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Silica filler, preparation method thereof and epoxy resin composite material

A silica and epoxy resin technology, applied in epoxy resin glue, adhesive type, adhesive additive and other directions, can solve the problem of high viscosity of composite materials, achieve excellent viscosity stability, simple process flow, process conditions easy-to-achieve effects

Pending Publication Date: 2021-04-16
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the deficiencies in the prior art, the present invention provides a silica filler and a preparation method thereof to solve the problem that the existing silica filler causes excessive viscosity of the composite material when the particle size is relatively small and the filling amount is relatively high. high problem

Method used

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  • Silica filler, preparation method thereof and epoxy resin composite material
  • Silica filler, preparation method thereof and epoxy resin composite material
  • Silica filler, preparation method thereof and epoxy resin composite material

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preparation example Construction

[0031] The embodiment of the present invention also provides the preparation method of the silica filler as described above, which includes:

[0032] Step S10 , stirring and dispersing the silica particles in the silane coupling agent solvent to obtain a mixed reaction liquid; wherein, the silane coupling agent solvent contains two or more different silane coupling agents.

[0033] In a preferred solution, the mass ratio of the silica particles to the silane coupling agent solvent is selected to be 1:(1-5).

[0034] In a preferred scheme, the two or more different silane coupling agents are selected from aminopropyltriethoxysilane, glycidyloxypropyltrimethoxysilane, methacryloxypropyltrimethoxysilane Silane, Vinyltriethoxysilane, Vinyltrimethoxysilane, Mercaptopropyltrimethoxysilane, Mercaptopropyltriethoxysilane, Ethylenediaminepropyltriethoxysilane, Ethylenediaminepropyl Dimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-(2,3-epoxypropoxy)propylmethyldimethoxy...

Embodiment 1

[0049] 1. Silica filler and its preparation process

[0050] Add 50g of phenyltrimethoxysilane and 50g of 3-glycidyloxypropyltrimethoxysilane to the single-necked flask of the reaction device, add 50g of silicon dioxide with a particle size of 100nm to the single-necked flask, add a magnetic stirring rotor, and heat to Stir at 120°C at 800 rpm, condense and reflux for 12 hours.

[0051] The liquid mixture obtained after the reaction is placed in a centrifuge bottle, and centrifuged in a high-speed centrifuge at a speed of 8000rpm for 10 minutes to separate the powder from the silane coupling agent liquid, and recover and collect the silane coupling agent liquid for reuse. Ultrasonic cleaning and centrifugation with absolute ethanol, repeated 3 times, the purpose is to remove the physically adsorbed silane on the surface of the silica, and the obtained powder is placed in a blast drying oven at 110°C for 6 hours to further promote the interaction of the silane coupling agent wi...

Embodiment 2

[0059] 1. Silica filler and its preparation process

[0060] Add 50g of methyltrimethoxysilane and 50g of aminopropyltriethoxysilane into the single-necked flask of the reaction device, add 100g of silicon dioxide with a particle size of 100nm into the single-necked flask, add a magnetic stirring rotor, heat to 140 ° C, at 800rpm Stir at a rotating speed, condense and reflux for 3 hours.

[0061] The liquid mixture obtained after the reaction is placed in a centrifuge bottle, and centrifuged in a high-speed centrifuge at a speed of 8000rpm for 10 minutes to separate the powder from the silane coupling agent liquid, and recover and collect the silane coupling agent liquid for reuse. Ultrasonic cleaning and centrifugation with absolute ethanol, repeated 3 times, the purpose is to remove the physically adsorbed silane on the surface of the silica, and the obtained powder is placed in a blast drying oven at 110°C for 6 hours to further promote the interaction of the silane couplin...

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Abstract

The present invention provides a silica filler which is silica particles having two or more different organic functional groups grafted on the surface thereof by surface modification with two or more different silane coupling agents. The preparation method of the silicon dioxide filler comprises the following steps: stirring and dispersing silicon dioxide particles in a silane coupling agent solvent to obtain a mixed reaction solution, wherein the silane coupling agent solvent comprises more than two different silane coupling agents; and carrying out a high-temperature reflux reaction process on the reaction solution, cooling the reaction solution, and sequentially carrying out a centrifugal washing process and a drying process to obtain the silicon dioxide particles of which the surfaces are grafted with more than two different organic functional groups. According to the silicon dioxide filler provided by the invention, more than two different organic groups are grafted on the surface, the silicon dioxide filler is filled in an epoxy resin composite material, and the composite material has lower viscosity and excellent viscosity stability when the particle size of the filler is smaller and the filling amount is higher.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, specifically relates to a silica filler and a preparation method thereof, and also relates to an epoxy resin composite material containing the silica filler. Background technique [0002] New forms of electronic products such as biological micro-electromechanical, artificial intelligence micro-robots, wearable electronic devices, 5G communication electronic devices, thin and light notebooks, and ultra-thin mobile phones appear more and more frequently in people's daily life. The miniaturization, thinning, and high operating speed of electronic equipment make chips develop towards high integration, miniaturization, and high reliability. Underfill is one of the key plastic electronic packaging materials. Underfill can reduce the thermal expansion coefficient mismatch between the chip and the substrate, provide adhesion, protect solder balls, etc., and are used in CSP (Chip Scale...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
CPCC09J11/04C09J163/00C08L63/00
Inventor 李刚张超吴厚亚朱朋莉
Owner SHENZHEN INST OF ADVANCED TECH
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