Raw material composition for preparing light-cured resin, light-cured resin prepared from raw material composition and application of light-cured resin

A raw material composition and technology of photocurable resin, which is applied in the field of curable resin synthesis, can solve the problems of reduced impact resistance, achieve low shrinkage, excellent mechanical properties and thermal properties, and increase the effect of crosslinking density

Active Publication Date: 2021-03-12
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Currently known polyurethane/cyanate interpenetrating polymer network structure, bismaleimide/cyanate ester interpenetrating polymer network structure and epoxy/cyanate ester interpen

Method used

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  • Raw material composition for preparing light-cured resin, light-cured resin prepared from raw material composition and application of light-cured resin
  • Raw material composition for preparing light-cured resin, light-cured resin prepared from raw material composition and application of light-cured resin
  • Raw material composition for preparing light-cured resin, light-cured resin prepared from raw material composition and application of light-cured resin

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0060] The preparation of embodiment 1-5 light curing IPN resin

[0061] The preparation steps of light curing IPN resin are as follows:

[0062] 1. Ingredients process

[0063] The cyanate ester was dissolved in the photocurable prepolymer in beaker 1 and stirred at 60° C. for 10 minutes. Mix the catalyst and part of the diluent in beaker 2, pour into beaker 1 after ultrasonication for 30 minutes, rinse beaker 2 with the remaining diluent and pour into beaker 1, then add photoinitiator and stir for 10 minutes. Place the beaker 1 in a vacuum box, vacuumize for 10 minutes, and remove air bubbles for later use.

[0064] 2. Curing process

[0065] 1) UV curing: pour the mixture prepared by the above batching process into a mold, and irradiate for 200 seconds under a 400W UV light to obtain a preliminary cured product.

[0066] 2) Thermal curing: put the preliminary cured product in a temperature-programmed oven for stepwise heating and curing, rise to 90°C for 30 minutes, kee...

Example Embodiment

[0070] The performance test of embodiment 6 light-cured IPN resin

[0071] The photocurable IPN resin samples prepared in Examples 1-5 above were subjected to mechanical and thermal performance tests.

[0072] The tensile strength is measured on a universal mechanical performance testing machine according to the ISO527 standard; the glass transition temperature Tg is obtained from Tanδ on a dynamic thermomechanical analyzer DMA, the temperature range is 20-300°C, the heating rate is 3°C / min, and the vibration frequency is 1.0Hz. The sample size is 33mm×13mm×3.0mm; the heat distortion temperature is measured on a Vicat tester, and the sample size is 80mm×10mm×3.0mm.

[0073] Table 2 Properties of photocurable IPN resin

[0074]

[0075]

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Abstract

The invention discloses a raw material composition for preparing light-cured resin, the light-cured resin prepared from the raw material composition and application of the light-cured resin, and belongs to the field of curable resin synthesis. The raw material composition for preparing the light-cured resin comprises cyanate ester, a photocurable prepolymer, a diluent, a catalyst and a photoinitiator, wherein the photocuring interpenetrating polymer network structure resin is obtained by ultraviolet light curing and thermal curing of the composition. According to the invention, the raw material composition for preparing the light-cured resin has the characteristic of rapid molding of photosensitive resin and the characteristic of excellent heat resistance and moisture resistance of cyanateester; and the photocuring interpenetrating polymer network structure resin is low in viscosity and easy to process, has the advantages of being high in strength, resistant to high temperature, low in shrinkage rate, low in water absorption rate, low in dielectric constant and the like, and can be applied to the fields of 3D printing, coating materials, adhesives, aerospace materials, printed circuit boards, invisible clothes, artificial satellites, flame-retardant materials, electronic packaging and the like.

Description

technical field [0001] The application relates to a raw material composition for preparing a photocurable resin, a photocurable interpenetrating polymer network structure resin prepared therefrom and its use, belonging to the field of curable resin synthesis. Background technique [0002] In the 1950s and 1960s, R. Stroh and H. Gerber synthesized cyanate for the first time. In 1963, German scientist E.Grigat synthesized cyanate esters by reacting phenolic compounds with hydrogen halides, and then Bayer Company also conducted research on cyanate esters. However, due to the lack of understanding of the polymerization mechanism of cyanate esters and the improper processing of resins, the popularization and use of cyanate esters are limited. In 1976, Miles company introduced 70% cyanate ethyl ketone solution resin and used it in the electronics industry. Cyanate resin has attracted the attention of people from all walks of life in recent years because of its superior structura...

Claims

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Application Information

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IPC IPC(8): C08F283/00C08F220/20C08F222/14C08F2/48
CPCC08F283/00C08F283/008C08F283/105C08F220/20C08F2/48
Inventor 周照喜李悦微许莹吴立新龚翠然罗震郑杨清
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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