High-heat-resistance low-dielectric copper-clad plate and preparation method thereof

Abstract

The invention discloses a high-heat-resistance low-dielectric copper-clad plate. The two sides of the high-heat-resistance low-dielectric copper-clad plate are provided with copper foils, 3-5 pieces of reinforcing material-based prepregs are arranged in the middle, the layers are bonded by an epoxy resin glue solution, the epoxy resin glue solution comprises the following components in parts by weight: 10 to 30 parts of brominated epoxy resin, 10 to 15 parts of trifunctional epoxy, 5 to 15 parts of polystyrene resin, 8 to 15 parts of polyimide resin, 10 to 20 parts of bisphenol A diphenyl ether bismaleimide, 15 to 30 parts of benzoxazine, 0.05 to 0.5 part of a curing accelerator, 15 to 35 parts of silica powder and 30 to 100 parts of a solvent. Targeted epoxy resin glue is prepared according to the characteristics of the copper-clad plate, the glue contains multifunctional epoxy and is compatible with other resin, the heat resistance of the copper-clad plate can be improved, and the glue solution contains low-dielectric benzoxazine resin, so that the dielectricity of the copper-clad plate can be reduced; the performance T288 / min of the copper-clad plate is larger than 120, Tg is larger than 200 DEG C, CTE is smaller than 2.0, Td is larger than 380, DK (10 GHz) is smaller than 3.6, DF (10 GHz) is smaller than 0.006, and the water absorption rate is smaller than 0.08%.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to a high-heat-resistant and low-dielectric copper-clad laminate and a preparation method thereof. Background technique [0002] With the development of electronic technology, electronic products are developing towards high-density, multi-functional, multi-unit multi-layer (HDI) and high-frequency and high-speed signal transmission, such as 5G communication, military radar, smart car electronics and high-end Servers, smart wearables, etc. have put forward higher requirements for the dielectric properties (Dk / Df), heat resistance, Tg, Td, and CTE of copper clad laminates. [0003] At present, the countries and companies that can mass produce such products are Panasonic of Japan and Rogers of the United States. Panasonic's process route is to use polyphenylene ether as the main resin, add fillers, flame retardants and other small amounts of additives to make glue. Using polytetrafluoroethyl...

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Problems solved by technology

[0004] The present invention aims at the problem of poor heat resistance and dielectric properties of the existing copper clad laminates, and provides a high heat resistant low dielectric copper clad laminate, the copper clad laminates are provided with copper foil on both sides, and 3-5 reinforcing material base prepregs in the middle , each layer is bonded with epoxy resin glue, and the epoxy resin glue is composed of the following components by weight: 10-30 parts of brominated epoxy resin, 10-15 parts of trifunctional epoxy, polystyrene resin 5-15 parts, 8-15 parts of polyimide resin, 10-20 parts of bisphenol A diphenyl ether bismaleimide, 15-30 parts of benzoxazine, 0.05-0.5 parts of curing accelerator, 15-35 parts of silica powder and 30-100 parts of solvent;

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