High-bending-resistance circuit board for automobile and preparation method of high-bending-resistance circuit board

A circuit board and bending-resistant technology, which is applied in printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve the problems of short service life of flexible circuit boards, short service life, and aging of circuit layers, so as to save design area and improve Service life, effect of changing elasticity

Active Publication Date: 2021-06-25
GUANGDE XINSANLIAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the traditional flexible and anti-bending printed circuit board has a certain degree of flexibility, there is still a risk of fracture after frequent bending, and the service life is short. Third, the heat generated by the circuit layer is accumulated in the circuit board and cannot be dissipated out, resulting in the aging of the circuit layer due to excessive temperature, which further causes the service life of the flexible circuit board to be short

Method used

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  • High-bending-resistance circuit board for automobile and preparation method of high-bending-resistance circuit board
  • High-bending-resistance circuit board for automobile and preparation method of high-bending-resistance circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as Figure 1-2 As shown, a circuit board with high bending resistance for automobiles, the circuit board includes a rigid bending-resistant plate 1 arranged in the middle, and a flexible prepreg 2 is attached to the upper and lower outer surfaces of the rigid bending-resistant plate 1, and the flexible prepreg 2 The upper and lower outer surfaces of the honeycomb heat dissipation sheet 3 are attached; the upper and lower outer surfaces of the honeycomb heat dissipation sheet 3 are provided with a flexible copper wire plate 4, and the outer surface of the flexible copper wire plate 4 is provided with a protective film layer 9, and the rigid bending resistant plate 1 Divided into several square bending resistant plates, buffer grooves 5 are arranged between the square bending resistant plates, and elastic connecting ribs 6 are arranged inside the buffer grooves 5.

[0033] Further, the rigid anti-bending plate 1 is provided with air bubble cavities 7 of different siz...

Embodiment 2

[0051] Rigid anti-bending plate 1 is composed of resin glue and organic fiber. The resin glue includes 25% polyimide, 15% polytetrafluoroethylene, 10% MDI modified bromine-free resin, 20% carbon fiber modified high elastic polyethylene, Modified graphene oxide 5%, acetone 20% and 4-methylimidazole 5%.

[0052] Organic fibers include 10% polyester fiber, 10% nylon fiber, 5% polyvinyl formal fiber, 10% polyparaphenylene terephthalamide fiber, 30% polyurethane elastic fiber, 10% polyamide fiber and Carbon fiber modified high elastic polyethylene fiber 25%.

[0053] The elastic connecting rib 6 is made of resin glue and mixed fibers, the resin glue of the elastic connecting rib 6 is the same as that of the rigid anti-bending plate 1, and the mixed fiber includes 15% of 3J9 (2Cr19Ni9Mo) alloy fiber, 30% of braided carbon fiber and modified carbon fiber High elastic polyethylene fiber 55%.

[0054] A method for preparing a high bending resistance circuit board for automobiles, the...

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Abstract

The invention provides a high-bending-resistance circuit board for an automobile and a preparation method of the high-bending-resistance circuit board. The circuit board comprises a rigid bending-resistance plate arranged in the middle, wherein flexible prepregs are attached to the upper and lower outer surfaces of the rigid bending-resistance plate, honeycomb heat dissipation thin plates are attached to the upper and lower outer surfaces of the flexible prepregs, flexible copper wire plates are arranged on the upper outer surface and the lower outer surface of the honeycomb heat dissipation thin plate, protective film layers are arranged on the outer surfaces of the flexible copper wire plates, the rigid bending-resistance plate is divided into a plurality of square bending-resistance plate blocks, buffer grooves are formed among the square bending-resistance plate blocks, and elastic connecting ribs are arranged in the buffer grooves. According to the high-bending-resistance circuit board for the automobile, the rigid bending-resistance resin with good elasticity is adopted to manufacture the substrate, and the buffer grooves and the elastic connecting ribs are arranged, so that the flexibility of the circuit board is remarkably improved, the elasticity, the flexibility and the bending resistance of the circuit board are changed, the service life of the circuit board is prolonged, the circuit board is resistant to bending by 180 degrees, and the circuit board is not broken after the total number of times is 100 thousand so as to improve the practicability and creativity of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board with high bending resistance for automobiles and a preparation method thereof. Background technique [0002] The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, soft and hard boards, ultra-thin circuit boards, printed circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] As electronic products are gradually required to be light, thin, short, and miniaturized, printed boards are developing towards high-precision, thin-line, and high-density SMT assembly machines to meet environmental protection requirements. Printed boards can be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/03H05K1/11H05K3/00H05K3/20H05K3/40
CPCH05K1/028H05K1/0281H05K1/0366H05K1/115H05K1/118H05K1/0201H05K3/0011H05K3/20H05K3/4038H05K2201/0133H05K2201/0323
Inventor 张华弟胡德忠郭世永秦衎陈崚嵘曾松李传明周启俊段景彬张齐冬
Owner GUANGDE XINSANLIAN ELECTRONICS CO LTD
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