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Manufacturing method for improving tin plating on gold surface of blue gel plate

A production method and technology of blue glue, which are used in the manufacture of printed circuits, coating of non-metallic protective layers, secondary processing of printed circuits, etc., to achieve the effects of improving performance, solving tin on gold surfaces, and improving production quality

Pending Publication Date: 2021-01-15
DALIAN CHONGDA CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the existing technical defects, provide a kind of preparation method that improves tin on the gold surface of the blue glue board, by enlarging the size of blue glue and controlling reasonable baking time, can improve blue glue after solidification and gold The bonding performance between the surfaces solves the problem of tin on the gold surface and improves the production quality of PCB

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment provides a method for manufacturing a circuit board, and the specific process is as follows:

[0026] (1) Cutting: Cut out the core board according to the board size 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the outer layer of copper foil is 0.5OZ.

[0027] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the core board, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to 5-6 grids The exposure ruler (21-grid exposure ruler) completes the exposure of the inner layer circuit on the core board, and after development, the inner layer circuit pattern is formed on the core board; the inner layer is etched, and the inner layer circuit is etched out of the exposed and developed core board, and the inner layer The line width measurement is 3mil; the inner lay...

Embodiment 2

[0046] This embodiment provides a method for manufacturing a circuit board, and the specific process is as follows:

[0047] (1) Cutting: Cut out the core board according to the board size 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the outer layer of copper foil is 0.5OZ.

[0048] (2), drilling: according to the drilling data, use the mode of mechanical drilling to drill holes on the core plate, and the drilled holes include plug holes that need to be filled with resin.

[0049] (3) Copper sinking: A thin layer of copper is deposited on the hole wall by chemical reaction to metallize the hole on the core board. The backlight test is grade 10, and the thickness of the copper sinking in the hole is 0.5 μm.

[0050] (4) Full board electroplating: According to the principle of electrochemical reaction, a layer of copper is electroplated on the basis of sinking copper.

[0051] (5) Outer layer circuit production (negative film process): use a verti...

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Abstract

The invention discloses a manufacturing method for improving tin plating on a gold surface of a blue gel plate. The manufacturing method comprises the following steps: manufacturing a solder mask layer on a production plate; forming a nickel-gold layer on the copper surface of a part of bonding pads of the production plate through surface treatment; screen-printing a layer of blue gel covering thenickel-gold layer on the bonding pad on which the nickel-gold layer is formed, wherein the periphery of the blue gel extends to the surface of the solder mask layer; baking the production plate at 150 DEG C for 55 + / -5 minutes to cure the blue glue on the production plate; and then carrying out hot air leveling processing on the production plate so that tin layers are formed on the copper surfaces of the bonding pads without the nickel-gold layers in the production plate. According to the method, by increasing the size of the blue gel and controlling the reasonable baking time, the bonding performance between the cured blue gel and the gold surface can be improved, the problem of tin plating on the gold surface is solved, and the production quality of the PCB is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a production method for improving the tin on the gold surface of a blue plastic board. Background technique [0002] Blue glue is a blue sticky silk-like ink that uses screen printing. Its main advantage is that it can be easily peeled off by hand or tools without leaving residue on the substrate after printing. At present, in the PCB manufacturing process, the blue glue is roughly divided into two types: finished blue glue and process blue glue. The main function of the finished blue glue is to protect the secondary welding PAD, and the role of the process blue glue is to protect the PCB board during the PCB production process. . [0003] Hot air leveling, commonly known as tin spraying, is one of the surface treatment processes of circuit boards. Its working principle is to immerse the circuit boards to be made into tin pads into a molten tin furnace, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/22H05K3/34
CPCH05K3/28H05K3/227H05K3/3457
Inventor 黄国平孙淼郑威孙蓉蓉
Owner DALIAN CHONGDA CIRCUIT
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