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Method for improving performance of polyimide by negative thermal expansion material with coupling agent modified surface

A negative thermal expansion material and surface modification technology, which is applied in the field of coupling agent surface modification treatment negative thermal expansion material to improve polyimide performance, low thermal expansion coefficient (performance) polyimide, to achieve strong controllability and versatility , easy to achieve, reduce the effect of cracking or peeling

Pending Publication Date: 2020-07-28
ZHENGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above situation, the object of the present invention is to provide a method for improving the performance of polyimide by surface modification of the coupling agent and treating negative thermal expansion materials, which can effectively solve the problem of reducing or regulating the thermal expansion coefficient of PI to improve its dielectric properties, and satisfy the requirements of integrated circuits and The problem of thermal matching requirements for silicon-based materials in chip packaging

Method used

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  • Method for improving performance of polyimide by negative thermal expansion material with coupling agent modified surface
  • Method for improving performance of polyimide by negative thermal expansion material with coupling agent modified surface
  • Method for improving performance of polyimide by negative thermal expansion material with coupling agent modified surface

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Embodiment 1

[0029] A method for improving the performance of polyimide by surface modification of a coupling agent for negative thermal expansion materials, comprising the following steps:

[0030] (1) Take 1ml of silane coupling agent KH570 and add 49 ml of absolute ethanol, dissolve and dilute for 4.5 hours to obtain a diluted solution of silane coupling agent KH570;

[0031] (2) Take 0.8167g (that is, 40% of the total mass of ZWP / PI of the target composite material 2.0417g) of ZWP powder, add it to 50 mL of absolute ethanol, stir on a magnetic stirrer for 30 min, and use an ultrasonic cleaner Ultrasonic treatment for 10 min to obtain the solution after ultrasonic treatment;

[0032] (3) Use a pipette to measure 245 ul, 491 ul, 738 ul, 986 ul, 1236 ul from the silane coupling agent KH570 dilution solution obtained in step (1) respectively (that is, the negative thermal expansion coefficient of the target compound / polyimide 0.25wt.%, 0.5 wt.%, 0.75 wt.%, 1 wt.%, 1.25 wt.% of the amine c...

Embodiment 2

[0037] A method for improving the performance of polyimide by surface modification of a coupling agent for negative thermal expansion materials, comprising the following steps:

[0038](1) Take 1ml of silane coupling agent KH570 and add 49 ml of absolute ethanol, dissolve and dilute for 4.5 hours to obtain a diluted solution of silane coupling agent KH570;

[0039] (2) Take 0.8167g (that is, 40% of the total mass of ZWP / PI of the target composite material 2.0417g) of ZWP powder, add it to 50 mL of absolute ethanol, stir on a magnetic stirrer for 30 min, and use an ultrasonic cleaner Ultrasonic treatment for 10 min to obtain the solution after ultrasonic treatment;

[0040] (3) Use a pipette to measure 491 ul, 986 ul, 1993 ul, 3021 ul, 4070 ul, 5141 ul respectively from the silane coupling agent KH570 dilution solution obtained in step (1) (that is, the negative thermal expansion coefficient of the target compound / 0.5 wt.%, 1 wt.%, 2 wt.%, 3wt.%, 4 wt.%, 5 wt.%) of the polyim...

Embodiment 3

[0045] A method for improving the performance of polyimide by surface modification of a coupling agent for negative thermal expansion materials, comprising the following steps:

[0046] (1) Take 2ml of silane coupling agent KH570 and add 50 ml of absolute ethanol, dissolve and dilute for 2 hours to obtain a diluted solution of silane coupling agent KH570;

[0047] (2) Take 0.306g (that is, 20% of the total mass of ZWP / PI of the target composite material 1.531g) of ZWP powder, add it to 50 mL of absolute ethanol, stir on a magnetic stirrer for 30 min, and use an ultrasonic cleaner Ultrasonic treatment for 10 min to obtain the solution after ultrasonic treatment;

[0048] (3) Add the diluted solution of silane coupling agent KH570 prepared in step (1) to the solution after ultrasonic treatment in step (2);

[0049] (4) Stir the solution prepared in step (3) with a magnetic stirrer for 30 minutes, then ultrasonically treat it for 5 minutes, and then wash it with absolute ethanol...

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Abstract

The invention discloses a method for improving the performance of polyimide by a negative thermal expansion material with a coupling agent modified surface. The method comprises the following steps: 1) diluting a coupling agent; 2) modifying the surface of a negative thermal expansion material; and 3) compounding the negative thermal expansion material powder with a coupling agent modified surfaceprepared in the step 2) with polyimide (PI) according to a conventional in-situ compounding method to obtain a composite material of the negative thermal expansion material powder with a coupling agent modified surface and polyimide. The method is simple, convenient, is easy to implement, and is strong in controllability and universality. The negative thermal expansion material with a coupling agent modified surface reduces the thermal expansion coefficient of a polyimide material widely applied to the electronic industry; the dielectric property of polyimide is improved, the requirements ofthe microelectronic packaging industry, the solar cell field, the aviation field, the aerospace field and the like are met, cracking or peeling of a device in the use process is inhibited, the yield of devices is increased, the service life of devices is prolonged, the cost is reduced, and the economic and social benefits are remarkable.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a coupling agent surface modification treatment of negative thermal expansion materials for polyimide (PI) with low thermal expansion coefficient (performance) in the fields of electronic packaging, solar cells, aviation and aerospace, etc. A method for improving the properties of polyimide. Background technique [0002] The progress of modern society is closely related to the development of electronic technology. Mobile phones, computers, automotive electronics, and aerospace electronics are increasingly becoming smaller and lighter. In order to adapt to this development trend, flexible circuits suitable for three-dimensional electronic packaging should be used As a result, this circuit can be bent into the desired shape as needed. Flexible circuits use multi-layer wiring technology, using insulating polymers and adhesives to interconnect wires such as copper or aluminum to for...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K9/06C08K9/04C08K3/32
CPCC08K9/06C08K9/04C08K3/32C08L2203/20C08L79/08
Inventor 史新伟周强李杏瑞郭倩李敬王月蒙
Owner ZHENGZHOU UNIV