Resin composition, adhesive and flexible copper clad laminate
A technology of resin composition and mixture, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem that polyimide copper clad laminate is difficult to meet the requirements of 5G high-frequency/high-speed wireless transmission, and achieve firm adhesion The effect of increasing the thickness of the junction and dielectric layer
Active Publication Date: 2022-05-20
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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Problems solved by technology
[0008] The main purpose of the present invention is to provide a resin composition, an adhesive and a flexible copper-clad laminate to solve the problem that polyimide copper-clad laminates in the prior art are difficult to meet the high-frequency / high-speed wireless transmission requirements of 5G
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preparation example Construction
[0042] Preparation process of adhesive:
[0043] First, fluorine resins (such as various fluororesins: perfluoroalkoxy polymer (EA-2000, ASAHI Glass) :D 50 = 2 ~ 3 μm; polytetrafluoroethylene (YA-4, Admatechs) :D 50 = 1.5 ~ 3 μm; poly perfluoroethylene vinyl polymer (2801-00, ÅMAR) :D 50 = 3 ~ 5 μm) need to be dissolved in the solvent, stirred at high speed (4000 ~ 5000rpm) for 1 hour, Fluorine resin dispersion can be obtained. In addition, the curing agent, flame retardant and curing accelerator dissolved in the solvent, stirred and mixed, mixing time of about 1.5 hours, followed by the addition of low dielectric / low loss epoxy resin, and then added to the dispersed fluorine resin dispersion, stirred and mixed for 3 hours, you can get the adhesive, the viscosity of the prepared adhesive is controlled at 800 ~ 1200cps, and the final solidity is about 50%.
[0044] According to the above process to prepare the adhesive of each embodiment and comparative example, the adhesive compos...
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Abstract
The invention provides a resin composition, an adhesive and a flexible copper clad board. In terms of weight percentage, the resin composition includes: 35-45% of epoxy resin, and the epoxy resin is selected from any one of dicyclopentadiene novolac epoxy resin, biphenyl epoxy resin and naphthalene ring epoxy resin 1-3.5% curing agent; 25-35% toughening agent; 15-25% fluororesin; 10-20% flame retardant; and 1-3% curing accelerator. When the components of the above resin composition are mixed and used as an adhesive in a flexible copper-clad laminate, it can achieve firm bonding to polyimide and other low-dielectric and low-loss films, and then can be used in polyimide On the film, other low-dielectric and low-loss films that have a small difference in thermal expansion coefficient from the copper foil can increase the thickness of the dielectric layer on the copper foil, so that the formed flexible copper-clad laminate can meet 5G high-frequency, high-speed wireless Transmission requirements.
Description
Technical field [0001] The present invention relates to the field of flexible circuit board technology, in particular, to a resin composition, an adhesive and a flexible copper clad laminate. Background [0002] In recent years, with the increasing functional integration of terminal application products, the reaction speed must become faster and faster, and the trend of high frequency / high speed of flex boards has become more and more important. Because the high dielectric constant (Dk) will slow down the signal transmission speed, and the high dielectric loss (Df) will convert the signal part into thermal energy loss in the substrate material, it has become a trend to reduce the material Dk / Df, and various new technologies and new materials with low Dk / Df have emerged. [0003] In response to these material requirements, as a flexible printed circuit board (FPC) substrate film, has been proposed with low dielectric properties of liquid crystal polymer (LCP), syntactic polystyren...
Claims
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IPC IPC(8): C08L27/18C08L63/00C08L9/02C08K3/22C08K5/5313C09J127/18C09J163/00C09J109/02C09J11/04C09J11/06B32B7/12B32B15/08B32B15/20B32B27/08B32B27/28B32B27/38B32B33/00
CPCC08L27/18C08L63/00C08L9/02C09J127/18C09J163/00C09J109/02C09J11/04C09J11/06B32B15/20B32B15/08B32B7/12B32B27/08B32B27/281B32B27/38B32B33/00B32B2307/20C08L2205/03C08L2205/025C08L2205/035C08L2203/20C08K2003/2227C08K3/22C08K5/5313Y02E10/50
Inventor 黄黎明周慧宋赣军周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD