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Sealant for water content measuring device

A measuring device and sealant technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems that electronic components cannot be bent and installed at will, the sealing surface is difficult to repair, and the elongation at break is low. Achieve the effect of excellent flexibility, high light transmittance and good fluidity

Inactive Publication Date: 2021-01-26
HEFEI JINGTE INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to avoid leakage during the measurement process, the electronic components in the measurement device must be potted with sealant. At present, epoxy resin is mostly used as the main component for the sealing of electronic components. The epoxy resin used for this purpose is usually Acid anhydrides are used as curing agents, and the curing reaction generally needs to be carried out above 100°C, which consumes more energy; although the cured product has good light transmittance and physical and chemical properties, it has high hardness, poor flexibility, and low elongation at break , the packaged electronic components cannot be bent and installed at will, and once the sealing surface is damaged, it will be difficult to repair

Method used

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  • Sealant for water content measuring device

Examples

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Effect test

Embodiment 1

[0031] This embodiment discloses a sealant for a water content measuring device, which is composed of two components, A component and B component, wherein the A component includes the following components in parts by weight: 40 parts of modified epoxy resin, 40 parts of polymer 10 parts of tetrafluoroethylene micropowder, 2 parts of diluent, 1 part of dispersant and 0.05 part of defoamer; the B component includes the following parts by weight: 5 parts of epoxy curing agent, 1 part of silane coupling agent, dehydration 1 part of UV absorber and 0.5 part of UV absorber.

[0032] In the present embodiment, the preparation method of the modified epoxy resin is as follows: react the epoxy resin and r-mercaptopropylmethyldimethoxysilane at normal temperature for 3-8 hours to obtain the first reaction product; Under protection, mix toluene diisocyanate and polytetramethylene ether glycol into the solvent dimethylformamide, raise the temperature to 70-80°C, and react for 2-3 hours to ...

Embodiment 2

[0050]The raw materials, preparation method and use method of this embodiment are basically the same as those of Example 1, except that: component A includes the following components in parts by weight: 60 parts of modified epoxy resin, 25 parts of polytetrafluoroethylene micropowder, 5 parts of thinner, 5.5 parts of dispersant and 0.27 parts of defoamer; the B component includes the following parts by weight: 10 parts of epoxy curing agent, 4 parts of silane coupling agent, 3 parts of dehydrating agent and ultraviolet absorber 1.25 servings.

Embodiment 3

[0052] The raw materials, preparation method and use method of this embodiment are basically the same as those of Example 1, except that: component A includes the following components in parts by weight: 80 parts of modified epoxy resin, 40 parts of polytetrafluoroethylene micropowder, 8 parts of diluent, 10 parts of dispersant and 0.5 part of defoamer; The B component includes the following parts by weight: 15 parts of epoxy curing agent, 7 parts of silane coupling agent, 5 parts of dehydrating agent and ultraviolet absorber 2 servings.

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Abstract

The invention belongs to the technical field of epoxy resin sealants, and particularly relates to a sealant for a water content measuring device. The sealant is composed of a component A and a component B. The component A comprises the following components in parts by weight: 40-80 parts of modified epoxy resin, 10-40 parts of polytetrafluoroethylene micropowder, 2-8 parts of a diluent, 1-10 partsof a dispersing agent and 0.05-0.5 part of a defoaming agent. The component B comprises the following components in parts by weight: 5-15 parts of an epoxy curing agent, 1-7 parts of a silane coupling agent, 1-5 parts of a dehydrating agent and 0.5-2 parts of an ultraviolet absorbent. According to the sealant, defects in the prior art are overcome, potting and curing can be performed under a roomtemperature condition, and the sealant is high in bonding strength, excellent in aging resistance, cracking resistance and flexibility and capable of being well applied to potting electronic components.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin sealants, and in particular relates to a sealant for water content measuring devices. Background technique [0002] The water content of crude oil is the main factor that directly affects the extraction, dehydration, gathering and transportation, metering, sales, and refining of crude oil. Therefore, it is required to detect the water content of crude oil in the process of crude oil production, storage and transportation. On-line detection of water content in crude oil is of great significance for determining the water and oil production layers of oil wells, estimating crude oil production, and predicting the development life of oil wells. At the same time, the accurate and timely online detection of the water content of crude oil can reflect the working status of the oil well in real time, which plays an important role in reducing energy consumption and cost for the management department and ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J127/18C08G59/14C08G59/62
CPCC09J163/00C08G59/14C08G59/623C08L2201/10C08L27/18
Inventor 吴叶军周瑾
Owner HEFEI JINGTE INSTR
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