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Polycarboxylic acid resin containing unsaturated group, photosensitive resin composition, cured product, base material, and article

A technology of unsaturated polycarboxylic acid, which is applied in the field of photosensitive resin composition and polycarboxylic acid resin, can solve the problems that cannot be fully dealt with, and achieve the effect of excellent adhesion and excellent photosensitivity

Pending Publication Date: 2020-09-22
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When a printed wiring board is installed near an internal combustion engine or a battery mounted on a vehicle, etc., the cured coating film may be required to adhere to the printed wiring circuit board without cracking even after being left at a high temperature. The solder mask studied does not adequately address these requirements

Method used

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  • Polycarboxylic acid resin containing unsaturated group, photosensitive resin composition, cured product, base material, and article
  • Polycarboxylic acid resin containing unsaturated group, photosensitive resin composition, cured product, base material, and article
  • Polycarboxylic acid resin containing unsaturated group, photosensitive resin composition, cured product, base material, and article

Examples

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Embodiment

[0100] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to a following Example.

Synthetic example 1

[0102] In a 1L flask with a stirring device and a reflux tube, 298.8 g of carbitol acetate as a reaction solvent, NC-3500 (Japan Manufactured by Kayaku Co., Ltd., softening point 71°C, epoxy equivalent 207g / eq.) 513.1g, acrylic acid (molecular weight: 72.06) which is a monocarboxylic acid compound (b) having one or more ethylenically unsaturated groups in the molecule 184.0 g, 2.1 g of 2,6-di-tert-butyl-p-cresol as a thermal polymerization inhibitor, and 2.1 g of triphenylphosphine as a reaction catalyst were reacted at a temperature of 120°C until the acid value of the reaction liquid became 3 mg·KOH / g or less, a solution of the reactive epoxy carboxylate compound (R) was obtained. Let this resin solution be A-1. The reaction time at this time was 10 hours.

Synthetic example 2

[0104] In a 1L flask with a stirring device and a reflux tube, 298.8 g of carbitol acetate as a reaction medium, NC-6000 (Japan Manufactured by Kayaku Co., Ltd., softening point 71°C, epoxy equivalent 208 / eq.) 513.7g, acrylic acid (molecular weight: 72.06) which is a monocarboxylic acid compound (b) having one or more ethylenically unsaturated groups in the molecule 183.3 g, 2.1 g of 2,6-di-tert-butyl-p-cresol as a thermal polymerization inhibitor, and 2.1 g of triphenylphosphine as a reaction catalyst were reacted at a temperature of 120°C until the acid value of the reaction liquid became 3 mg·KOH / g or less, a solution of the reactive epoxy carboxylate compound (R) was obtained. Let this resin solution be A-2. The reaction time at this time was 17 hours.

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Abstract

The invention provides an unsaturated group-containing polycarboxylic acid resin, a photosensitive resin composition, a cured product, a base material, and an article. The polycarboxylic acid resin has excellent sensitivity to active energy rays, developability, heat resistance, and adhesion after high-temperature placement. A polycarboxylic acid resin (A) containing an unsaturated group is obtained by reacting a reaction product (R) of an epoxy compound (a) having two or more glycidyl groups in the molecule and a monocarboxylic acid compound (b) having one or more ethylenically unsaturated groups in the molecule with a polybasic acid anhydride (d) represented by formula (1). (In the formula, R represents a hydrogen atom or an alkyl group having 1-3 carbon atoms) [chemical formula 1].

Description

technical field [0001] The present invention relates to a polycarboxylic acid resin containing an unsaturated group, a photosensitive resin composition containing the polycarboxylic acid resin containing an unsaturated group, a cured product, a base material and an article. Background technique [0002] Printed wiring boards require high precision and high density in order to reduce the size and weight of portable devices and improve communication speeds. Along with this, there is an increasing demand for solder resist coating the circuit itself. Compared with the previous requirements, it is required to maintain heat resistance and thermal stability, while maintaining the performance of substrate adhesion, high insulation, and electroless gold plating, and a film with stronger hardened properties is required. Forming materials. [0003] As these materials, carboxylate compounds obtained by reacting carboxylic acid, a compound having a hydroxyl group, and acrylic acid with ...

Claims

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Application Information

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IPC IPC(8): C08G59/17G03F7/004H05K3/28
CPCC08G59/1466G03F7/004H05K3/287H05K3/282C08G59/1461C08G59/245C08G59/32C09D163/00H05K3/28
Inventor 加贺大树山本和义内藤伸彦锷本麻衣
Owner NIPPON KAYAKU CO LTD
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