Conductive non-woven fabric adhesive tape and manufacturing method thereof

Abstract

The invention relates to a conductive non-woven fabric adhesive tape and a manufacturing method thereof. The conductive non-woven fabric adhesive tape comprises a base material layer, and an evaporation layer, a cold spraying metal deposition layer, a heterogeneous conductive adhesive layer and a release film layer which are sequentially distributed on one side or two sides of the base material layer in a laminated manner, the manufacturing method comprises the following steps: (1) selecting the non-woven fabric with the thickness of 10-100 microns as the base material layer; (2) plating an evaporation layer on one surface or two surfaces of the base material layer by using a vacuum magnetron sputtering evaporation method; (3) spraying and depositing a continuous conductive cold spraying metal deposition layer on the other surface of the evaporation layer by taking the evaporated non-woven fabric as a second base material and utilizing a metal cold spraying technology; and (4) taking the conductive non-woven fabric treated by the metal cold spraying technology as a third base material, coating the surface of the cold spraying metal deposition layer with a layer of heterogeneous conductive adhesive, namely a heterogeneous conductive adhesive layer, through a coating process, and covering the heterogeneous conductive adhesive layer with a release film during winding to form a release film layer for protection. The conductive non-woven fabric adhesive tape is excellent in performance, and the preparation process is relatively environment-friendly.

Description

technical field [0001] The invention relates to a conductive non-woven tape and a manufacturing method thereof, in particular to a conductive non-woven tape based on a combination of metal cold spray technology and magnetron sputtering evaporation technology and a manufacturing method thereof. Background technique [0002] With the rapid development of the electronic age, various new materials emerge in an endless stream. Among them, non-conductive polymer materials and inorganic materials are widely used as special-purpose materials for electronic products through various technical means to make them conductive: Such as conductive foam, conductive cloth, etc.; on the one hand, the base material of these materials has the advantages of superior cushioning performance, flexibility, foldability, wear resistance, no trace after friction, and IC protection; on the other hand, it has conductivity. It plays the role of circuit connection and electromagnetic shielding; so this kind...

AI Technical Summary

Problems solved by technology

The metal deposition layer of the conductive non-woven fabric in this process is generally more than 5um in thickness, which has good conductivity and shielding performance; however, its production process is not environmentally friendly, and different metal plating layers require different chemicals. , relatively cumbersome, and the reaction deposition process itself is relatively slow, low in efficiency, and usually not continuous

The second is to use magnetron sputtering technology to deposit a conductive layer with a nanometer thickness, and then use it as a substrate to coat a heterogeneous conductive adhesive; this process is more environmentally friendly, but because the metal coating is relatively thin, the resistance The rate is high, the effect in this respect is not as good as chemical plating, and the application is limited to a certain extent

The third process is to use the printing process to print a layer of metal conductive layer on the base cloth, usually silver paste printing; this process also has the problem that the process is not environmentally friendly, and at the same time; the cost is also high, and imported silver paste is used The cost is high; because the conductive layer prepared by this process actually contains a certain amount of binder components, the resistivity is too large, and the resistivity will be even greater after the heterogeneous conductive adhesive is coated, which limits its application

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