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Low-melting-point green flexible 3D packaging alloy

A low melting point, alloy technology, applied in metal processing equipment, welding media, welding/cutting media/materials, etc., can solve problems such as poor plasticity, high hardness and brittleness of alloy solder, and poor wettability

Inactive Publication Date: 2021-07-09
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the technical problems that existing alloy brazing filler metals have high hardness and brittleness, poor plasticity, and poor wettability, so that they cannot be applied in specific fields, thereby providing a low melting point Sn-Bi-Zn-In brazing filler metal and its preparation method

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  • Low-melting-point green flexible 3D packaging alloy
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specific Embodiment approach 1

[0019] DETAILED DESCRIPTION OF THE INVENTION The present embodiment is a low melting point Sn-In-Zn-BI solder comprising 88 parts of Sn, 10-x, 2 parts Zn, X-based BI, which is comprising, 88 parts by Sn, 10-X, 2 parts Zn, X-based BI, which The expression was 88SN- (10-x) in-2ZN-XBI, where 1 ≤ x ≤ 5.

specific Embodiment approach 2

[0020] DETAILED DESCRIPTION OF THE INVENTION 2: The present embodiment has a method of preparing a low melting point Sn-in-Zn-BI solder, which is carried out according to the following procedure:

[0021] I. In accordance with the expression of 88SN- (10-x) in-2Zn-Xbi, the purity of the IN block, the Sn block, and the Zn block is 99.95%.

[0022] 2. The metal block obtained by step is placed in the graphite crucible, and the high-frequency induction furnace is heated to 490 to 510 ° C under the protection of reduction rosin, and the melt is obtained.

[0023] 3. The melt obtained by step two is placed in a high frequency induction melting furnace for smelting, while stirring, and controlling the melting temperature of 190 to 210 ° C, holding 35 to 45 min, and obtains a solder liquid.

[0024] IV. The solder solution obtained by step three is solidified under room temperature into the alloy belt 50 mm × 5 mm × 0.2 mM to obtain the one low melting Sn-In-Zn-Bi alloy solder.

specific Embodiment approach 3

[0025] BEST MODE FOR CARRYING OUT THE INVENTION The third or third embodiment of the present embodiment is that the weight ratio of Sn, IN, Zn, and Bi weighing in step one is 88: 9: 2: 1. Others are the same as those of the specific implementation of the second or third.

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Abstract

The invention discloses low-melting-point green flexible brazing filler metal and a preparation method thereof, and relates to low-melting-point brazing filler metal and a preparation method thereof. The 3D packaging alloy aims to solve the technical problem that the existing alloy brazing filler metal cannot be applied to the fields of 3D packaging and flexible packaging due to the problems of high hard brittleness, poor plasticity, poor wettability and the like. The Sn-In-Zn-Bi alloy brazing filler metal is prepared from Sn, In, Zn and Bi, and the content of Bi in the alloy brazing filler metal is 1%-5%. The method comprises the following steps of 1, weighing a pure tin block, a pure indium block, a pure zinc block and a pure bismuth block; 2, heating and melting to obtain molten liquid; 3, smelting and stirring the molten liquid to obtain the brazing filler metal liquid. and 4, solidifying and rolling. The lowest melting point of the prepared alloy brazing filler metal is 162.5 DEG C, the wetting angle ranges from 23 degrees to 29 degrees, the tensile strength ranges from 42 MPa to 58 MPa, and the alloy brazing filler metal is free of toxicity and environmentally friendly; and according to the method, the low-melting-point green flexible brazing filler metal can be obtained.

Description

Technical field [0001] The present invention relates to alloy solder and its performance research Background technique [0002] At present, aviation, aerospace, computer, automotive and communications are increasingly high-performance systems, forcing electronic packaging design to develop toward higher power, current density and reliability. 3D packaging technology and flexible devices have gradually become one of the main directions of the electronics industry. A series of problems such as aging, thermoelectric mobility, stress injury, etc. are increasingly prominent. How to solve this series of issues is one of the challenges faced by 3D packages and flexible packages. At this stage, we mainly packaged in organic connection materials and alloying solders. The main ingredient is the most commonly used organic connection material, which can reduce the advantages such as stress injury in the field of flexible encapsulation due to its good ductility. However, the conductive glue i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 王敬泽常晶尹佳庆翁冠军孙云龙
Owner HARBIN UNIV OF SCI & TECH