Heat dissipation element, preparation method thereof and IGBT module

A heat dissipation element and module technology, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve problems such as low bonding force, poor heat transfer performance of aluminum columns, and difficulty in meeting product use requirements

Active Publication Date: 2020-10-09
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the bonding force between the aluminum column and aluminum silicon carbide is low, it is difficult to meet the use requirements of the product, and the heat transfer performance of the aluminum column is poor

Method used

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  • Heat dissipation element, preparation method thereof and IGBT module
  • Heat dissipation element, preparation method thereof and IGBT module
  • Heat dissipation element, preparation method thereof and IGBT module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] A copper column with a diameter of 4.18mm and an axis height of 8mm is subjected to nickel plating at 85°C to obtain a copper column with a nickel-plated layer, and the nickel-plated layer on one end surface (ie, the second surface) of the copper column is polished by sandpaper. Remove, obtain the copper post with the first nickel-plated layer 4 (such as Figure 8), the thickness of the first nickel plating layer is 8 μm.

[0077] At 80°C, use an alkaline chemical cleaning agent consisting of sodium hydroxide (concentration: 15g / L), sodium carbonate (concentration: 20g / L) and sodium phosphate (concentration: 10g / L) The second surface of the nickel-plated copper pillar was ultrasonically cleaned for 15 minutes, then rinsed with water, and then rinsed with a sulfuric acid solution with a concentration of 5% by weight for 5 minutes to remove the oxide layer on the surface of the copper pillar. Then at 30° C., an ethanol solution containing benzotriazole (concentration of ...

Embodiment 2

[0081] Prepare the cooling element according to the method of Example 1, the difference is that the alkaline chemical cleaning agent is composed of sodium hydroxide (concentration is 10g / L), sodium carbonate (concentration is 15g / L) and sodium phosphate (concentration is 15g / L) , copper protective agent is the ethanol solution containing benzotriazole (concentration is 0.5g / L).

Embodiment 3

[0083] Prepare the cooling element according to the method of Example 1, the difference is that the alkaline chemical cleaning agent consists of sodium hydroxide (concentration is 15g / L), sodium carbonate (concentration is 20g / L) and sodium lauryl sulfate (concentration is 10g / L), the copper protective agent is a self-made protective agent containing 15% by weight of amines, 20% by weight of alcohols and 20% by weight of nonionic surfactant BCu-10.

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Abstract

The invention relates to a heat dissipation element, a preparation method thereof and an IGBT module. The heat dissipation element comprises an aluminum silicon carbide substrate (1) and a copper column (3) connected to the aluminum silicon carbide substrate (1) through a welding layer (2), and the copper column (3) is provided with a first surface which is not connected with the welding layer (2)and a second surface which is connected with the welding layer (2); a first nickel plating layer (4) is arranged on the first surface; a second nickel plating layer (5) is arranged on the surface ofthe aluminum silicon carbide substrate (1); the bonding force between the copper pillar (3) and the aluminum silicon carbide substrate (1) is 9-33 N/mm2 on the basis of the surface area of the secondsurface of the copper pillar (3), and the oxide content of the second surface of the copper pillar (3) is 0.05-0.18 g/m2 on the basis of the total surface area of the copper pillar (3). The heat dissipation element disclosed by the invention has relatively high strength and better heat dissipation performance.

Description

technical field [0001] The disclosure relates to a heat dissipation element, a preparation method thereof, and an IGBT module. Background technique [0002] Aluminum silicon carbide (AlSiC) is a particle-reinforced metal-matrix composite material. It uses Al alloy as the matrix. According to the design requirements, SiC particles are used as reinforcements in a certain form, proportion and distribution state to form a multi-phase composite material with obvious interfaces. , with comprehensive superior performance that a single metal does not have, it is widely used in the field of packaging heat dissipation materials such as aerospace, microwave integrated circuits, power modules, and military radio frequency system chips. [0003] Chinese invention patent application CN201510638985.5 discloses a method for preparing an aluminum silicon carbide plate with an aluminum column, mainly by pressing the front of the aluminum casting into the molding sand, heating the aluminum cas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373C23G1/20
CPCH01L23/367H01L23/3736C23G1/20
Inventor 潘力争唐柳平王亚楠张登超赵树明
Owner BYD CO LTD
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