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Thermal electron enhanced heat exchange device, heat exchange system and heat exchange method

A technology that enhances heat transfer and thermal electrons. It is applied in heat exchange equipment, indirect heat exchangers, lighting and heating equipment, etc. It can solve the problems that the cooling medium cannot effectively complete high heat flow heat transfer in a timely manner, and the local temperature of gas turbine blades is high. Achieve excellent heat conduction effect, improve heat exchange efficiency and optimize structure

Active Publication Date: 2021-07-23
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Similar to the high-temperature heat transfer in the solar thermal system, the cooling of gas turbine blades and the working process of electronic components will also cause the local temperature to be too high, and the cooling medium cannot effectively complete the high heat flow heat transfer in a timely manner.

Method used

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  • Thermal electron enhanced heat exchange device, heat exchange system and heat exchange method
  • Thermal electron enhanced heat exchange device, heat exchange system and heat exchange method
  • Thermal electron enhanced heat exchange device, heat exchange system and heat exchange method

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Embodiment approach 1

[0052] The first embodiment of the present invention provides a thermal electron enhanced heat exchange device, see figure 2 , image 3 and Figure 4 As shown, it includes a thermoelectric heat exchange layer 1 and a high-temperature heat source layer 2 , and the high-temperature heat source layer 2 is sheathed on the outside of the thermoelectric heat exchange layer 1 . Thermionic heat exchange layer 1 is divided into three layers, which are high temperature cathode layer 11, vacuum spacer layer 12 and low temperature anode layer 13 from outside to inside, and the inner space of low temperature anode layer 13 is formed as a low temperature medium channel 3 for the circulation of low temperature medium , the high-temperature cathode layer 11 can emit thermal electrons at high temperature, and the low-temperature anode layer 13 receives the thermal electrons, and the low-temperature medium exchanges heat with the low-temperature anode layer 13 in the low-temperature medium ch...

Embodiment approach 2

[0074] The second embodiment of the present invention provides a thermal electron enhanced heat exchange device. The second embodiment is a further improvement on the first embodiment. Parts not specifically described include reference numerals and text descriptions, which are the same as those of the first embodiment. The implementation is the same, and will not be repeated here.

[0075] The main improvement of the second embodiment over the first embodiment is that in the second embodiment of the present invention, the combination Figure 6 and Figure 7 From the point of view, the high-temperature heat source layer 2 is provided with a multi-layer thermoelectron heat exchange layer 1, the thermoelectron heat exchange layer 1 and the high-temperature heat source layer 2 are concentrically arranged, and the outer wall of the outermost thermoelectron heat exchange layer 1 is closely connected to the inner wall of the high-temperature heat source layer 2. Bonding, between two...

Embodiment approach 3

[0078] The third embodiment of the present invention provides a thermal electron enhanced heat exchange device. The third embodiment is a further improvement on the first to second embodiment. The second embodiment is the same, so it will not be repeated here.

[0079] The main improvement of the third embodiment compared with the first embodiment is that in the third embodiment of the present invention, considering high-temperature industrial projects such as nuclear power plant heat exchange and gas turbine blade heat exchange with a temperature exceeding 1000 ° C, the cathode material is made of resistant High temperature barium tungsten cathode, oxide cathode. to combine Figure 8 and Figure 9 It can be seen that the outer wall of the outermost thermionic heat exchange layer 1 is closely attached to the inner wall of the high-temperature heat source layer 2 , and the low-temperature medium channel 3 is between two adjacent thermionic heat exchange layers 1 .

[0080] In ...

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Abstract

The invention relates to the technical field of heat collection and heat exchange, and discloses a thermal electron enhanced heat exchange device, a heat exchange system and a heat exchange method. The thermal electron enhanced heat exchange device includes a thermal electron heat transfer layer and a high-temperature heat source layer, wherein the thermal electron heat transfer layer includes a high-temperature cathode layer, a vacuum spacer layer, and a low-temperature anode layer in sequence from outside to inside, and the inner space of the low-temperature anode layer forms It is a low-temperature medium channel. The high-temperature cathode layer overflows hot electrons at high temperature, and the hot electrons take away part of the heat from the high-temperature cathode layer and transfer it to the low-temperature anode layer. The heated low-temperature anode layer exchanges heat with the low-temperature medium circulating in the low-temperature medium channel. The thermal electron enhanced heat exchange device provided by the present invention has a simple and compact structure, does not need to be additionally provided with a low-temperature medium circulation system, and has high safety and good reliability. In addition, the dual superposition of thermal electron heat transfer and radiation heat transfer is used to effectively improve the heat transfer efficiency and meet the heat transfer requirements in high temperature environments.

Description

technical field [0001] The invention relates to the technical field of high temperature and high heat flow heat exchange, in particular to a thermoelectron enhanced heat exchange device, heat exchange system and heat exchange method based on thermionic emission technology. Background technique [0002] High temperature and high heat flow heat transfer widely exists in high temperature thermal power conversion and high temperature industrial projects such as solar thermal power generation heat collection and heat storage, nuclear power, gas turbine blade cooling, and heat dissipation of electronic components. Under high-temperature working conditions with a temperature exceeding 500°C, the commonly used heat transfer method is mainly the forced convection heat transfer method of cooling working fluid, such as liquid metal sodium heat transfer for solar collector heat transfer, fan forced air convection for Heat exchange of electronic components and cooling of gas turbine blad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D21/00F28F27/00
CPCF28D21/00F28F27/00
Inventor 肖刚王锦涛王国轩倪明江岑可法
Owner ZHEJIANG UNIV
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