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A kind of organic high temperature resistant encapsulant and preparation method thereof

A technology of high temperature resistance and encapsulation adhesive, which is applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of easy cracking, poor stability, and difficulty in meeting the requirements of encapsulation, and achieve improved adhesion Excellent bonding strength, easy industrial production, and improved packaging effect

Active Publication Date: 2022-05-17
宁波有航新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent application CN104710796A discloses a silicone packaging silicone composition for packaging. Although the packaging silicone composition has good light transmittance and thermal shock resistance, the hydrogen-containing silicone oil, vinyl silicone oil and vinyl silicone oil used The polymer composed of MQ resin is easy to crack at a high temperature of 250°C, and its stability is not good, so it is difficult to meet the requirements of packaging.

Method used

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  • A kind of organic high temperature resistant encapsulant and preparation method thereof
  • A kind of organic high temperature resistant encapsulant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1), the attapulgite clay powder is modified and mixed with the nano-zirconia powder in a mass ratio of 100:15 to prepare a composite powder;

[0028] (2), take 5 parts of silane coupling agent by weight and put it in the beaker, pour 9 parts of absolute ethanol into the stirrer, then add 3 parts of formic acid as a catalyst, adjust the pH value to 9, and use an electric mixer Stir for 3 hours at a stirring speed of 350 r / min. After the phases are uniformly mixed, seal the solution, oscillate in an ultrasonic cleaning agent for 3 hours, and finally place it in a 50°C water bath to react to a gel, and add it to the gel. 40 parts of tetrahydrofuran (THF) was dissolved, added 20 parts of modified silicone resin, put into a magnetic stirrer and stirred at a speed of 200r / min for 1-3h, set aside;

[0029] (3), put 7.5 parts of the composite powder prepared in step (1) into the mixing system of step (2), add 5 parts of active agent, fully stir with a cross-blade stirrer, and ...

Embodiment 2

[0032] (1), the attapulgite clay powder is modified and mixed with the nano-zirconia powder in a mass ratio of 100:20 to prepare a composite powder;

[0033] (2), take 8 parts of silane coupling agent by weight and put it in the beaker, pour 10 parts of absolute ethanol into the stirrer, then add 2 parts of formic acid as a catalyst, adjust the pH value to 9, and use an electric mixer Stir for 4 hours at a stirring speed of 400 r / min. After the phases are uniformly mixed, the solution is sealed, ultrasonically shaken in an ultrasonic cleaning agent for 1 hour, and finally placed in a 50 °C water bath to react to a gel, and added to the gel. 40 parts of tetrahydrofuran (THF) was dissolved, added 20 parts of modified silicone resin, put into a magnetic stirrer and stirred at a speed of 250r / min for 1h, set aside for use;

[0034] (3), put 5 parts of the composite powder prepared in step (1) into the mixing system of step (2), add 2 parts of active agent, fully stir with a cross ...

Embodiment 3

[0037] (1), the attapulgite clay powder is modified and mixed with the nano-zirconia powder in a mass ratio of 100:20 to prepare a composite powder;

[0038] (2), take 6 parts of silane coupling agent by weight and put it in the beaker, pour 8 parts of absolute ethanol into the stirrer, add 2 parts of formic acid as a catalyst, adjust the pH value to 9, and use electric The mixer was stirred for 4 hours, and the stirring speed was 350 r / min. After the phases were uniformly mixed, the solution was sealed, and ultrasonically oscillated in an ultrasonic cleaning agent for 1 hour. Finally, it was placed in a 50 °C water bath to react to a gel. Add 45 parts of tetrahydrofuran (THF) to dissolve it, add 20 parts of modified silicone resin, put it into a magnetic stirrer and stir at a speed of 250r / min for 1h, set aside;

[0039] (3), put 5 parts of the composite powder prepared in step (1) into the mixing system of step (2), add 2 parts of active agent, fully stir with a cross-blade ...

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Abstract

The invention discloses an organic high-temperature-resistant encapsulant and a preparation method thereof, which are prepared from raw materials in the following weight proportions: high-temperature-resistant filler 5-10wt%, active agent 2-5wt%, and modified silicone resin 20-25wt% %, silane coupling agent 5%~10wt%, catalyst 1%~3wt%, curing agent 10%~15wt%, absolute ethanol 5%~10wt%, defoamer 0.5~1wt%, thinner 40%~45wt% %. The invention realizes high temperature resistance without affecting the overall bonding performance by rationally selecting each component and seeking the best ratio, thereby achieving the goals of high temperature resistance and enhancing bonding quality, and effectively improving the packaging effect of electronic products.

Description

technical field [0001] The invention belongs to the technical field of encapsulation, and in particular relates to an organic high-temperature-resistant encapsulant and a preparation method thereof. Background technique [0002] With the increasing maturity of electronic technology, the market has put forward higher requirements for the cracking resistance and yellowing resistance of the encapsulant at high temperature. The heat-resistant temperature of ordinary silicone encapsulant in the air is generally around 230 °C, and when the temperature exceeds 250 °C, it will quickly become brittle and break. Chinese patent application CN104710796A discloses a silicone encapsulation silicone composition for encapsulation. Although the encapsulated silicone composition has good light transmittance and thermal shock resistance, the used hydrogen-containing silicone oil, vinyl silicone oil and vinyl The polymer composed of MQ resin is easy to crack at a high temperature of 250 ° C, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J161/06C09J11/04C09J11/06
CPCC09J183/04C09J161/06C09J11/04C09J11/06C08K2201/011C08K2003/2244C08L2201/08C08L2203/206C08L61/06C08K9/00C08K9/06C08K3/346C08K3/22C08K5/14C08L83/04Y02E10/50
Inventor 姚义俊董雅凤陈一琛张宇豪王彦
Owner 宁波有航新材料有限公司
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