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Organic solderability preservative (OSP) and preparation method of organic copper coordination polymer film

A coordination polymer and solderability technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problem of not meeting the development of PCB, and achieve excellent copper-gold selectivity, maintain stability, and maintain solderability. Effect

Active Publication Date: 2020-07-03
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the continuous development of the printed circuit board (PCB) industry, the requirements for surface treatment technology are getting higher and higher, which makes the hot air leveling process used earlier can no longer meet the development of PCB

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  • Organic solderability preservative (OSP) and preparation method of organic copper coordination polymer film
  • Organic solderability preservative (OSP) and preparation method of organic copper coordination polymer film

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Embodiment Construction

[0033] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0034] An organic solderability protective agent provided by the first embodiment of the present invention includes imidazole compounds, small molecular acids, long-chain acids, transition metal ions, deionized water and pH regulators, wherein: the concentration of imidazole compounds is 1- 10g / L, the concentration of small molecule acid is 2-10mol / L, the concentration of long-chain acid is 1-10g / L, the concentration of transition metal ion is 0.1-1g / L; the pH of the organic solderability protective agent The value is 2-4.

[0035] In the above-mentioned embodiments, the imidazole compound is selected as the main film-forming substance of the organic solderability protective agent, which improves the heat resistance...

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Abstract

The invention relates to an organic solderability preservative (OSP). An imidazole compound is used as the main film forming substance of the OSP, the heat resistance of a printed circuit board (PCB)organic copper coordination polymer film which is formed subsequently is improved, the temperature required for lead-free soldering can be reached, pollution to the environment is reduced, the performance of the organic copper coordination polymer film is still quite stable after being subjected to multiple times of reflow soldering treatment, requirements of a PCB surface treatment production process are met, an OSP solution is very stable, and a film formed on the surface of a PCB can be used for effectively preventing copper from being oxidized within a certain period; and meanwhile, the good solderability and excellent copper-gold selectivity are maintained in lead-free reflow temperature welding. The PCB OSP provided by the invention conforms to progress and development of an integrated circuit technology. In addition, the invention further relates to a preparation method of the organic copper coordination polymer film.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a preparation method of an organic solderability protective agent and an organic copper coordination polymer film. Background technique [0002] With the continuous development of the printed circuit board (PCB) industry, the requirements for surface treatment technology are getting higher and higher, which makes the hot air leveling process used earlier unable to meet the development of PCB. There are many common surface treatment technologies, such as lead-free hot air leveling, chemical immersion tin, chemical immersion silver, electroless nickel / gold (ENIG), organic solder preservative (OSP), etc., each surface treatment technology has its own advantages and disadvantages Among them, OSP has the advantages of simple process, convenient operation, low price and low pollution, so it is widely used in the manufacture of integrated circuits of electronic devices ...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/40C08J5/18C08L87/00C08G83/00
CPCB23K35/3612B23K35/362B23K35/40C08G83/008C08J5/18C08J2387/00
Inventor 周国云王玲凤何为王守绪陈苑明王翀洪延杨文君
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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