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Preparation method of heat-resistant polyimide molding powder containing benzimidazole structure

A technology of benzimidazole and polyimide, which is applied in the field of polymer molding powder preparation, can solve the problems of polyimide heat resistance reduction, achieve stable performance, control the reaction process, and strengthen the intermolecular force Effect

Pending Publication Date: 2020-08-14
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method adds a second diamine: 4,4'-diaminodiphenyl ether diamine, and the thermal stability of 4,4'-diaminodiphenyl ether diamine is the same as that of 2-amino (4-aminobenzene) - The thermal stability of 5-aminobenzimidazole is quite different, so the addition of 4,4'-diaminodiphenyl ether diamine will reduce the heat resistance of polyimide

Method used

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  • Preparation method of heat-resistant polyimide molding powder containing benzimidazole structure
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  • Preparation method of heat-resistant polyimide molding powder containing benzimidazole structure

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Experimental program
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Effect test

Embodiment 1

[0031] 1. Synthesis of polyamic acid: APABI:BPDA=1:1.03 molar ratio. First add 2-(4-aminophenyl)-5-aminobenzimidazole into the measured solvent N,N-dimethylacetamide, stir under nitrogen to completely dissolve APABI in the solvent, then slowly add Phthalic anhydride, divided into BPDA three times, mechanically stirred, added once every 15 minutes, and ensured that the dianhydride added in the previous time was completely dissolved. When the dianhydride was added for the last time, the viscosity of the solution rose sharply. After the reaction is finished, a polyamic acid solution with larger molecular chains is obtained.

[0032] 2. Preparation of polyimide molding powder: Slowly add catalyst triethylamine and dehydrating agent acetic anhydride to polyamic acid solution, react at 30°C for one hour, then rise to 80°C for one hour, then cool to room temperature , slowly added xylene under stirring at room temperature, the temperature of the oil bath was raised to 150° C. and th...

Embodiment 2

[0035] 1. Synthesis of polyamic acid: APABI:BPDA=1:1.05 molar ratio. First add 2-(4-aminophenyl)-5-aminobenzimidazole into the measured solvent N,N-dimethylacetamide, stir under nitrogen to completely dissolve APABI in the solvent, then slowly add Phthalic anhydride, divided into BPDA three times, mechanically stirred, added once every 15 minutes, and ensured that the dianhydride added in the previous time was completely dissolved. When the dianhydride was added for the last time, the viscosity of the solution rose sharply. After the reaction is finished, a polyamic acid solution with larger molecular chains is obtained.

[0036]2. Preparation of polyimide molding powder: Slowly add catalyst triethylamine and dehydrating agent acetic anhydride to polyamic acid solution, react at 30°C for one hour, then rise to 80°C for one hour, then cool to room temperature , slowly added xylene under stirring at room temperature, the temperature of the oil bath was raised to 150° C. and the...

Embodiment 3

[0038] 1. Synthesis of polyamic acid: APABI:BPDA=1:1.07 molar ratio. First add 2-(4-aminophenyl)-5-aminobenzimidazole into the measured solvent N,N-dimethylacetamide, stir under nitrogen to completely dissolve APABI in the solvent, then slowly add Phthalic anhydride, divided into BPDA three times, mechanically stirred, added once every 15 minutes, and ensured that the dianhydride added in the previous time was completely dissolved. When the dianhydride was added for the last time, the viscosity of the solution rose sharply. The reaction is over. A polyamic acid solution with a larger molecular chain is obtained.

[0039] 2. Preparation of polyimide molding powder: Slowly add catalyst triethylamine and dehydrating agent acetic anhydride to polyamic acid solution, react at 30°C for one hour, then rise to 80°C for one hour, then cool to room temperature , slowly added xylene under stirring at room temperature, the temperature of the oil bath was raised to 150° C. and the reacti...

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Abstract

The invention discloses a preparation method of heat-resistant polyimide molding powder containing a benzimidazole structure. The preparation method comprises the following steps: synthesizing poly(amic acid) with higher molecular weight from a diamine monomer containing a benzimidazole structure and an aromatic dianhydride monomer in an aprotic solvent, adding a catalyst and a dehydrating agent into the poly(amic acid), settling, washing and drying to obtain the heat-resistant polyimide molding powder containing the benzimidazole structure. The polyimide prepared by the preparation method disclosed by the invention not only has excellent thermal stability, but also has good solubility and excellent comprehensive performance.

Description

technical field [0001] The invention relates to a preparation method of a polymer molding powder, in particular to a preparation method of a heat-resistant polyimide molding powder containing a benzimidazole structure. Background technique [0002] Polyimide has excellent mechanical properties, mechanical properties, good solvent resistance, chemical corrosion resistance, high thermal stability, and a small thermal expansion coefficient. As an important application form of polyimide, molding powder is mainly used in compression molding to prepare polyimide parts, and is widely used in cutting-edge technical fields such as aerospace, electronic appliances, military equipment, automobiles, and communications. However, traditional polyimides have disadvantages such as difficult melting, high curing temperature, poor toughness, and poor processability. Many researchers have improved their solubility properties by introducing flexible groups, asymmetric substituents or large sid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/1067C08G73/1085C08G73/1007
Inventor 史铁钧刘晶
Owner HEFEI UNIV OF TECH
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