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10-gigabit wavelength division module low-temperature expansion design method

A design method and sub-module technology, applied in computer-aided design, CAD circuit design, calculation, etc., can solve the problems of increased difficulty in the packaging process of optical components, increased power consumption of optical components, and increased power consumption of optical modules. To achieve the overall signal integrity and power integrity are not affected, to avoid heat dissipation problems, the effect of simple temperature compensation circuit

Pending Publication Date: 2021-03-23
JIANGSU ALLRAY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a low-temperature extension design method for 10 Gigabit wavelength division modules to solve the problem of fiber dispersion of C-band long-wavelength optical modules at an ambient temperature of -40°C proposed in the above background technology, and ensure the transmission distance and In engineering applications, the current conventional practice is to add TEC control to the laser. By monitoring the real-time operating temperature of the optical module and feeding it back to the TEC control circuit, the constant temperature control of the laser working environment of the optical module is carried out to ensure that the laser works stably at the optimal temperature point, increasing TEC also needs a TEC drive control circuit, the power consumption of optical components will increase, the packaging process of optical components will become more difficult, and the cost of the entire optical module will increase significantly, and the overall power consumption of the optical module will also increase.

Method used

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  • 10-gigabit wavelength division module low-temperature expansion design method
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  • 10-gigabit wavelength division module low-temperature expansion design method

Examples

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Embodiment 1

[0022]SeeFigure 1-2 , A low temperature expansion design method of 10 Gigabit Wave Modules, which includes the following steps:

[0023]S1, first control circuit design on the optical module plate, composed of bias resistance, thermistor and switch triode, the thermistor resistance value varies with the optical module, the thermistor resistance value is low, with the heat The sensitivity resistance value increases, the light-receiving triode control voltage increases, the control voltage reaches the set threshold control three-pole conduction, power heating resistance is electrically heated, power heating resistance heat through the soft plate to pass to the TO base, pass TO The base is supplemented by the laser, improves the working temperature of the laser low temperature environment, ensuring that the optical module is low temperature indicators, the temperature compensation circuit is simple, the components used are small, the PCB box space is small, and it is more favorable. Modul...

Embodiment 2

[0030]SeeFigure 3-4Unlike the examples, a low temperature expansion design method of a 10,000gate wave division module, which includes the following steps:

[0031]S1, first on the TEC (semiconductor refrigerator), the TEC patch is on the TO base, the thermistor sticker is adjacent to the TEC sheet, and the working temperature during normal operation of the laser is collected by thermistor sensing, collecting, collecting Temperature information feeds back to the TEC controller circuit.

[0032]S2, then the TEC controller implements the working current control of TEC cooling sheet by the PID software algorithm, and realizes the dynamic approach to the target temperature, reaching the laser operating in a constant temperature state.

[0033]S3, finally the laser assembly with TEC is welded through the high-speed softboard, ensuring the shortest connection of the TO pin, reducing the lead high frequency inductance, and ensuring the complete high speed signal.

[0034]In summary: This embodiment ca...

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Abstract

The invention discloses a 10-gigabit wavelength division module low-temperature expansion design method, which comprises the following steps that S1, a control circuit is designed on an optical modulehard board and consists of a bias resistor, a thermistor and a switching triode, the resistance value of the thermistor is changed along with the working temperature of an optical module, the resistance value of the thermistor is increased at a low temperature, along with the increase of the resistance value of the thermistor, the control voltage of the switching triode rises, the control voltagereaches a set threshold value to control the triode to be conducted, a power heating resistor is powered on for heating, and the heat generated by the power heating resistor is conducted to a tightlyattached TO base through a soft board to supplement temperature to a laser working at low temperature through the TO base, so the working temperature of the laser in a low-temperature environment isincreased, and the working photoelectric index of the optical module at low temperature is ensured; and S2, a common laser assembly without TEC control is welded and connected through one end of a high-speed flexible board with a heating compensation resistor, so that shortest connection of TO pins is ensured, and the high-frequency inductance of a lead is reduced.

Description

Technical field[0001]The present invention relates to the application of 4G LTE and 5G pre-transmission system applications and industrial automation control technology, and is specifically a low temperature expansion design method for 10 gigramnoform modules.Background technique[0002]In recent years, the rise of cloud computing, Internet of Things, mobile Internet and other networks and business applications have proposed high bandwidth and bearer demand for the underlying transfer network, especially for network bandwidth, fast supply, network flexibility, etc. Higher demand, 4G LTE and 5G prequel require 10 Gigabit light module (CWDM wave points) support large bandwidth services, the working wavelength is extended from the O band to the C band, and the optical power and sensitivity indicator requirements of the optical module are high The optical fiber is long, the normal application work is required to meet 0 ~ 70 ° C, and special application work ambient temperature requirement...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/392
CPCG06F30/392G06F2115/12G06F2119/08
Inventor 于佩王波朱勤
Owner JIANGSU ALLRAY