A Surface Treatment Method of Ultrathin Polymer

A surface treatment and polymer technology, applied in the field of ion beam coating, can solve the problems of limiting the wide application of ultra-thin polymers, difficult to achieve copper cladding treatment, low surface bonding strength, etc., to achieve a balance between surface resistivity, low cost, The effect of enhanced peel strength

Active Publication Date: 2021-05-07
廖斌 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The polymer thickness of the conventional polymer surface treatment is 12.5-100 microns, and the thickness of the copper foil is greater than 9 microns during the copper cladding treatment. This is because the commonly used surface treatment, such as plasma, mechanical pressing, etc. Low, resulting in low surface bonding strength; it is difficult to achieve copper clad treatment for ultra-thin polymers, especially below 5 microns, which greatly limits the further widespread application of ultra-thin polymers

Method used

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  • A Surface Treatment Method of Ultrathin Polymer
  • A Surface Treatment Method of Ultrathin Polymer
  • A Surface Treatment Method of Ultrathin Polymer

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as figure 1 , figure 2 as shown,

[0038] A surface treatment method for ultra-thin polymers, carried out in a vacuum chamber, the pressure in the vacuum chamber is 2×10 - 2 Pa, the air pressure fluctuation range does not exceed 5%. The surface treatment method includes fixing the polymer film on the unwinding shaft, and moving the polymer film to the cooling roll under the action of the guide roller for ion beam surface treatment. After the surface treatment, it continues to move to the winding shaft under the action of the guide roller ; The electric field strength between the cold roller and the vacuum chamber wall is not lower than 250V / m; the magnetron system includes twin target magnetron sputtering, and its magnetic field strength is 50mT. The thickness of the polymer film is less than 5 microns, and the ion beam surface treatment is performed twice.

[0039] The device for ion beam surface treatment includes an ion source system, an arc system, and a ...

Embodiment 2

[0044] Compared with embodiment 1, the difference is as follows:

[0045] The linear distance between the gas ion source and the center of the arc cathode surface is 320 mm, and the angle between the line and the vertical is 40 degrees; the gas ion source is 100 mm away from the surface of the cold roll, and the center of the gas ion source is 40 mm lower than the center of the cold roll; the magnetic control system The distance between the center and the surface of the cold roll is 60mm, and the linear distance from the center of the arc cathode surface is 350mm;

[0046] S1: The polymer film is treated with a gas ion source before copper is deposited on the surface, the air intake is 200sccm, the Penning source voltage is 20KV, and the gas ion beam current is 500mA;

[0047] S2: The starting current of the arc deposition in the arc system is 30A, and the current is 0.1-1A; the magnetron sputtering current in the magnetron system is 0.1-2A. The electric field strength betwee...

Embodiment 3

[0049] Compared with embodiment 1, the difference is as follows:

[0050] The linear distance between the gas ion source and the center of the arc cathode surface is 310 mm, and the angle between the line and the vertical is 38 degrees; the gas ion source is 80 mm away from the surface of the cold roll, and the center of the gas ion source is 35 mm lower than the center of the cold roll; the magnetic control system The distance between the center and the surface of the cold roll is 55mm, and the linear distance from the center of the arc cathode surface is 330mm;

[0051] S1: The polymer film is treated with a gas ion source before copper is deposited on the surface, the air intake is 200sccm, the Penning source voltage is 30KV, and the gas ion beam current is 500mA;

[0052] S2: The starting current of the arc deposition in the arc system is 30A, and the current is 0.1-1A; the magnetron sputtering current in the magnetron system is 0.1-2A. The electric field strength between...

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Abstract

The invention discloses a method for surface treatment of ultra-thin polymers, which is carried out in a vacuum chamber, including fixing the polymer film on an unwinding shaft, and moving the polymer film to a cold roll under the action of a guide roll for ion beam surface treatment , after the surface treatment, continue to move to the winding shaft under the action of the guide roller; the thickness of the polymer film is lower than 5 microns; the device for the ion beam surface treatment includes an ion source system, an arc system and a magnetron system, the surface During processing, the temperature of the polymer film is not higher than 50° C., and the processing sequence is gas ion source, electric arc and magnetron sputtering. The process of the present invention can be popularized on the surface treatment of any ultra-thin polymer, especially the metal film layer on the surface of the ultra-thin polymer that is not resistant to temperature. The equipment has a long service life and low cost, and can realize large-scale roll-to-roll production . Moreover, it can take into account the surface resistivity, surface roughness, water absorption and tensile properties of the polymer at the same time.

Description

technical field [0001] The invention belongs to the technical field of ion beam coating, and mainly relates to a surface treatment method of ultra-thin polymers. Background technique [0002] With the development of science and technology, polymers are more and more widely used in the field of science and technology, and their importance has become increasingly prominent. The polymer itself has very unique properties, such as excellent corrosion resistance, high and low temperature resistance, aging resistance, physical and chemical inertness, high insulation performance and so on. However, in many cases, the polymer itself is not used alone, it needs to be coupled with other metals, non-metals, metal oxides, etc.; Combined with interface strength applications. [0003] Magnetron sputtering is a type of physical vapor deposition (Physical Vapor Deposition, PVD). The general sputtering method can be used to prepare multiple materials such as metals, semiconductors, and ins...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/32C23C14/35C23C14/02C23C14/20
CPCC23C14/022C23C14/205C23C14/221C23C14/325C23C14/352
Inventor 廖斌陈琳王国梁罗军庞盼
Owner 廖斌
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