Device and method for in-situ laser drilling sampling and solder sealing of small pipe

Abstract

The invention discloses a device and method for in-situ laser drilling sampling and solder sealing of a small pipe, and belongs to the technical field of ultrafast laser drilling and quasi-continuous laser welding methods. Firstly, a laser machining part is installed on a special workbench, the part needing laser drilling is placed in a sampling container, and interface sealing is achieved; vacuumizing is carried out on the sampling container, a sampling valve is closed after the vacuum reaches 10<-3>Pa, and micropores penetrating through the wall thickness of a sampling pipe is machined at a specified part through a picosecond laser; then the atmosphere in the interior of a product is slowly released into the sampling container through a micropore channel; and after the internal air pressure of the product is balanced with the air pressure of the sampling container, a solder sealing laser head is moved to the micropore, and solder sealing is carried out on the micropore in a long-pulse laser welding mode. Laser in-situ near-lossless punching and solder sealing of the sampling pipe in a narrow space are met, near-lossless sampling is carried out on the atmosphere in the interior of a sealed container, and the use performance of a sealed container product is not affected.

Description

technical field [0001] The invention belongs to the technical field of ultrafast laser drilling and quasi-continuous laser welding methods, and in particular relates to a device and method for in-situ laser drilling, sampling and welding of small tubes. Background technique [0002] In recent years, laser technology has developed rapidly, and has been widely used in industrial sectors, and output modes such as ultrafast, quasi-continuous and continuous lasers have been developed. Ultrafast lasers are mainly used for micro-nano processing and precision drilling. Due to the characteristics of short pulses, high peak power and high repetition frequency, ultrafast lasers have high processing precision, extremely small heat-affected zone and are suitable for processing various materials. It is one of the hot spots in laser processing research. Among them, quasi-continuous and continuous lasers have the characteristics of long output time and high average power, and are widely us...

AI Technical Summary

Problems solved by technology

[0003] In some specific engineering fields, there has been an application demand for using ultrafast lasers for near-non-destructive micro-nano drilling sampling analysis, and then for in-situ laser sealing and welding of microholes. The above-mentioned ultrafast laser drilling and quasi-continuous laser welding single items None of the technologies is sufficient to solve the complex requirement of micropore processing-sampling-welding sealing. Therefore, there is a lack of an integrated technology that can realize both precision micropore processing and welding sealing requirements, especially in a narrow vacuum environment space. To realize the processing of small-diameter parts, there are still a series of technical problems such as the difficulty of the lighting source of the visual system entering the narrow space and the scattering of the lighting source by the small-diameter pipe diameter (larger curvature), which leads to poor observation results.

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