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Mounting structure and mounting process for semiconductor device

A semiconductor and equipment technology, applied in the field of large-scale integrated block structure, can solve the problems of long curing steps and low productivity, and achieve the effects of increasing productivity, easy reuse, and reducing production costs

Inactive Publication Date: 2003-06-25
LOCTITE +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such disclosed removal methods do not consistently allow for easy chip removal, the curing steps are long at high temperatures, and the process is generally less productive

Method used

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  • Mounting structure and mounting process for semiconductor device
  • Mounting structure and mounting process for semiconductor device
  • Mounting structure and mounting process for semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] thermosetting resin composition

[0071] A thermosetting resin composition was prepared by mixing epoxy resin (i), curing agent (ii) and plasticizer (iii) in the following amounts, and 0.1% by weight of a defoamer. The viscosity of the composition thus formed was 5,200 MPa.S.

[0072] (i) epoxy resin: the mixture of the bisphenol A type epoxy resin of 85 weight parts, the novolak epoxy resin of 4 weight parts and the alkyl glycidyl ether of 12-14 carbon atoms of 11 weight parts .

[0073] (ii) Curing agent: 3 parts by weight of dicyandiamide and 19 parts by weight of epoxy adduct of amine.

[0074] (iii) Plasticizer: 12 parts by weight of acrylated amine oligomer.

[0075] installation method

[0076] Using paste solder (PS10R-350A-F92C, manufactured by Harima Chemicals, Inc.), a CSP with 20 mm square components, electrodes with a diameter of 0.5 mm and an electrode pitch of 1.0 mm, and a carrier base composed of alumina were mounted on 1.6 mm thick glass-reinf...

Embodiment 2-5

[0087] The procedure of Example 1 was repeated except that the amount of acrylated amine oligomer used as the plasticizer in Example 1 was changed as follows. The resulting installation structure passed the thermal shock test, and its repair time was also within 3 minutes.

Embodiment 2

[0088] Embodiment 2: 1.2 parts by weight.

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Abstract

The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP / BGA, to be securely fixed to a circuit board by short-time heat curing, which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices.

Description

technical field [0001] The present invention relates to structures and methods for mounting semiconductor chips such as large scale integration ("LSI") on a carrier substrate. Background technique [0002] In recent years, small-sized LSI components are more desired for popular small-sized electronic devices such as video camera integrated video tape recorders ("VTR") and portable telephones. The result of these desired size reductions has been to reduce the size of chip-size or chip-scale components ("CSP") and ball gate array ("BGA") components substantially down to the size of a die. These CSPs and BGAs improve the characteristics of electronic devices while maintaining many of their operational properties, (thus serving to protect semiconductor die such as LSIs), and facilitate their inspection. [0003] Usually, CSP / BGA components are connected to conductors on the circuit board by means of soldering or the like. However, the reliability of the soldering between the b...

Claims

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Application Information

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IPC IPC(8): C08G59/24H01L21/56H01L21/60H01L23/29H01L23/31H05K3/28H05K3/34
CPCH01L23/293H01L2924/15311H01L2924/07811H01L21/563H05K3/3436H01L2224/16225H05K3/284H01L2224/73204H01L2924/01019H01L2224/32225H05K2201/10977H01L2224/73203H05K2203/176H01L2224/16Y02P70/50H01L2924/00H01L21/00
Inventor 饭田和利J·威格哈姆渡边正树目黑赳
Owner LOCTITE