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Multi-layer plated lead frame

A technology of lead frame and multi-layer plating, which is applied in the field of lead frame and can solve problems such as corrosion of alloy 42

Inactive Publication Date: 2003-10-22
MDS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Alloy 42 was severely corroded by the assembly process in a saline environment

Method used

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  • Multi-layer plated lead frame
  • Multi-layer plated lead frame
  • Multi-layer plated lead frame

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Experimental program
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Embodiment Construction

[0023] The present invention is characterized in that the ferroalloy substrate is initially plated with precious metal or its alloy. After forming such a precious metal plating layer, an intermediate plating layer and an outermost plating layer are formed to complete the plating layer. Here, a palladium (Pd) plating layer may be formed between the middle plating layer and the outermost plating layer. Here, the Pd-containing plating layer improves the adhesion between the middle plating layer and the outermost plating layer, and reduces the surface roughness of the plating layer, thereby improving solderability and wire bonding.

[0024] The principle of the present invention will be described with reference to Wagner's hybrid molecular electrode theory.

[0025] In the electrochemical field, the corrosion rate of metals is generally expressed by the following equation (1).

[0026] i=i o exp(ΔE / β) ……(1) where i o In order to exchange current density, β is the Tafel constant, and...

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PUM

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Abstract

The invention provides a multi-layer coating lead frame. The structure of the lead frame has a first noble metal plating layer, an intermediate plating layer and a second noble metal plating layer sequentially formed on an iron alloy substrate. The lead frame is improved in all characteristics such as wire bondability, corrosion resistance and solderability.

Description

Technical field [0001] The present invention relates to a lead frame, and more particularly, to a multi-layer plated lead frame, in which the structure of the plating layer is improved so that a pre-plated layer frame (PPF) process is applied to a ferroalloy substrate. Background technique [0002] The semiconductor lead frame is an important component in the semiconductor package together with the semiconductor chip. The lead frame connects the inside and outside of the semiconductor package and supports the semiconductor chip. Generally, such semiconductor lead frames are manufactured by molding or etching methods. [0003] According to the molding method, a thin metal plate material is formed into a predetermined shape with a molding equipment. Such molding methods are mainly used for mass production of lead frames. [0004] The etching method is a kind of chemical etching, in this method, a predetermined part of the material is etched away with a chemical substance, and this ...

Claims

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Application Information

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IPC IPC(8): C25D5/26C23C28/02C25D7/00H01L21/50H01L21/60H01L23/48H01L23/495H01L23/50
CPCC23C28/021C23C28/023H01L23/49582H01L24/48H01L2224/48247H01L2224/85464H01L2924/00014H01L2924/01046H01L2924/01078H01L2924/01079H01L2224/45099H01L2224/45015H01L2924/207H01L23/48
Inventor 金重道白铃昊福京纯
Owner MDS CO LTD