10-gigabit wavelength division module low-temperature expansion design method
A design method and sub-module technology, applied in computer-aided design, CAD circuit design, calculation, etc., can solve the problems of increased difficulty in the packaging process of optical components, increased power consumption of optical components, and increased power consumption of optical modules. To achieve the overall signal integrity and power integrity are not affected, to avoid heat dissipation problems, the effect of simple temperature compensation circuit
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Embodiment 1
[0022]SeeFigure 1-2 , A low temperature expansion design method of 10 Gigabit Wave Modules, which includes the following steps:
[0023]S1, first control circuit design on the optical module plate, composed of bias resistance, thermistor and switch triode, the thermistor resistance value varies with the optical module, the thermistor resistance value is low, with the heat The sensitivity resistance value increases, the light-receiving triode control voltage increases, the control voltage reaches the set threshold control three-pole conduction, power heating resistance is electrically heated, power heating resistance heat through the soft plate to pass to the TO base, pass TO The base is supplemented by the laser, improves the working temperature of the laser low temperature environment, ensuring that the optical module is low temperature indicators, the temperature compensation circuit is simple, the components used are small, the PCB box space is small, and it is more favorable. Modul...
Embodiment 2
[0030]SeeFigure 3-4Unlike the examples, a low temperature expansion design method of a 10,000gate wave division module, which includes the following steps:
[0031]S1, first on the TEC (semiconductor refrigerator), the TEC patch is on the TO base, the thermistor sticker is adjacent to the TEC sheet, and the working temperature during normal operation of the laser is collected by thermistor sensing, collecting, collecting Temperature information feeds back to the TEC controller circuit.
[0032]S2, then the TEC controller implements the working current control of TEC cooling sheet by the PID software algorithm, and realizes the dynamic approach to the target temperature, reaching the laser operating in a constant temperature state.
[0033]S3, finally the laser assembly with TEC is welded through the high-speed softboard, ensuring the shortest connection of the TO pin, reducing the lead high frequency inductance, and ensuring the complete high speed signal.
[0034]In summary: This embodiment ca...
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