ether resin, the polyolefin resin and the terpeneresin is 100 parts by weight; and the polyolefin resin is one selected from a group consisting of unsaturated polybutadiene resin, SBS resin and styrene-butadiene resin or a combination of at least two selected from the group. Through mutual cooperation of the unsaturated polyphenyl ether resin, the polyolefin resin and the terpene resin, the obtained resin composition has good film-forming property, cohesiveness and dielectric property, and a circuit board adopting the resin composition has relatively high interlaminar strength and relatively low dielectric loss.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a resin composition and a prepreg and circuit material using the resin composition. Background technique [0002] Circuit boards are key components of electronic equipment such as mobile phones, computers, communication base stations, and intelligent robots, which have a major impact on the speed and accuracy of information transmission. In recent years, with the development of high-performance, high-functionality and networking of communication equipment, in order to transmit high-speed and process large-capacity information, the frequency of operation signals is increasing. [0003] The smaller the dielectric constant of the circuit insulating material, the faster the signal transmission rate. Therefore, for high-speed signal transmission, it is necessary to develop a circuit substrate with a low dielectric constant. At the same time, high-frequency ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L47/00C08L71/12C08L45/00C08J5/24C09J147/00C09J171/12C09J145/00C09D147/00C09D171/12C09D145/00B32B17/04B32B17/06B32B15/20B32B15/14B32B7/12B32B27/04B32B27/28B32B27/32B32B27/20B32B27/18B32B15/085B32B15/08B32B33/00H05K1/02
CPCC08L47/00C08L71/126C08J5/24C09J147/00C09J171/12C09D147/00C09D171/12B32B5/02B32B15/20B32B15/14B32B7/12B32B15/085B32B15/08B32B27/285B32B27/32B32B27/28B32B33/00H05K1/02B32B2260/021B32B2260/046B32B2262/101B32B2307/204C08L2205/03C08L2203/20C08J2347/00C08J2445/00C08J2471/12C08J2371/12C08J2447/00C08L45/00C08G65/485C08L9/06H05K1/0326H05K1/0366H05K1/0373H05K2201/0209C08J2409/00C08J2309/00C08J2309/06Y02E60/10C08L57/00C08L9/00B32B2457/08B32B2260/023B32B5/26C09J109/06C08L93/00
Inventor 师剑英殷卫峰许永静颜善银
Owner GUANGDONG SHENGYI SCI TECH
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