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A method for treating waste containing abrasive particles

A technology for abrasive particles and waste, applied in the field of processing waste containing abrasive particles, can solve problems such as waste, and achieve the effects of improving utilization rate, increasing surface activity and dispersing ability, and efficiently recycling

Active Publication Date: 2022-05-20
LUOYANG CSI PHOTOVOLTAIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to actual investigations, the cost of diamond micropowder accounts for 30%-40% of the production cost of diamond wire at present, and the direct utilization rate of diamond micropowder in production is generally 50%-60%, and there is a lot of waste. Therefore, the recycling of diamond micropowder has become a key factor restricting cost

Method used

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  • A method for treating waste containing abrasive particles
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] A method of processing abrasive-containing waste, the method comprising the steps of:

[0062] S1 Every 7 days, the upper sand waste slurry (which includes diamond micropowder) is taken from the upper sand tank, which is a waste solution containing abrasive grains, and the abrasive grains are used to fix the wire saw surface to prepare diamond wire saws. Put it into a container for sedimentation, let it settle for 1 hour, then pour out the upper liquid, add water three times its volume to the residue, and stir at a speed of 600r / min for 5 minutes to obtain a mixed solution;

[0063] The minimum particle size of the diamond micropowder used for sanding in the described upper sand tank is 6 μm, and the maximum particle size is 14 μm. The electroplating conditions carried out in the described upper sand tank are: the main salt of the plating solution is nickel sulfamate, and the secondary salt is Nickel chloride, temperature 55°C, use sulfamic acid to adjust pH to 4.5;

...

Embodiment 2

[0069] A method for reclaiming diamond micropowder from waste materials prepared by electroplating for diamond wire saws, characterized in that the method comprises the following steps:

[0070] S1 Every 10 days, take the sand waste slurry (which contains diamond micropowder) from the sand tank, put it into a container for settlement before use, and settle it for 0.5 hours, then pour out the upper liquid and pour it into the remainder. Water with 5 times its volume was stirred at a speed of 500r / min for 8 minutes to obtain a mixed solution;

[0071] The minimum particle size of the diamond micropowder used for sanding in the described upper sand tank is 6 μm, and the maximum particle size is 14 μm. The electroplating conditions carried out in the described upper sand tank are: the main salt of the plating solution is nickel sulfamate, and the secondary salt is Nickel chloride, temperature 50°C, use sulfamic acid to adjust pH to 4;

[0072] S2 adopts the method of filtering fo...

Embodiment 3

[0081] A method of processing abrasive-containing waste, the method comprising the steps of:

[0082] S1 Every 8 days, the upper sand waste slurry (which includes diamond micropowder) is taken from the upper sand tank, which is a waste solution containing abrasive grains, and the abrasive grains are used to fix the wire saw surface to prepare diamond wire saws. Put it in a container for sedimentation, and settle it statically for 0.8 hours, then pour out the upper layer liquid, add water 4 times its volume to the residue, and stir at a speed of 550r / min for 10 minutes to obtain a mixed solution;

[0083] The minimum particle size of the diamond micropowder used for sanding in the described upper sand tank is 6 μm, and the maximum particle size is 14 μm. The electroplating conditions carried out in the described upper sand tank are: the main salt of the plating solution is nickel sulfamate, and the secondary salt is Nickel chloride, temperature 60°C, use sulfamic acid to adjust...

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Abstract

The invention discloses a method for treating waste material containing abrasive grains, which comprises: obtaining a waste material solution containing abrasive grains, and the abrasive grains are used to fix the surface of a wire saw; using a filter to filter out first impurities in the waste material solution to obtain The first abrasive particle solution, the average particle diameter of the first impurity is greater than the average particle diameter of the abrasive particles; ultrasonic treatment is performed on the first abrasive particle solution to peel off the second impurity on the surface of the abrasive particles, and the first abrasive particle solution The second impurity is removed from the first abrasive solution to obtain a second abrasive solution; the abrasive particles in the second abrasive solution are subjected to surface active treatment with an active agent and the abrasive particles are extracted. The method of the invention can achieve the purpose of purifying and optimizing the diamond surface state, so that the recovered diamond powder can be reused, the utilization rate can be improved, and the sanding ability and uniformity can be further improved.

Description

technical field [0001] The invention relates to the field of silicon wafer cutting, and relates to a method for treating waste materials containing abrasive grains. Background technique [0002] At present, for the silicon wafer cutting industry, due to the advantages of high efficiency, high output, and low cost of diamond wire, diamond wire cutting sheets are developing rapidly. Therefore, the main raw material diamond powder produced by electroplating diamond wire is also in short supply. [0003] Diamond micropowder is a very important raw material in the production process of electroplated diamond wire. The properties of diamond micropowder determine the final cutting performance of electroplated diamond wire. Therefore, the treatment of diamond micropowder is very important for the production of electroplated diamond wire. According to actual investigations, the cost of diamond micropowder accounts for 30%-40% of the production cost of diamond wire at present, and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B32/28C09K3/14
CPCC01B32/28C09K3/1409Y02P70/10
Inventor 张伟娜李飞龙张欢欢
Owner LUOYANG CSI PHOTOVOLTAIC TECH CO LTD
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