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Electromagnetic shielding cover film and preparation method thereof

A technology of electromagnetic shielding and covering film, applied in the fields of magnetic field/electric field shielding, chemical instruments and methods, electrical components, etc. The effect of simplification, increased reliability, and fewer control points

Pending Publication Date: 2021-07-16
广州宏庆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cover film is directly plated on the insulating base film or on the barrier layer, and the bonding force between the coating layer and the plated substrate is low.
Moreover, all of the above-mentioned patents use ready-made insulating base films (i.e. polyimide films), and do not mention the use of coating methods to manufacture insulating base films.

Method used

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  • Electromagnetic shielding cover film and preparation method thereof
  • Electromagnetic shielding cover film and preparation method thereof
  • Electromagnetic shielding cover film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0117] Such as figure 1 As shown, the electromagnetic shielding cover film of the present invention includes a protective film layer 1 , an adhesive layer 2 , a metal layer 3 , an adhesive layer 4 and a PI film layer 5 stacked together in sequence from bottom to top. The order of the stacked layers of the electromagnetic shielding cover film can also be from top to bottom, and stacked one by one.

[0118] The PI film layer 5 is a biaxially stretched polyimide film with a thickness of 50 μm and a width of 600 mm; or coated with a solution of soluble polyimide and its modified products, with a thickness of 5-10 μm;

[0119] The adhesive layer is a film layer made of adhesive layer slurry coated on the surface of the PI film layer, with a thickness of 5-15 μm (preferably 5-12 μm, more preferably 6 μm).

[0120] The next layer of slurry includes epoxy resin, inorganic filler, curing agent, solvent, wherein: epoxy resin is epoxy resin with high temperature resistance, choose epox...

Embodiment 1A

[0139] Embodiment 1A prepares electromagnetic shielding covering film

[0140] Such as figure 1 As shown, the electromagnetic shielding cover film to be tested in the present invention includes a protective film 1, an adhesive layer 2, a metal layer 3, an adhesive layer 4, and a PI film layer sequentially from bottom to top.

[0141] 1. Superimpose the next layer

[0142] 1-1) Mix the raw materials with the following weight ratio, disperse them evenly, and prepare the adhesive layer slurry.

[0143]

[0144]

[0145] Wherein resin selects epoxy resin E44; Filler is barium sulfate; Described curing agent is phenolic curing agent (CAS:9003-35-4); Described organic solvent is butanone;

[0146] In addition to epoxy resin E44, other high-temperature resistant epoxy resins (such as epoxy resin E20, special epoxy resin phenoxy resin 1256), acrylic resins (such as 4401, 4000, etc.) ), polyurethane (such as: Henkel: LOCTITE-LIOFOL-LA-2726), silica gel (such as: Xibang: CILBO...

Embodiment 1B

[0194] Embodiment 1B prepares electromagnetic shielding covering film

[0195] 1. Superimpose the next layer

[0196] 1-1) Prepare adhesive paste

[0197] Mix the silane coupling agent with the solvent and stir evenly to make a slurry for the next layer, wherein the mass ratio of the silane coupling agent to the solvent is 2:100 (usually (0.1-3):100); the silane coupling agent Choose silane coupling agents A151, A171, KH550, KH650, etc.; choose water, alcohols (ethanol, etc.), ketones (acetone, butanone, etc.) as solvents.

[0198] The silane coupling agent can also be replaced by a titanate coupling agent (such as CAS: 61417-49-0, 65467-75-6), an electrodeless metal chelating agent, or an organometallic chelating agent.

[0199] In this embodiment, the silane coupling agent KH550 is selected as the silane coupling agent, and butanone is selected as the solvent.

[0200] 1-2) Coating adhesive layer slurry

[0201] The prepared adhesive layer slurry is coated with an adhesi...

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Abstract

The invention discloses an electromagnetic shielding cover film and a preparation method thereof, and belongs to the field of electronic materials. The electromagnetic shielding cover film comprises a PI film layer, a bonding layer, a metal layer, an adhesion layer and a protective film layer or a carrier film layer, a release layer, a PI film layer, a bonding layer, a metal layer, an adhesion layer and a protective film layer which are sequentially laminated together. According to the invention, the preparation process of the cover film is simple, the process control is easy, the stability and reliability of the product are improved, the production process is simplified, and the risk of aging failure of the circuit board adhesive layer is reduced; and according to the electromagnetic shielding cover film, an existing electromagnetic (shielding) film and an existing cover film are integrated for the first time, the electromagnetic shielding cover film has the shielding function and the circuit protection function, the manufacturing process of a circuit board is optimized, the circuit board product is ultrathin, and the production cost is reduced.

Description

technical field [0001] The invention relates to a film and a preparation method thereof, in particular to an electromagnetically compatible shielding cover film used for communication, photoelectric display, FPC (flexible circuit board) and the preparation method thereof, belonging to circuit board production, electromagnetic wave shielding film, Covering film, flexible copper clad laminate (Flexible Copper Clad Laminate, FCCL), electronic functional film, communication technology field. Background technique [0002] With the rapid development of communication and optoelectronic display industries, the demand for new materials is also increasing. The development of special films is relatively backward in China. In particular, most high-end materials of various laminated functional films are monopolized by foreign companies such as the United States and Japan. Products are highly dependent, how to break the monopoly of foreign companies has become the level of national strate...

Claims

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Application Information

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IPC IPC(8): H05K9/00B32B27/28B32B27/08B32B33/00B32B7/12B32B7/06C09D163/00C09D7/61C09J163/00C09J11/04
CPCH05K9/0084B32B27/281B32B27/08B32B33/00B32B7/12B32B7/06C09D163/00C09D7/61C09J163/00C09J11/04B32B2255/10B32B2255/205B32B2307/212B32B2250/24C08K2003/3045C08K3/30
Inventor 郑永德
Owner 广州宏庆电子有限公司