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Silicon wafer cutting fluid suitable for on-line recovery and supply circulation system and preparation method thereof

A circulation system and cutting fluid technology, applied in the petroleum industry, lubricating composition, etc., can solve the problems of large foaming, slow foam elimination, and affecting cutting performance, so as to achieve slow change in conductivity, suppress foam generation, reduce Putrefaction bubbling and spoilage effects

Inactive Publication Date: 2020-06-16
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this invention is to solve the problem that the long-term circulation of the cutting fluid used for diamond wire cutting silicon wafers in the large circulation system will cause a large amount of foaming, slow foam elimination, and affect the cutting performance.

Method used

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  • Silicon wafer cutting fluid suitable for on-line recovery and supply circulation system and preparation method thereof
  • Silicon wafer cutting fluid suitable for on-line recovery and supply circulation system and preparation method thereof
  • Silicon wafer cutting fluid suitable for on-line recovery and supply circulation system and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A silicon chip cutting fluid suitable for on-line recovery and supply circulation system, which includes the following components in weight percentage: 0.1% of triethanolamine borate, 0.1% of foam suppressor, 0.05% of non-foaming emulsifier, bactericidal and bacteriostatic agent 0.1%, polyethylene glycol 5%, non-foaming penetrant 1%, low-foaming cleaning agent 5% and deionized water 88.65%;

[0024] Wherein, the suds suppressor is obtained by mixing acetylenic diol and isooctyl alcohol in a mass ratio of 1:1;

[0025] The non-foaming emulsifier is obtained by mixing isomeric alcohol polyoxyethylene ether 1005 and FT62 at a mass ratio of 1:1;

[0026] The bactericidal and antibacterial agent is obtained by mixing isothiazolinone and s-triazine in a mass ratio of 1:1;

[0027] The non-foaming penetrating agent is obtained by mixing Dow EH-9, Dow TRITON DF-20 and low-foaming fatty alcohol polyoxyalkyl ether PlurafacLF 221 according to the mass ratio of 1:1:1;

[0028] Th...

Embodiment 2

[0031] A silicon chip cutting fluid suitable for on-line recovery and supply circulation system, which includes the following components in weight percentage: 0.1% of triethanolamine borate, 0.1% of foam suppressor, 0.05% of non-foaming emulsifier, bactericidal and bacteriostatic agent 0.1%, polyethylene glycol 5%, non-foaming penetrant 1%, low-foaming cleaning agent 5% and deionized water 88.65%;

[0032] Wherein, the foam suppressor is obtained by mixing acetylenic diol and isooctyl alcohol in a mass ratio of 1:2;

[0033] The non-foaming emulsifier is obtained by mixing isomeric alcohol polyoxyethylene ether 1005 and FT62 at a mass ratio of 1:2;

[0034] The bactericidal and antibacterial agent is obtained by mixing isothiazolinone and s-triazine in a mass ratio of 1:2;

[0035] The non-foaming penetrating agent is obtained by mixing Dow EH-9, Dow TRITON DF-20 and low-foaming fatty alcohol polyoxyalkyl ether PlurafacLF 221 according to the mass ratio of 1:2:2;

[0036] Th...

Embodiment 3

[0039] A silicon chip cutting fluid suitable for on-line recovery and supply circulation system, which includes the following components in weight percentage: 0.1% of triethanolamine borate, 0.1% of foam suppressor, 0.05% of non-foaming emulsifier, bactericidal and bacteriostatic agent 0.1%, polyethylene glycol 5%, non-foaming penetrant 1%, low-foaming cleaning agent 5% and deionized water 88.65%;

[0040] Wherein, the antifoaming agent is isooctyl alcohol;

[0041] The non-foaming emulsifier is FT625;

[0042] The bactericidal and antibacterial agent is s-triazine;

[0043] The non-foaming penetrant is Dow TRITON DF-20;

[0044] The low foam cleaning agent is organic amine ester TPP.

[0045] The silicon chip cutting fluid suitable for on-line recovery and supply circulation system is prepared by the following method: start the reactor, and turn on the temperature control device to control the temperature within 60°C, use the above-mentioned components by weight percentage...

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Abstract

The invention discloses a silicon wafer cutting fluid suitable for an on-line recovery and supply circulating system and a preparation method of the silicon wafer cutting fluid. The silicon wafer cutting fluid comprises the following components in percentage by weight: 0.1-1% of triethanolamine borate, 0.1-5% of a foam inhibitor, 0.05-5% of a foam-free emulsifier, 0.1-5% of a bactericidal bacteriostatic agent, 5-40% of polyethylene glycol, 1-20% of a foam-free penetrant, 5-10% of a low-foam cleaning agent and the balance being deionized water. The foam inhibitor is one or a mixture of two of alkynediol and isooctyl alcohol; the foam-free emulsifier is one or a mixture of two of isomeric alcohol ethoxylates 1005 and FT625. The silicon wafer cutting fluid disclosed by the invention has an excellent foam inhibition effect, and can inhibit the generation of foam and dissipate the foam more quickly in the recycling process without adding a defoaming agent, thereby enhancing the recycling effect.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting fluid, more specifically, the invention relates to a diamond wire-cut silicon wafer cutting fluid suitable for online recovery and supply circulation system and a preparation method thereof. Background technique [0002] Photovoltaic silicon wafer cutting technology is developing rapidly. Electroplating diamond wire cutting has replaced traditional silicon carbide blade cutting. The new technology solves the problem of silicon carbide sauce processing and promotes the development of electroplating diamond wire cutting. Silicon wafer cutting enterprises mostly adopt the centralized liquid supply and waste liquid treatment measures of the large circulation system. The large circulation system has the advantages of saving cutting fluid and uniformly treating waste liquid. However, the large circulation system has stricter requirements on the performance of the cutting fluid. In the syst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M169/04C10N40/22C10N30/18C10N30/10
CPCC10M169/048C10M2227/061C10M2209/104C10M2207/022C10M2207/021C10M2219/104C10M2215/222C10M2215/14
Inventor 沈家华吕德苏光临陈韬
Owner 广西珀源新材料有限公司
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