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Laser-loaded array catapulting process method

A process method and laser technology, applied in the direction of launch/drag transmission, can solve the problems of high-speed ejection of small-sized components, large ejection material size, low production efficiency, etc., to achieve excellent acceleration effect, increase absorption, The effect of environmental protection automation

Active Publication Date: 2020-08-21
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the complex equipment required for ejection with mechanical and electromagnetic energy sources, the size of ejection materials is large and there are certain requirements for materials, it cannot meet the needs of high-speed ejection of many small-sized components
In addition, although the preparation of a single projectile can also be automated, its production efficiency is low

Method used

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  • Laser-loaded array catapulting process method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A laser-loaded array ejection method is characterized in that it includes two parts: a module to be ejected and laser loading: 1. Preparation of a module to be ejected composed of objects to be ejected that are distributed in an array on a light-transmitting backplane; The single pulse laser of the short pulse laser is loaded on the ejection system of the coating. The other parameters are that the single pulse energy of the laser is about 3J. The object to be ejected is a pure aluminum sheet with a thickness of 25 μm. The plate is 0.5mm polycarbonate, the adhesive is double-sided tape, and the light spot is a circle with a diameter of 2mm. PDV test results show that the ejection speed can reach 1000m / s, and this process has excellent ejection performance.

Embodiment 2

[0032] A laser-loaded array ejection method is characterized in that it includes two parts: a module to be ejected and laser loading: 1. Preparation of a module to be ejected composed of objects to be ejected that are distributed in an array on a light-transmitting backplane; The single pulse laser of the short pulse laser is loaded on the ejection system of the coating. The other parameters are that the single pulse energy of the laser is about 3J. The object to be ejected is a pure aluminum sheet with a thickness of 25 μm. The plate is 0.5mm polycarbonate, the adhesive is double-sided tape, and the light spot is a circle with a diameter of 4mm. PDV test results show that the ejection speed can reach 950m / s, and this process has excellent ejection performance.

Embodiment 3

[0034] A laser-loaded array ejection method is characterized in that it includes two parts: a module to be ejected and laser loading: 1. Preparation of a module to be ejected composed of objects to be ejected that are distributed in an array on a light-transmitting backplane; The single pulse laser of the short pulse laser is loaded on the ejection system of the coating. The other parameters are that the single pulse energy of the laser is about 3J. The object to be ejected is a pure aluminum sheet with a thickness of 25 μm. The plate is 0.5mm polycarbonate, the adhesive is double-sided tape, and the light spot is a circle with a diameter of 6mm. PDV test results show that the ejection speed can reach 500m / s, and this process has excellent ejection performance.

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Abstract

The invention discloses a laser-loaded array catapulting process method. The method comprises the steps of firstly, combining a whole to-be-catapulted object, an ablation coating, a binding agent anda light-transmitting back plate into a whole to obtain a catapulting module, compressing and emptying air between layers in the catapulting module, and then cutting the whole to-be-catapulted object on the catapulting module into independent to-be-catapulted individuals through an automatic machining platform. When the catapult module is moved to a proper position of a laser light path, the size of laser spots and pulse energy is set according to needs, the laser is started to emit laser, the next catapulted object can be catapulted by the laser when the catapult module is moved every time, and thus continuous and automatic array catapulting can be achieved. According to the array catapulting method, plasma emission is excited through the laser ablation coating, so that the tiny sheet-shaped to-be-catapulted material is catapulted by means of the counter-acting force of the laser ablation coating, and the array catapulting method is not limited by the material; an excellent acceleration effect is achieved, and the speed can reach 1000m / s or above within 0.2 microsecond; and the method is simple in preparation process, low in cost, easy to automate, high in accuracy and high in safety.

Description

technical field [0001] The invention relates to the field of preparation of laser-driven flight and ejection components, in particular to an ejection method and an automatic process for ultra-thin plate micro-components. Background technique [0002] In today's era of rapid development of various industries, catapult has become an indispensable means and process in various industries such as aerospace, aircraft take-off, microelectronics, precision machinery manufacturing and processing, and basic research on material physics. However, due to the limitations of the ejection components themselves, their ejection capabilities are specific and difficult to use in common use. The laser-loaded ejection has the following characteristics: microstructure, high speed, precise positioning, and easy operation. In the field of microelectronics, laser ejection can be applied to micro-connections. Especially for precipitation-strengthened alloys, such as aluminum-lithium alloys; in the ...

Claims

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Application Information

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IPC IPC(8): B64F1/06
CPCB64F1/06
Inventor 王慧敏王康年童志周洪宇郑文跃许爱军
Owner UNIV OF SCI & TECH BEIJING
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