Electroplating activating agent and preparation method thereof

An activator and surfactant technology, applied in the field of electroplating activator and its preparation, can solve the problems of surface damage of plated parts, affecting operation, etc., and achieve the effect of good hydrophilicity

Inactive Publication Date: 2020-08-28
惠州市腾达宇科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the electroplating activator can effectively remove the oxide film on the surface of the plated pa

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] An electroplating activator comprises 45 parts by weight of organic acids, 2.5 parts by weight of inorganic acids, 1 part by weight of surfactants, 1 part by weight of additives, 1 part by weight of polyamides, and 0.6 parts by weight of parts of ethers.

[0022] Among them, the organic acid is citric acid.

[0023] Wherein, the inorganic acid is hydrochloric acid.

[0024] Wherein, surfactant comprises polyethylene glycol.

[0025] Among them, the additive is benzene.

[0026] Among them, the polyamide-based substance is polyamide ether.

[0027] Wherein, the ether substance is polyether polyol.

[0028] According to above-mentioned formula, the preparation method of a kind of electroplating activator of the present invention is as follows:

[0029] Step 1: Add the organic acid to the reaction kettle A, start stirring, add the surfactant, after it is completely dissolved, slowly add the polyamide substance, and then add the additive until it is completely dissolve...

Embodiment 2

[0033] An electroplating activator comprises 80 parts by weight of organic acids, 0.5 parts by weight of inorganic acids, 0.1 parts by weight of surfactants, 0.1 parts by weight of additives, 0.1 parts by weight of polyamides, and 0.2 parts by weight of polyamides. parts of ethers.

[0034] Among them, the organic acid is oxalic acid.

[0035] Among them, the inorganic acid is sulfuric acid.

[0036] Wherein, the surfactant includes sodium 2-ethylhexylsulfonate.

[0037] Wherein, the additive is xylene.

[0038] Wherein, the polyamide substance is sodium polyamide.

[0039] Wherein, the ether substance is polyether polyol.

[0040] According to above-mentioned formula, the preparation method of a kind of electroplating activator of the present invention is as follows:

[0041] Step 1: Add the organic acid to the reaction kettle A, start stirring, add the surfactant, after it is completely dissolved, slowly add the polyamide substance, and then add the additive until it is...

Embodiment 3

[0045] An electroplating activator comprises 10 parts by weight of organic acids, 5 parts by weight of inorganic acids, 2 parts by weight of surfactants, 2 parts by weight of additives, 2 parts by weight of polyamides, and 1 parts by weight of polyamides. parts of ethers.

[0046] Among them, the organic acid is acetic acid.

[0047] Among them, the inorganic acid is hydrofluoric acid.

[0048] Wherein, the surfactant includes sodium 2-ethylhexylsulfonate.

[0049] Among them, the additives are choline chloride and cerium chloride.

[0050] Wherein, the polyamide substance is potassium polyamide.

[0051] Among them, the ethers are polyamide ethers.

[0052] According to above-mentioned formula, the preparation method of a kind of electroplating activator of the present invention is as follows:

[0053] Step 1: Add the organic acid to the reaction kettle A, start stirring, add the surfactant, after it is completely dissolved, slowly add the polyamide substance, and then a...

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PUM

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Abstract

The invention belongs to the field of metal surface cleaning, and particularly discloses an electroplating activating agent and a preparation method of the electroplating activating agent. The electroplating activating agent comprises, by weight, 10-80 parts of organic acid, 0.5-5 parts of inorganic acid, 0.1-2 parts of surfactants, 0.1-2 parts of additives, 0.1-2 parts of polyamide substances and0.2-1 part of ether substance. The combination of the organic acid and the inorganic acid can effectively remove an oxide film of a plated part. The polyamide substances including polyamide ether, polyamide sodium and polyamide potassium contain amido bonds, the amido bonds are functional groups with electronegativity and have the good hydrophilicity, and stains on the surface of the plated partcan be effectively removed. The ether substances including polyether polyol, halogenated ether and polyamide ether contain ether bonds, and the ether bonds are polar groups, and the adhesion effect isfacilitated.

Description

technical field [0001] The invention belongs to the field of metal surface cleaning, in particular to an electroplating activator and a preparation method thereof. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the appearance. [0003] Electroplating activator generally refers to the process of eroding the plated parts by acid or alkali solution to dissolve the oxide film on the surface to expose the active metal interface, so as to ensure the bonding force between the electroplating layer and the substrate. [0004] In the prior art, the electroplating acti...

Claims

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Application Information

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IPC IPC(8): C25D5/34C23G1/02
CPCC25D5/34C23G1/02
Inventor 张勇杨磊
Owner 惠州市腾达宇科技有限公司
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