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Adhesive tape for wafer processing and manufacturing method thereof

A wafer processing and adhesive tape technology, applied in the direction of adhesives, film/sheet adhesives, etc., can solve problems such as insufficient impact strength

Inactive Publication Date: 2021-04-02
DUALSHINE TECH SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The main purpose of the tape for wafer processing is to protect the semiconductor wafer from the impact of grinding the back of the semiconductor wafer. It is especially important to have water resistance to water washing and the retention of processed parts. Therefore, it is suitable for wafer processing. The strength, toughness and other mechanical properties of the adhesive tape have high requirements. Acrylonitrile-butadiene-styrene copolymer is a thermoplastic polymer structure material with high strength, good toughness and easy processing. It is added to It is conceivable that tapes for wafer processing can be used in raw materials to improve toughness. However, their impact strength and other properties are insufficient, and there are still defects and problems to be overcome in practical use. Therefore, a tape for wafer processing and its manufacture are now provided. method

Method used

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  • Adhesive tape for wafer processing and manufacturing method thereof
  • Adhesive tape for wafer processing and manufacturing method thereof

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preparation example Construction

[0021] In the embodiment of the present invention, the preparation method of the modified coated marble filler specifically includes: 1) preparing the melamine formaldehyde resin prepolymer: according to the weight of 1:(1-5):(1-6) Take melamine, formaldehyde solution and distilled water and mix them, wherein the mass fraction of formaldehyde solution is 20%, and react for 1 hour under the conditions of pH 7-8 and temperature 55-65°C to obtain a melamine-formaldehyde resin prepolymer; 2 ) Preparation of coated marble powder filler: take melamine formaldehyde resin prepolymer and surfactant aqueous solution according to the weight ratio of 1:(5-10) and stir and mix for 1 hour, wherein the mass fraction of surfactant aqueous solution is 30%, Then add marble powder and gelatin according to the ratio of melamine-formaldehyde resin prepolymer, marble powder and gelatin at a ratio of 0.5:1:0.5, and react for 3-4 hours at a pH of 3-4 at 50-60°C, filter, Washing and drying to obtain c...

Embodiment 1

[0025] In the embodiment of the present invention, the preparation method of modified coated marble filler:

[0026]1) Preparation of melamine-formaldehyde resin prepolymer: Take melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3 and mix them, wherein the mass fraction of formaldehyde solution is 20%, and the pH is 8 and the temperature is 60°C React 1h under the condition of melamine formaldehyde resin to obtain melamine formaldehyde resin prepolymer; 2) preparation of coated marble powder filler: take melamine formaldehyde resin prepolymer and cetyltrimethylammonium bromide according to the weight ratio of 1:10 The aqueous solution was stirred and mixed for 1 hour, wherein the mass fraction of cetyltrimethylammonium bromide aqueous solution was 30%, and then marble powder was added according to the ratio of melamine formaldehyde resin prepolymer, 300 mesh marble powder and gelatin to 0.5:1:0.5. Powder and gelatin, reacted at pH 3 and 6...

Embodiment 2

[0031] In the embodiment of the present invention, the preparation method of modified coated marble filler:

[0032] 1) Preparation of melamine-formaldehyde resin prepolymer: Take melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3 and mix them, wherein the mass fraction of formaldehyde solution is 20%, and the pH is 8 and the temperature is 60°C React 1h under the condition of melamine formaldehyde resin to obtain melamine formaldehyde resin prepolymer; 2) preparation of coated marble powder filler: take melamine formaldehyde resin prepolymer and cetyltrimethylammonium bromide according to the weight ratio of 1:10 The aqueous solution was stirred and mixed for 1 hour, wherein the mass fraction of cetyltrimethylammonium bromide aqueous solution was 30%, and then marble powder was added according to the ratio of melamine formaldehyde resin prepolymer, 300 mesh marble powder and gelatin to 0.5:1:0.5. Powder and gelatin, reacted at pH 3 and ...

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Abstract

The invention discloses an adhesive tape for wafer processing and a manufacturing method of the adhesive tape, and relates to the field of adhesive tapes A base material film used in the invention mainly aims to protect a semiconductor wafer from impact during grinding processing of the back surface of the semiconductor wafer, an acrylonitrile butadiene styrene copolymer is a thermoplastic macromolecular structure material which is high in strength, good in toughness and easy to process and mold, but the impact strength and other properties of the acrylonitrile butadiene styrene copolymer areinsufficient; melamine formaldehyde resin is arranged as a plating layer to coat the surface of a marble powder filler and is modified by a coupling agent, so that the surface of the modified coated marble filler is compact, the hydrophilicity of the surface is changed into hydrophobicity, and the modified coated marble filler has good compatibility with an acrylonitrile butadiene styrene copolymer system; meanwhile, the modified coated marble filler is added into the acrylonitrile- butadiene- styrene copolymer system, so that the hardness performance of the whole system can be remarkably improved, and the advantages of the system in the aspect of toughness are kept.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to an adhesive tape for wafer processing and a manufacturing method thereof. Background technique [0002] The main purpose of the tape for wafer processing is to protect the semiconductor wafer from the impact of grinding the back of the semiconductor wafer. It is especially important to have water resistance to water washing and the retention of processed parts. Therefore, it is suitable for wafer processing. The strength, toughness and other mechanical properties of the adhesive tape have high requirements. Acrylonitrile-butadiene-styrene copolymer is a thermoplastic polymer structure material with high strength, good toughness and easy processing. It is added to It is conceivable that tapes for wafer processing can be used in raw materials to improve toughness. However, their impact strength and other properties are insufficient, and there are still defects and problems t...

Claims

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Application Information

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IPC IPC(8): C09J7/24C08J5/18C08L33/12C08L55/02C08K9/10C08K3/26
CPCC09J7/24C08J5/18C08J2333/12C08J2455/02C08K9/10C08K2003/265C09J2433/006C09J2455/006
Inventor 陈家豪陈全炼易小钗
Owner DUALSHINE TECH SHENZHEN