Copper surface treatment liquid and preparation method and application of copper surface treatment liquid

Abstract

The invention relates to a copper surface treatment liquid and a preparation method and an application of the copper surface treatment liquid. The treatment liquid comprises the following components of, in percentage by mass, 0.1%-5% of copper ions, 0.1%-5% of tin ions, 0.1%-5% of alloy ions, 5%-30% of a complexing agent, 1%-20% of halogen ions, 0.1%-1% of a surfactant and the balance water. The application comprises the following steps that (1) oil removal and washing are sequentially carried out on a copper sample to be treated, then first treatment is carried out by adopting the treatment liquid, then second treatment is carried out by adopting the treatment liquid, and then the treated copper sample is obtained; and (2) the treated copper sample obtained in the step (1) is sequentiallysubjected to washing and drying to obtain the alloy copper sample. The surface treatment liquid enables a copper surface to form an alloy layer with a special concave shape, the binding force of resin and copper foil is increased, meanwhile, the roughness of the copper foil is reduced, the loss of high-frequency electric signals is small, the alloy layer is thin, the application cost is low, andthe process is simple.

Description

technical field [0001] The invention relates to the field of surface treatment, in particular to a copper surface treatment liquid and its preparation method and application. Background technique [0002] With the development of electronic technology products in the direction of miniaturization, high performance and multi-function, higher and higher requirements are put forward for the integrated circuit industry, and high-density interconnection boards have become the mainstream of development. Especially in the 5G communication industry, due to the finer and finer lines, the roughness of the copper surface of high-speed and high-frequency boards has a greater impact on signal transmission. Therefore, low-roughness copper surface treatment plays a vital role. [0003] In the inner lamination process, the traditional process potion is browning solution or black oxidation solution. The mainstream browning process is to form a metal-organic layer on the copper surface, so th...

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Problems solved by technology

[0006] However, the amount of microetching on the browned surface is large (1.5-2μm), and the roughness is high, especially in the application of 5G communication field, there will be obvious signal loss

Therefore, a new type of copper surface treatment agent is developed in the industry to reduce the roughness of the copper surface, such as connecting a silane coupling agent or an alloy layer on the copper surface. Generally, the copper surface treated with the silane coupling agent is pressed and then reflowed at high temperature After welding, the bonding force drops greatly, resulting in explosion, which makes it difficult to meet the process requirements

The low-roughness copper surface alloy plating process has high expectations. According to reports, the alloys include tin, nickel, silver, gold, palladium, ruthenium, cobalt, etc., but the specific surface area formed on the alloy surface is low, resulting in insufficient bonding force and cannot meet the high requirements. High-frequency high-speed board inner layer lamination process requirements

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