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Method for manufacturing circuit board by using remelting solder as weldable protective layer

A circuit board method and solderability technology, which is used in the assembly of printed circuits with electrical components, printed circuits, and printed circuit manufacturing. easy effect

Pending Publication Date: 2021-07-02
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the implementation of the patented technology requires bare board manufacturers and board assemblers to adjust their existing business scopes, involving multiple changes in organization and benefit distribution, as well as a series of technical challenges in terms of time, space and The combination of sequence is difficult to be widely used in practice in the short term

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  • Method for manufacturing circuit board by using remelting solder as weldable protective layer
  • Method for manufacturing circuit board by using remelting solder as weldable protective layer
  • Method for manufacturing circuit board by using remelting solder as weldable protective layer

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Embodiment 1

[0058] In this embodiment, a circuit board with pure thermosetting ink printed on both sides and fully cured is taken as an example. The specific steps are as follows:

[0059] (1) While using laser to remove the solder resist on the welding area to create a solder resist pattern, perform solderability treatment on the welding area.

[0060] After etching and stripping the film, for the manufacture of solder resist patterns of general precision and high precision circuit boards, the existing technology uses photosensitive solder resist materials, which require pre-baking, exposure, development, curing and other processes to obtain solder resist patterns. This step applies laser photoetching processing, which can directly vaporize and remove the solder resist material on the surface of the copper foil in the welding area, so there is no need to use photosensitive solder resist, and no pre-baking, exposure, development and other processes are required. After the solder resist is...

Embodiment 2

[0084] In this embodiment, a circuit board with PI laminated on both sides instead of solder resist ink is taken as an example. The specific steps are as follows:

[0085] (1) While using laser to remove the solder resist on the welding area to create a solder resist pattern, perform solderability treatment on the welding area.

[0086] In this embodiment, the copper-clad substrate 1 is taken as an example, and the conductive circuit and the surface pad copper layer 2 have been laminated with PI as the solder resist 3, and then the solder resist 3 in the welding area is removed by laser to create a solder resist pattern. Solderability treatment is performed to expose a cleaned and solderability treated surface4. Such as Figure 1-4 shown.

[0087] Specifically, in this embodiment, the ultraviolet nanosecond laser machine U6 produced by Dezhong Technology Co., Ltd. is used to remove the PI in the welding area to make the solder resist pattern. The thickness of the PI layer is...

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Abstract

The invention provides a method for manufacturing a circuit board by using a remelting solder as a solderable protective layer, and the method comprises the following steps: after solderability treatment, adding the solder to a welding area according to a preset amount, and performing heating to remelt and spread the solder on the surface of the welding area to play a role of the solderable protective layer. The method has the advantages that the adding amount of the solder can be controlled by controlling the adding thickness, and solderability protection layers with the same or different thicknesses can be obtained on the same circuit board; the proportion of various substances in the weldability protection layer can be accurately controlled, different welding flux components are easily adopted, and different weldability and protection requirements are met; compared with a hot air leveling weldability protection layer coating technology, the thermal shock on the circuit board is small, and the thickness of the protection layer is uniform and controllable; compared with wet weldability protection metal technologies such as chemical plating and electroplating, liquid treatment is not needed in the whole process, worries about water absorption and damp of workpieces are avoided, quality control is easy, and environment friendliness is achieved. The method is suitable for mass production of various circuit boards, and is also suitable for small-batch and multi-variety production of circuit board samples.

Description

technical field [0001] The invention relates to a circuit board manufacturing process, in particular to a method for manufacturing a circuit board using remelted solder as a solderability protection layer. Background technique [0002] One of the important steps in the production of bare circuit boards is to apply a solderability protective layer to the non-solder resist-covered surface-soldering area after the solder mask pattern is prepared. The process of soldering components and circuit boards is largely affected by the quality of the solderable coating. Therefore, the type, process, and quality of the solderable coating have always been one of the key factors affecting the reliability of electronic products. [0003] When the component leads are brazed with the printed board, the quality of the solder joints formed is related to the wetting characteristics of the printed board surface by the molten solder, that is, solderability. In order to obtain good solderability, ...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/3494H05K3/3457
Inventor 胡宏宇于跃欣宋金月
Owner 德中(天津)技术发展股份有限公司
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