W-band millimeter wave chip multilayer dielectric substrate

Abstract

A W-band millimeter wave chip multilayer dielectric substrate comprises a first ground layer, a first dielectric layer, a second ground layer, a second dielectric layer, a control layer, a third dielectric layer, a power supply layer, a fourth dielectric layer, a third ground layer, a fifth dielectric layer, a radio frequency layer, a sixth dielectric layer, a fourth ground layer, a seventh dielectric layer and an antenna layer. The fourth ground layer is connected with the second end of the radio frequency layer through a vertical through hole; the first end of the radio frequency layer is connected with the third ground layer, the power supply layer, the control layer, the second ground layer and the first ground layer through vertical through holes; the radio frequency layer is of a multi-section microstrip line structure with different impedances. The structure of the metal layer is reasonably planned, the radio frequency layer is arranged between the two ground layers, and the shielding columns are arranged around the signal transmission structure, so that high-density wiring is carried out between the same layer or different layers while the anti-interference performance of radio frequency signals is guaranteed, and the dielectric substrate is suitable for the application scene of the antenna and chip integrated packaging interconnection structure. And the requirements of complex functions, high integration level and light weight at present are met.

Description

Technical field [0001] The present invention relates to impedance matching techniques, and more particularly to a W-band millimeter-chip multilayer dielectric substrate. Background technique [0002] In the modern, microwave, microwave wave, has become a very valuable resource due to its unique own characteristics. With the rapid development and application of microwave circuits and radio frequency circuits, microwave multilayer circuit tends to integrate and miniaturize. For efficient use of resources, there is a need to integrate more components and chips on the PCB board. Therefore, how the higher the integration of the microwave integrated circuit, the smaller the volume weight, the performance of the circuit system has become a new Research direction and hotspots. [0003] When designing a W-band multilayer dielectric substrate, it is necessary to consider the high-temperature and high humidity, dielectric transmission loss, dielectric characteristics, substrate layers, and ...

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Problems solved by technology

Zhu Datong and others (Zhu Datong. New development of substrate material technology for millimeter wave circuits (Part 1) [J]. Copper Clad Laminate Information, 2016 (05): 7-16.) disclosed a substrate multilayer structure, using carbon Hydrogen resin is used as the seventh layer of circuit traces, the sixth layer of microwave substrate and the fifth layer of ground plane or reference layer, epoxy resin is used as the fourth layer of FR-4 prepreg, the third layer of FR-4 laminate, the second layer FR-4 prepreg and the first layer of FR-4 laminate, the structure and material of the multilayer dielectric substrate are unbalanced, and the substrate is prone to mechanical warping and deformation, which makes the solder balls cause virtual soldering and desoldering due to structural stress

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