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Thin film and preparation method thereof

A thin film and metal thin film technology, which is applied in the field of thin film and its preparation, can solve the problem that the thickness of the shielding cover cannot meet the demand, etc.

Pending Publication Date: 2021-01-05
SHENZHEN FRD SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Nowadays, with the development of science and technology, electronic equipment is gradually thinner and thinner, and the traditional shielding cover cannot meet the demand due to its thickness

Method used

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  • Thin film and preparation method thereof
  • Thin film and preparation method thereof
  • Thin film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] 1. Mix 5g of polyolefin and 5g of paraffin in a planetary mixer and mix evenly, then add 5μm aluminum powder and 1um aluminum powder in a weight ratio of 7:3 to a total of 80g, add xylene solvent to dilute, mix and stir for 15min, and then add evenly The joint agent was 0.4g, and after stirring for 15 minutes, a phase-change thermally conductive slurry was obtained. Position and coat the phase-change heat-conducting paste on the corresponding position of the copper foil 4, the heat-conducting paste is coated in a square of 15 mm, and the copper foil 4 is in a square of 30 mm to obtain a semi-finished product a. For details, refer to image 3 , shows a schematic structural view of a film semi-finished product a provided by an embodiment of the present application.

[0055] The formula of the phase change thermally conductive paste is: 5g of polyolefin, 5g of paraffin, 0.4g of coupling agent, 56g of aluminum powder with a particle size of 5um, 24g of aluminum powder with ...

Embodiment 2

[0060] 1. Mix 5g of polyolefin and 5g of paraffin in a planetary mixer and mix evenly, then add 5μm alumina powder and 1um alumina powder in a weight ratio of 7:3 to a total of 80g, add xylene solvent to dilute, mix and stir for 15min, and then Add 0.4 g of coupling agent and stir for 15 minutes to obtain a phase change thermally conductive slurry. Positionally coat the phase-change heat-conducting paste on the corresponding position of the copper foil 4, the heat-conducting paste is coated in a square of 15 mm, and the copper foil 4 is in a square of 30 mm to obtain a semi-finished product a.

[0061] The formula of the phase change thermally conductive slurry is: 5g of polyolefin, 5g of paraffin, 0.4g of coupling agent, 56g of alumina powder with a particle size of 5um, 24g of alumina powder with a particle size of 1um, and 9.6g of xylene.

[0062] 2. Die-cut the insulating tape 2 into a 26mm square, punch out a 15mm square in the center of the insulating tape 2, and paste i...

Embodiment 3

[0066] 1. Mix 5g of polyolefin and 5g of paraffin in a planetary mixer and mix evenly, then add 5μm aluminum powder and 1um aluminum powder in a weight ratio of 8:2, a total of 80g, add xylene solvent to dilute, mix and stir for 15min, and then add evenly The joint agent was 0.45g, and after stirring for 15 minutes, a phase-change thermally conductive slurry was obtained. Positionally coat the phase-change heat-conducting paste on the corresponding position of the copper foil 4, the heat-conducting paste is coated in a square of 15 mm, and the copper foil 4 is in a square of 30 mm to obtain a semi-finished product a.

[0067] The formula of the phase change thermally conductive paste is: 5g of polyolefin, 5g of paraffin, 0.45g of coupling agent, 72g of aluminum powder with a particle size of 5um, 8g of aluminum powder with a particle size of 1um, and 11g of xylene.

[0068] 2. Die-cut the insulating tape 2 into a 26mm square, punch out a 15mm square in the center of the insula...

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Abstract

The invention provides a thin film and a preparation method thereof. The thin film comprises a metal thin film layer, a conductive pressure-sensitive adhesive tape, a phase-change heat-conducting adhesive and an insulating adhesive tape, the conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive, conductive cloth, conductive filling powder, a crosslinking aid, a leveling agent, an anti-settling agent and a diluting solvent, the phase-change heat-conducting adhesive comprises paraffin, a high polymer material, heat-conducting filling powder, a coupling agent and thediluting solvent. An upper cover of a traditional shielding case is replaced by the thin film, the thickness can be reduced to 20 microns, the thin film becomes lighter and thinner, the copper foil is coated with the phase-change heat-conducting glue, so that the thin film has an excellent heat-conducting function, and the thin film has a shielding function.

Description

technical field [0001] The application relates to the field of chips, in particular to a thin film and a preparation method thereof. Background technique [0002] At present, electronic equipment has become an indispensable communication tool for people. The thinning and thinning of electronic equipment is an important direction of development. The thickness of electronic equipment is usually limited by the thickness of internal components of electronic equipment, so reducing the thickness of internal components of electronic equipment The thickness of the electronic equipment can be reduced, and the shielding case also becomes one of the components of the electronic equipment to be optimized. [0003] Traditional chip shields are mostly made of stainless steel or nickel-nickel copper to form an integrated shield. In actual use, silicon grease is first applied to the chip, and then the shield is fastened. The existing shielding structure includes a microelectronic chip devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J7/38C09J9/02C09J123/02C09J191/06C09J11/04C09J183/04C09J11/08
CPCC09J7/29C09J7/38C09J9/02C09J123/02C09J191/06C09J11/04C09J183/04C09J11/08C09J2203/326C09J2400/163C09J2400/283C09J2483/00C08K2201/014C08K2003/0812C08K2003/0806C08K2003/2227C08L2205/03C08L2205/025C08L91/06C08K3/08C08K3/22C08L23/02C08L83/04
Inventor 麻海波王海旭郭参陈军
Owner SHENZHEN FRD SCI & TECH
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