High-frequency IMPATT diode mesa die structure and preparation method thereof

A diode and mesa technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of poor reliability, reduce device negative resistance, and reduce RF power efficiency, and increase the heat sink area. , Improve the output power and reduce the effect of additional resistance

Pending Publication Date: 2021-04-09
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the millimeter wave frequency band, the IMPATT diode adopts a mesa structure, which can effectively reduce the parasitic capacitance and inductance effect introduced by the device, and is conducive to improving the operating frequency and output power of the device. With the continuous improvement of the operating frequency of the device (above 100 GHz), The skin effect caused by high frequency is obvious, and the working current of the device is limited to flow within the surface depth δ of the mesa core, which will inevitably increase the effective resistance of the mesa core, and generate a voltage drop along the radial direction of the IMPATT diode vertical to the mesa, which will be

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-frequency IMPATT diode mesa die structure and preparation method thereof
  • High-frequency IMPATT diode mesa die structure and preparation method thereof
  • High-frequency IMPATT diode mesa die structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] combine figure 1 and figure 2 As shown, the present invention provides a high-frequency IMPATT diode mesa tube core structure, including a p+ conductive substrate 1, a mesa tube core pn junction 2 is provided on the top surface of the p+ conductive substrate, and a vertical The through hole 3 makes the mesa tube core form a circular frustum shape; the diameter of the lower part of the through hole 3 is tapered from top to bottom.

[0026] The present invention also provides a kind of preparation method of high-frequency IMPATT diode mesa die structure, comprises the following steps:

[0027] S1, combine image 3 As shown, an n-type epitaxial layer 12, a p-type epitaxial layer 13 and a p+ epitaxial layer 14 are sequentially grown on an n+ silicon wafer 11;

[0028] The thickness Wn of n-type epitaxial layer 12 is given by the formula (1) decide,

[0029] The thickness Wp of the p-type epitaxial layer 13 is given by the formula (2) decide,

[0030] In formulas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-frequency IMPATT diode mesa die structure. The high-frequency IMPATT diode mesa die structure comprises a p+ conductive substrate; a mesa die is arranged on the top surface of the p+ conductive substrate. The high-frequency IMPATT diode mesa die structure is characterized in that a vertical through hole is formed in the center of the mesa die, so that the mesa die forms an annular circular truncated cone shape. During preparation, an n-type epitaxial layer, a p-type epitaxial layer and a p+ epitaxial layer are grown on an n+ silicon wafer; donor impurities n are doped into the n-type epitaxial layer, and acceptor impurities p are doped into the p-type epitaxial layer; a p+ electrode enhancement layer is prepared on the surface of the p+ epitaxial layer; the n+ silicon wafer is thinned; an n+ electrode enhancement layer is prepared on the thinned surface of the n+ silicon wafer; and corrosion is performed from the n+ electrode enhancement layer to the p+ epitaxial layer through photoetching and corrosion processes according to the design pattern of the mesa die to obtain the high-frequency IMPATT diode mesa die structure. The structure can well reduce additional equivalent resistance introduced by a skin effect in a high-frequency working state of a device, increase the output power of the device in the high-frequency working state, and improve the reliability of the device.

Description

technical field [0001] The invention relates to the technical field of millimeter-wave solid-state devices, in particular to a high-frequency IMPATT diode mesa die structure and a preparation method. Background technique [0002] Millimeter wave / terahertz is a fast-growing interdisciplinary subject. The academic value of scientific research and the prospect of industrial application are extremely important. It can effectively reduce the size of the system, improve detection accuracy, anti-interference ability and wireless communication transmission rate, etc. Avalanche collision transit time (IMPact Avalanche Transit Time referred to as IMPATT) diodes have application value in the fields of millimeter wave / terahertz nondestructive testing, speed and ranging, radar imaging, wireless communication and other fields due to their high operating frequency and high output power. [0003] In the millimeter wave frequency band, the IMPATT diode adopts a mesa structure, which can effe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L29/864H01L29/06H01L21/329
CPCH01L29/66159H01L29/864H01L29/0615Y02P70/50
Inventor 潘结斌陈婧瑶吕东锋李文翰史一明李泽瑞
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products