LED epitaxial growth method
An epitaxial growth and reaction cavity technology, applied in the directions of crystal growth, single crystal growth, single crystal growth, etc., can solve the problems of low quantum well radiation recombination efficiency and low quantum well growth quality.
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Embodiment 1
[0042]This embodiment employs the LED epitaxial growth method provided by the present invention, using MOCVD to grow GaN-based LED epitaxial sheet, using high purity H2High purity N2High purity H2High purity N2Mixed gas as carrier gas, high purity NH3Examples of N-source, metal organic source trimethyl gallium (TMGA) as gallium source, trimethyl indium (Tmin) as indium sources, N-type dopants are silane (SiH4), Trimethyl aluminum (TmAl) as aluminum sources, p-type dopants are fermented magnesium (CP2Mg), the reaction pressure between 70 mbar to 600 mbar. The specific growth mode is as follows (please refer to the epitaxial structurefigure 1 ):
[0043]LED epitaxial growth method, in turn, in turn, to process sapphire substrate 1, grow low temperature GaN buffer layer 2, growing non-doped GaN layer 3, GaN GaN layer 4, grown doped Si, growing multi-quantum well layer 5, growth AlGaN electronics The barrier layer 6, the p-type GaN layer 7 that grows doped Mg, cooling cooling; wherein
[0044...
Embodiment 2
[0075]The above-mentioned embodiment is provided below, that is, the growth method of the traditional LED epitaxial structure (please refer to the extension structurefigure 2).
[0076]Step 1: In the temperature of 1000-1100 ° C, the reaction chamber pressure is 100-300 mbar, and the h of 100-130 l / min2Under the conditions, the sapphire substrate was processed for 5-10 minutes.
[0077]Step 2: Growth of the low temperature GaN buffer layer and form an irregular island in the low temperature GaN buffer layer 2.
[0078]Specifically, the step 2 is further:
[0079]At temperatures of 500-600 ° C, the reaction chamber pressure is 300-600 mbar, and the NH of 10000-20000sccm is passed.3, 50-100sccm TMGA, 100-130L / min H2Under the conditions, the low temperature GaN buffer layer 2 is grown on the sapphire substrate 1, and the thickness of the low temperature GaN buffer layer 2 is 20-40 nm;
[0080]At a temperature of 1000-1100 ° C, the reaction chamber pressure is 300-600 mbar, and the NH of 30000-400...
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