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A kind of preparation method of organic solderability protective agent and organic copper coordination polymer film

A coordination polymer and solderability technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as the inability to meet the development of PCB, and achieve excellent copper-gold selectivity, maintain stability, and reduce pollution.

Active Publication Date: 2021-08-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the continuous development of the printed circuit board (PCB) industry, the requirements for surface treatment technology are getting higher and higher, which makes the hot air leveling process used earlier can no longer meet the development of PCB

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  • A kind of preparation method of organic solderability protective agent and organic copper coordination polymer film
  • A kind of preparation method of organic solderability protective agent and organic copper coordination polymer film

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Embodiment Construction

[0033] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0034] An organic solderability protective agent provided by the first embodiment of the present invention includes imidazole compounds, small molecular acids, long-chain acids, transition metal ions, deionized water and pH regulators, wherein: the concentration of imidazole compounds is 1- 10g / L, the concentration of small molecule acid is 2-10mol / L, the concentration of long-chain acid is 1-10g / L, the concentration of transition metal ion is 0.1-1g / L; the pH of the organic solderability protective agent The value is 2-4.

[0035] In the above-mentioned embodiments, the imidazole compound is selected as the main film-forming substance of the organic solderability protective agent, which improves the heat resistance...

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Abstract

The invention relates to an organic solderability protective agent, wherein an imidazole compound is selected as the main film-forming substance of the organic solderability protective agent, which improves the heat resistance of the organic copper coordination polymer film of a printed circuit board formed subsequently, It can meet the temperature required for lead-free soldering and reduce environmental pollution. After multiple reflow soldering treatments, the performance of the organic copper coordination polymer film is still very stable, which meets the needs of the PCB surface treatment production process. OSP solution As far as it is concerned, it is very stable, and the film formed on the surface of the PCB can effectively prevent copper from being oxidized for a certain period of time. At the same time, it maintains good solderability under lead-free reflow temperature soldering, and has excellent copper and gold options. sex. The printed circuit organic solderability protectant provided by the invention conforms to the progress and development of integrated circuit technology. In addition, the invention also relates to a method for preparing an organic copper coordination polymer film.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a preparation method of an organic solderability protective agent and an organic copper coordination polymer film. Background technique [0002] With the continuous development of the printed circuit board (PCB) industry, the requirements for surface treatment technology are getting higher and higher, which makes the hot air leveling process used earlier unable to meet the development of PCB. There are many common surface treatment technologies, such as lead-free hot air leveling, chemical immersion tin, chemical immersion silver, electroless nickel / gold (ENIG), organic solder preservative (OSP), etc., each surface treatment technology has its own advantages and disadvantages Among them, OSP has the advantages of simple process, convenient operation, low price and low pollution, so it is widely used in the manufacture of integrated circuits of electronic devices ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362B23K35/40C08J5/18C08L87/00C08G83/00
CPCB23K35/3612B23K35/362B23K35/40C08G83/008C08J5/18C08J2387/00
Inventor 周国云王玲凤何为王守绪陈苑明王翀洪延杨文君
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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