Chemical palladium plating reduction agent and chemical palladium plating solution

A reducing agent, chemical plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the coating flatness, poor brightness, chemical palladium reducing agent poisoning, stable palladium plating solution problems such as poor performance, to achieve the effect of smooth surface, simple components, and reducing the amount of addition

Pending Publication Date: 2020-07-28
GUANGDONG UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is to overcome the defects such as the existing electroless palladium plating reducing agent is highly toxic, easily introduces foreign elements, the plating speed is slow, the stability of the palladium plating solution is poor, the plating solution is difficult to handle, and the flatness and brightness of the coating are poor. Insufficient, provide a kind of environmental protection, accelerate the electroless palladium plating liquid reducing agent of palladium deposition, improve the stability of palladium plating liquid, make the palladium layer surface that prepares smooth, brightness is high

Method used

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  • Chemical palladium plating reduction agent and chemical palladium plating solution
  • Chemical palladium plating reduction agent and chemical palladium plating solution
  • Chemical palladium plating reduction agent and chemical palladium plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A kind of electroless palladium plating liquid of embodiment 1

[0038] Described electroless palladium plating liquid is made of following raw material:

[0039] Palladium chloride 0.1g / L, citric acid 5g / L, hexamethylenetetramine 1g / L, adjust the pH of the electroless palladium plating solution to 3.0 with hydrochloric acid, to obtain final product.

[0040] Plating a 10×10mm nickel-plated substrate in a plating solution at 55°C for 15 minutes, washing with water and drying after plating to obtain a palladium film with an average thickness of 0.05±0.02 μm; magnify the palladium film by 3000 under a scanning electron microscope Observed at magnification, it can be observed that the palladium film on the surface is smooth.

[0041] When the electroless palladium plating solution is cooled, its pH is measured to be 2.95.

[0042] After the electroless palladium plating solution of embodiment 1 was placed for 3 days, the plating solution had good stability, and the pheno...

Embodiment 2

[0043] A kind of electroless palladium plating liquid of embodiment 2

[0044] Described electroless palladium plating liquid is made of following raw material:

[0045] Palladium chloride 0.1g / L, citric acid 5g / L, lactose 2g / L, adjust the pH of the electroless palladium plating solution to 3.0 with hydrochloric acid, to obtain final product.

[0046] Plating a 10×10mm nickel-plated substrate in a plating solution at 55°C for 15 minutes, washing with water and drying after plating to obtain a palladium film with an average thickness of 0.06±0.02 μm; magnify the obtained palladium film under a scanning electron microscope at 3000 Observed at magnification, it can be observed that the palladium film on the surface is smooth.

[0047] When the electroless palladium plating solution is cooled, its pH is measured to be 2.85.

[0048] After the electroless palladium plating solution of embodiment 2 was placed for 3 days, the plating solution had good stability, and the phenomenon ...

Embodiment 3

[0049] A kind of electroless palladium plating solution of embodiment 3

[0050] Described electroless palladium plating liquid is made of following raw material:

[0051] Palladium chloride 0.5g / L, citric acid 20g / L, glucose 8g / L, the pH of the electroless palladium plating solution is adjusted to 3.0 with hydrochloric acid, to obtain final product.

[0052] Plating a 10×10mm nickel-plated substrate in a plating solution at 55°C for 15 minutes, washing and drying after plating, to obtain a palladium film with an average thickness of 0.18±0.02 μm; magnify the palladium film by 3000 under a scanning electron microscope Observed at magnification, it can be observed that the palladium film on the surface is smooth and bright.

[0053] When the electroless palladium plating solution is cooled, its pH is measured to be 2.96.

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Abstract

The invention belongs to the technical field of chemical palladium plating, and particularly relates to a chemical palladium plating reduction agent and a chemical palladium plating solution. The chemical palladium plating reduction agent comprises one or more several kinds in hexamethylenetetramine, glucose and lactose and is green and environment-friendly, pollution of traditional hydrazine, formic acid, formaldehyde and other reduction agents to the environment is reduced, palladium deposition can be accelerated, a dense palladium film is formed, the adding quantity of palladium salt is reduced, and the cost is greatly reduced; and the chemical palladium plating solution is simple in component and high in stability, a prepared and obtained palladium layer is level in surface and high inbrightness and is suitable for large-scale industrial production, and the application prospects are wide.

Description

technical field [0001] The invention belongs to the technical field of electroless palladium plating. More specifically, it relates to an electroless palladium plating reducing agent and an electroless palladium plating solution. Background technique [0002] In the traditional chemical nickel-gold process, the deposition of gold is carried out through the nickel-gold substitution reaction. Due to the cellular structure of the Ni-P surface and the penetration of cyanide ions, the surface charge distribution will be uneven. Severe corrosion at local locations leads to lack of weldability on the surface of the Ni-P layer, resulting in insufficient strength of solder joints, and even cracks. After cracking, the surface of the pad is mostly dark gray or black, commonly known as the "black plate" phenomenon. In order to solve the "black plate" problem caused by Ni-P corrosion, a palladium layer can be added between the nickel layer and the gold layer. On the one hand, it can sup...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 郝志峰黄静梦许润峰吴博胡光辉王斌杨应喜黎小芳李小兵刘彬云
Owner GUANGDONG UNIV OF TECH
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