Manufacturing method of integrally-formed inductor

A manufacturing method and inductance technology, applied in the direction of inductance/transformer/magnet manufacturing, circuits, electrical components, etc., can solve the problems of reducing product yield, weight and performance deviation, poor uniformity, etc., to reduce costs and material waste, product Excellent performance and improved magnetic permeability

Active Publication Date: 2021-02-23
NINGBO ZHONGKE BIPULASI NEW MATERIAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It can be seen that in the existing manufacturing technology of integrally formed inductors, when pressing the inductor body, the powder is basically directly filled into the mold for pressing, but Production practice has proved that the existing manufacturing process of integrally formed inductors has the following defects: the soft magnetic alloy powder used for the production of integrally formed inductors will be subjected to insulation coating and granulation before pressing. Limitation, the prefabricated powder particles produced by granulation have poor uniformity in size and weight, while

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  • Manufacturing method of integrally-formed inductor

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Embodiment 1

[0039] figure 1 The flow chart of the integrated molding inductor manufacturing process adopted by the specific embodiment of the present invention includes the following steps:

[0040] Step S1, powder preparation: uniformly mix the main soft magnetic alloy powder and auxiliary soft magnetic alloy powder to form a powder, and uniformly mix the powder with a binder, a curing agent and acetone to obtain a prefabricated powder;

[0041] Among them, the main soft magnetic alloy powder is selected from Fe-Si-B-C-Cr amorphous soft magnetic alloy powder, and its particle size is D50=10 μm, and the auxiliary soft magnetic alloy powder is selected from carbonyl iron powder, and its particle size is below 5 μm. The magnetic alloy powder and the auxiliary soft magnetic alloy powder are uniformly mixed according to the preset first mass ratio of 5:5 to form a powder, and the powder is mixed with the binder, curing agent and acetone according to the preset second mass ratio of 100:2: 0.5:1...

Embodiment 2

[0051] Select the same main soft magnetic alloy powder, auxiliary soft magnetic alloy powder and proportioning thereof as in Example 1, select the same binding agent and curing agent as in Example 1, the same powder, binding agent, curing agent and The ratio of acetone, but in this embodiment 2, no ultrasonic vibration is applied during the preparation of the green body and the hot pressing molding process. The rest of the methods, steps, and process parameters are the same as in the embodiment 1, and the integrated molded inductor is obtained. The corresponding performance parameters are shown in the table shown in 1.

Embodiment 3

[0053] Step S1, powder preparation: uniformly mix the main soft magnetic alloy powder and auxiliary soft magnetic alloy powder to form a powder, and uniformly mix the powder with a binder, a curing agent and acetone to obtain a prefabricated powder;

[0054] Among them, the main soft magnetic alloy powder is selected from Fe-Si-B-Nb-Cu nanocrystalline soft magnetic alloy powder, and its particle size is D50=10 μm, and the auxiliary soft magnetic alloy powder is selected from carbonyl iron powder, and its particle size is below 5 μm. The main soft magnetic alloy powder and the auxiliary soft magnetic alloy powder are uniformly mixed according to the preset first mass ratio of 5:5 to form a powder, and the powder is mixed with the binder, curing agent and acetone according to the preset second mass ratio of 100: 2:0.5:12 Mix evenly to obtain prefabricated powder 7, and use epoxy resin as the binder.

[0055] Step S2, green body preparation: put the prefabricated powder 7 prepare...

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Abstract

The invention relates to the field of inductor manufacturing, and especially relates to a manufacturing method of an integrally-formed inductor. The method mainly comprises the following steps: S1, uniformly mixing main soft magnetic alloy powder and auxiliary soft magnetic alloy powder, and then mixing with a binder, a curing agent and acetone; S2, pressing a flat plate blank and a T-shaped blankwith preset sizes; S3, winding an enameled wire; S4, carrying out hot press molding and baking on the flat plate blank and the T-shaped blank wound with the enameled wire; S5, spraying and coating aninsulating resin protective material, and then baking; and S6, stripping the resin and the patent leather at the copper electrode, and electroplating the electrode to generate the integrally formed inductor. The technical scheme has the beneficial effects that by controlling the weight and the size of the prefabricated flat plate blank, the yield of a hot pressing link can be improved, and the cost and material waste in inductor manufacturing are reduced; and in addition, ultrasonic vibration is applied to the cold and hot pressing process, so that particles can be fully filled, inductance density is improved, and magnetic conductivity is remarkably improved.

Description

technical field [0001] The invention relates to the field of manufacturing inductors, in particular to a method for manufacturing integrally formed inductors. Background technique [0002] With the rapid development of the electronic information industry, downstream electronic devices and communication equipment are gradually developing in the direction of high frequency, small size, low voltage and high current. Low-cost, excellent shielding performance, high reliability, and suitable for high-density surface mounting, the one-piece chip inductors have been widely used in mobile communications, computers, automotive electronics, high-resolution TVs, broadcast satellites and other fields, and have gradually become the mainstream of the inductor market. . [0003] At present, there are many manufacturing processes for integrated chip inductors, but the basic method is: (1) Pre-wind the hollow coil, put the hollow coil into the mold cavity of the mold, and then fill the prepa...

Claims

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Application Information

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IPC IPC(8): H01F41/00H01F41/02
CPCH01F41/00H01F41/0246Y02P10/25
Inventor 门贺张英徐可心霍利山林涛
Owner NINGBO ZHONGKE BIPULASI NEW MATERIAL TECH CO LTD
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