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Method for improving dispersity of photovoltaic panel electronic paste

An electronic slurry and dispersion technology, applied in the direction of mixing methods, chemical instruments and methods, dissolution, etc., can solve the problems of poor film performance, film pilling and surface unevenness, and achieve the effect of promoting full infiltration

Inactive Publication Date: 2021-04-13
CHENDU NEW KELI CHEM SCI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem that the existing electronic paste contains a lot of conductive fillers, which are easily agglomerated during the paste configuration process and cause poor performance of the film material, this invention proposes a method for improving the dispersibility of electronic paste for photovoltaic panels
The foaming agent aggregates on the surface of the conductive phase particles and continuously generates bubbles, the bubbles burst and the gas driving force generated by the bubbles promotes the dispersion of tiny agglomerates in the conductive phase that are difficult to disperse through ordinary dispersion methods, thus effectively solving the problem of micro-agglomerates in the sintering process. Film material pilling and surface unevenness caused by blocks

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0027] Dissolve copper acetate in deionized water to prepare a 0.2mol / L solution, slowly add polyacrylamide powder with 10% solution mass and stir until the solution forms a viscous slurry. Add hydrazine hydrate, ammonia water, and EDTA to the viscous slurry, stir and react at 60°C for 20 minutes to form a suspension slurry of nano-copper particles, viscous slurry, hydrazine hydrate with a concentration of 85%, ammonia water with a concentration of 10%, and EDTA The mass ratio is 100:2:21:0.6. Add 0.1mol / L dilute hydrochloric acid dropwise to the suspended slurry until the suspended slurry is neutral, then add p-toluenesulfonyl hydrazide according to 2% of the suspended slurry mass, stir and mix evenly while heating to 80°C and kept stirring for 30 minutes, while stirring and keeping warm, add a saturated sodium carbonate solution dropwise at 1% of the mass of the suspended slurry to obtain a uniformly dispersed mixture without nano-copper clumps. Mix the mixture with glass p...

Embodiment 2

[0029]Dissolve copper acetate in deionized water to prepare a 0.2mol / L solution, slowly add polyacrylamide powder with 11% solution mass and stir until the solution forms a viscous slurry. Add hydrazine hydrate, ammonia water, and EDTA to the viscous slurry, stir and react at 63°C for 20 minutes to form a suspension slurry of copper nanoparticles, viscous slurry, hydrazine hydrate with a concentration of 85%, ammonia water with a concentration of 10%, and EDTA The mass ratio is 100:3:23:0.9. Add 0.1mol / L dilute hydrochloric acid dropwise to the suspended slurry until the suspended slurry is neutral, then add p-toluenesulfonyl hydrazide according to 2% of the suspended slurry mass, stir and mix evenly while heating Stir to 80°C and keep it warm for 30 minutes. While stirring and keeping warm, add a saturated sodium carbonate solution dropwise at 1% of the mass of the suspended slurry to obtain a uniformly dispersed mixture without nano-copper clumps. Mix the mixture with glass...

Embodiment 3

[0031] Dissolve copper acetate in deionized water to prepare a 0.2mol / L solution, slowly add polyacrylamide powder with 13% solution mass and stir until the solution forms a viscous slurry. Add hydrazine hydrate, ammonia water, and EDTA to the viscous slurry, stir and react at 65°C for 25 minutes to form a suspension slurry of nano-copper particles, viscous slurry, hydrazine hydrate with a concentration of 85%, ammonia water with a concentration of 10%, and EDTA The mass ratio is 100:4:27:1.3. Add 0.1mol / L dilute hydrochloric acid dropwise to the suspended slurry until the suspended slurry is neutral, then add p-toluenesulfonyl hydrazide at 2.5% of the suspended slurry mass, stir and mix evenly while heating to 80°C and kept stirring for 35 minutes. While stirring and keeping warm, 1% of the suspended slurry mass was added dropwise with saturated sodium carbonate solution to obtain a uniformly dispersed mixture without nano-copper clumps. Mix the mixture with glass powder and...

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Abstract

The invention relates to the technical field of electronic paste, and discloses a method for improving dispersity of photovoltaic panel electronic paste. The method comprises the following steps: preparing nano-copper powder from copper acetate and hydrazine hydrate under proper conditions, treating the nano-copper powder with toluenesulfonyl hydrazine, and aggregating toluenesulfonyl hydrazine on nano-copper tiny agglomerates; countless tiny bubbles are generated by decomposing in hot water, the bubbles burst and gas driving force generated by the bubbles promote tiny agglomerates formed by agglomeration of the nano-copper particles to be dispersed and fully infiltrated, and the sodium p-toluenesulfonate generated after the p-toluenesulfonylhydrazine is decomposed can promote effective infiltration of paste to the nano-copper particles. P-toluenesulfonyl hydrazide can hydrolyze on the surfaces of the nano-copper tiny agglomerates to generate countless small bubbles to crush the tiny agglomerates to be fully dispersed, and the generated sodium p-toluenesulfonate can also promote the slurry to fully infiltrate the nano-copper particles, so that the problem of agglomeration of the filler tiny agglomerates, which is difficult to solve by traditional mechanical stirring and ball milling, is effectively solved; therefore, uniform and stable dispersion of the conductive phase in the electronic paste is realized.

Description

technical field [0001] The invention relates to the technical field of electronic paste, in particular to a method for improving the dispersibility of electronic paste for photovoltaic panels. Background technique [0002] With the rapid development of microelectronics technology, electronic devices are increasingly developing in the direction of miniaturization, integration and high frequency. Electronic paste is a mixed system of solid particles and organic liquids composed of functional fillers, inorganic fillers or polymer binders suspended in organic carriers. This fluid material is applied to electronic components through printing and other methods to form modules with specific electrical functions. It is the basic material for various electronic components such as integrated circuits, chip components, photovoltaic devices, flexible batteries, and transistors. Photovoltaic panels are used to directly convert the sun's light energy into electrical energy, mainly based ...

Claims

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Application Information

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IPC IPC(8): B01F3/12
CPCB01F23/511
Inventor 廖健淞陈庆司文彬白涛
Owner CHENDU NEW KELI CHEM SCI CO LTD
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