A silver-platinum bonding wire utilizing silver-platinum coating and its preparation process

Abstract

The invention belongs to the technical field of alloy wire materials, and in particular relates to a silver-platinum bonding wire with silver-platinum coating and a preparation process thereof. The composition of the silver-platinum bonding wire includes silver, platinum, tin, manganese and indium; the silver-platinum bonding wire formed by combining metal silver with a higher content of metal platinum can meet the requirements for thrust, tension, mechanical In terms of strength and other requirements, it has better electrical and thermal conductivity and reliability than traditional pure alloy wires, optimizes the arc height, reduces the breakage rate, and meets the higher needs of customers; the high-quality silver-platinum bonding wire of the present invention The preparation process is simple and easy to operate, and the cost of raw materials and equipment used is lower than that of the existing technology. The adopted melting and casting, surface activation treatment and platinum-plated silver alloy metal layer are conducive to the formation of high tensile strength and ductility. High, arc-shaped and stable bonding wire, suitable for packaging in the microelectronics industry, in-line, SMD, high-power LED packaging, transistors, and IC packaging.

Description

technical field [0001] The invention belongs to the technical field of alloy wire materials, and in particular relates to a silver-platinum bonding wire with silver-platinum coating and a preparation process thereof. Background technique [0002] Bonding wire is one of the important semiconductor packaging materials. With the upgrading of electronic product technology, the semiconductor packaging industry has developed rapidly and its scale is constantly growing. The requirements for the performance of bonding wire materials are also increasing. The more stringent it is, the more it tends to develop in the form of high performance and low cost. [0003] The bonding wire material needs to have excellent chemical and physical properties. Its chemical properties include oxidation resistance, stability, electrical and thermal conductivity, and electrical conductivity. Its physical properties include tensile strength, breaking load, thrust, and tension, etc. , including the serv...

AI Technical Summary

Problems solved by technology

[0004] Most of the traditional technologies use metal gold as a bonding alloy material, but because of its relatively expensive price and its performance cannot keep up with the development of the application of bonding wire materials, new metal materials have been gradually developed to replace pure gold materials, and now In the existing technology, metal silver and metal copper are used as raw materials for bonding wires, and many other trace metal elements are also doped to meet different requirements for bonding wires.

[0005] In the prior art, most copper-based alloys are used as the base material, and the doped elements include zirconium, scandium, titanium and other elements, which can achieve the effect of enhancing the corrosion resistance of the alloy wire and improving the mechanical properties, but its price is relatively high. If the chemical properties are relatively stable, the corresponding preparation process will be more complicated, which is not conducive to popularization and application

Images